TWI414220B - Flexible printed circuit - Google Patents

Flexible printed circuit Download PDF

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Publication number
TWI414220B
TWI414220B TW100124809A TW100124809A TWI414220B TW I414220 B TWI414220 B TW I414220B TW 100124809 A TW100124809 A TW 100124809A TW 100124809 A TW100124809 A TW 100124809A TW I414220 B TWI414220 B TW I414220B
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Taiwan
Prior art keywords
circuit board
flexible circuit
gold
main body
protective layer
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TW100124809A
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Chinese (zh)
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TW201304631A (en
Inventor
Wen Chi Lin
Yu Sheng Lin
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Hannstar Display Corp
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Application filed by Hannstar Display Corp filed Critical Hannstar Display Corp
Priority to TW100124809A priority Critical patent/TWI414220B/en
Priority to CN201110251260.2A priority patent/CN102883520B/en
Publication of TW201304631A publication Critical patent/TW201304631A/en
Application granted granted Critical
Publication of TWI414220B publication Critical patent/TWI414220B/en

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Abstract

The invention discloses a flexible printed circuit board, comprising a body, a plurality of golden fingers and at least one protection layer. The plurality of golden fingers are located on insertion and pull parts and insertion and pull protection parts on the body respectively and the protection layer covers the insertion and pull protection parts. With the protection layer covering the insertion and pull protection parts, the flexible printed circuit board prevents stripping of material and solves the problem of poor current conduction after many times of insert and pull.

Description

軟性電路板 Flexible circuit board

本發明是有關於一種軟性電路板,尤指一種以保護層覆蓋插拔保護部,不易發生材料剝落之情形之軟性電路板。 The invention relates to a flexible circuit board, in particular to a flexible circuit board which covers the plug protection part with a protective layer and is less prone to material peeling.

印刷電路板係以印刷技術製作之電路產品。早期係將金屬熔融於絕緣板表面,以製造出所需之線路。1930年代末期,製作方法趨向將不需之區域以蝕刻之方式去除。而至1960年代以後,環氧樹脂基板被大量使用,成為電路板製作之主要樹脂基材。電路板之應用範圍廣泛,在人們日常生活所見之電腦、行動電話、電動玩具、印表機等等消費產品中,電路板皆為其不可或缺之重要元件。 Printed circuit boards are circuit products made by printing technology. In the early days, the metal was melted on the surface of the insulating plate to make the desired wiring. In the late 1930s, the fabrication method tended to remove unwanted areas by etching. After the 1960s, epoxy resin substrates were used in large quantities, becoming the main resin substrate for circuit board fabrication. Circuit boards are used in a wide range of applications. Circuit boards are an indispensable component in consumer products such as computers, mobile phones, electric toys, and printers that people see in their daily lives.

而軟性電路板具備了柔軟可饒曲之特性,因此擁有相當之技術優勢。特別係表現在立體空間之線路設計方面,軟性電路板提供了設計層面上更寬廣之變化性及彈性。請參閱第1圖所示,其係繪示現有之軟性電路板之示意圖。現有軟性電路板1之表面佈設有併排設置之金手指11。金手指11之功用係讓頂針固定接觸,藉以導通電流。 The flexible circuit board has the characteristics of softness and flexibility, so it has considerable technical advantages. In particular, the performance of the circuit design in the three-dimensional space, the flexible circuit board provides a wider range of variability and flexibility at the design level. Please refer to FIG. 1 , which is a schematic diagram showing an existing flexible circuit board. The surface of the existing flexible circuit board 1 is provided with gold fingers 11 arranged side by side. The function of the gold finger 11 is to make the thimble fixedly contact, thereby conducting current.

請再參閱第2圖所示,其係繪示現有之軟性電路板之金手指之材料剝落示意圖。然而,現有之軟性電路板1之金手指11,其插拔端在軟性電路板1多次插拔後,常發生材料剝落之情形(如圖中箭頭所指處),造成了電流導通不良等諸多缺失,前述實為目前仍待解決之技術課題。 Please refer to FIG. 2 again, which is a schematic diagram showing the material peeling of the gold finger of the existing flexible circuit board. However, in the existing gold finger 11 of the flexible circuit board 1, after the plug-in end of the flexible circuit board 1 is repeatedly inserted and removed, the material peeling often occurs (as indicated by the arrow in the figure), causing poor current conduction, etc. Many of these are missing, and the above is a technical issue that remains to be solved.

有鑑於習知技術之各項問題,本發明人基於多年研究開發與諸多實務經驗,提出一種軟性電路板,以作為改善上述缺點之實現方式與依據。 In view of the problems of the prior art, the inventors have proposed a flexible circuit board based on years of research and development and many practical experiences, as an implementation and basis for improving the above disadvantages.

依據本發明之上述目的,本發明提供一軟性電路板,包括一主體、複數個金手指以及一保護層,該主體定義有一插拔部及一插拔保護部,各該金手指係間隔地設置於該主體,各該金手指係位於該主體之插拔部及插拔保護部,該保護層覆蓋該些插拔保護部。各該金手指之材質係為銅箔或金。該保護層之材質係為聚亞醯胺樹脂或聚苯乙烯。各該插拔部係具有一第一寬度,而各該金手指係具有一第二寬度,且該第二寬度係等於或大於該第一寬度。該保護層具有一橫邊,該橫邊與該主體之該前緣係為平行或不平行。 According to the above object of the present invention, a flexible circuit board includes a main body, a plurality of gold fingers, and a protective layer. The main body defines an insertion portion and a plug protection portion, and each of the gold fingers is spaced apart. In the main body, each of the gold fingers is located at the insertion portion and the insertion protection portion of the main body, and the protection layer covers the insertion protection portions. The material of each of the gold fingers is copper foil or gold. The material of the protective layer is polyamidamide resin or polystyrene. Each of the plugging portions has a first width, and each of the gold finger portions has a second width, and the second width is equal to or greater than the first width. The protective layer has a lateral edge that is parallel or non-parallel to the leading edge of the body.

依據本發明之上述目的,本發明提供一軟性電路板,包括一主體、複數個金手指以及複數個保護層,該主體定義有一插拔部及一插拔保護部,各該金手指係間隔地設置於該主體,各該金手指係位於該主體之插拔部及插拔保護部,該些保護層覆蓋該些插拔保護部。各該金手指之材質係為銅箔或金。該些保護層之材質係為聚亞醯胺樹脂或聚苯乙烯。各該插拔部係具有一第一寬度,而各該金手指係具有一第二寬度,且該第二寬度係等於或大於該第一寬度。該保護層具有一橫邊,該橫邊與該主體之該前緣係為平行或不平行。 According to the above object of the present invention, a flexible circuit board includes a main body, a plurality of gold fingers, and a plurality of protective layers. The main body defines an insertion portion and a plug protection portion, and each of the gold fingers is spaced apart. The gold finger is disposed on the main body, and the insertion and removal protection portion covers the insertion protection protection portion. The material of each of the gold fingers is copper foil or gold. The material of the protective layer is polyamidene resin or polystyrene. Each of the plugging portions has a first width, and each of the gold finger portions has a second width, and the second width is equal to or greater than the first width. The protective layer has a lateral edge that is parallel or non-parallel to the leading edge of the body.

承上所述,依本發明之軟性電路板,其可具有一或多個下述優點: In view of the above, a flexible circuit board according to the present invention may have one or more of the following advantages:

(1)此軟性電路板可藉由以保護層覆蓋插拔保護部,藉此可改善材料剝落之情形。 (1) The flexible circuit board can improve the peeling of the material by covering the insertion and removal protection portion with a protective layer.

(2)此軟性電路板可藉由以保護層覆蓋插拔保護部,藉此可解決電流導通不良的問題。 (2) The flexible circuit board can solve the problem of poor current conduction by covering the plug protection portion with a protective layer.

茲為使貴審查委員對本發明之技術特徵及所達到之功效有更進一步之瞭解與認識,謹佐以較佳之實施例及配合詳細之說明如後。 For a better understanding and understanding of the technical features and the efficacies of the present invention, the preferred embodiments and the detailed description are as follows.

1‧‧‧軟性電路板 1‧‧‧Soft circuit board

11‧‧‧金手指 11‧‧‧Gold Fingers

2‧‧‧主體 2‧‧‧ Subject

21‧‧‧金手指 21‧‧‧Gold Fingers

211‧‧‧插拔部 211‧‧‧plugging department

212‧‧‧插拔保護部 212‧‧‧Plug and Protection Department

22‧‧‧保護層 22‧‧‧Protective layer

221‧‧‧橫邊 221‧‧‧ transverse side

23‧‧‧前緣 23‧‧‧ Leading edge

A‧‧‧第一寬度 A‧‧‧first width

B‧‧‧第二寬度 B‧‧‧second width

X-X‧‧‧剖面線 X-X‧‧‧ hatching

第1圖係為現有之軟性電路板之示意圖;第2圖係為現有之軟性電路板之金手指之材料剝落示意圖; 第3圖係為本發明之軟性電路板之第一較佳實施例之俯視示意圖;第4圖係為本發明之軟性電路板之第一較佳實施例之側視剖面圖;第5圖係為本發明之軟性電路板之第二較佳實施例之俯視示意圖;第6圖係為本發明之軟性電路板之第三較佳實施例之俯視示意圖;第7圖係為本發明之軟性電路板之第四較佳實施例之俯視示意圖;以及第8圖係為本發明之軟性電路板之第五較佳實施例之俯視示意圖。 1 is a schematic diagram of a conventional flexible circuit board; and FIG. 2 is a schematic diagram of material peeling of a gold finger of a conventional flexible circuit board; 3 is a top plan view of a first preferred embodiment of a flexible circuit board of the present invention; and FIG. 4 is a side cross-sectional view of a first preferred embodiment of the flexible circuit board of the present invention; A top view of a second preferred embodiment of the flexible circuit board of the present invention; FIG. 6 is a top plan view of a third preferred embodiment of the flexible circuit board of the present invention; and FIG. 7 is a flexible circuit of the present invention. A top view of a fourth preferred embodiment of the board; and FIG. 8 is a top plan view of a fifth preferred embodiment of the flexible circuit board of the present invention.

以下將參照相關圖式,說明本發明軟性電路板之較佳實施例,為使便於理解,下述實施例中之相同元件係以相同之符號標示來說明。 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following, the preferred embodiments of the present invention will be described with reference to the accompanying drawings.

首先,請一併參閱第3圖及第4圖所示,其係分別繪示本發明之軟性電路板之第一較佳實施例之俯視示意圖及側視剖面圖。第4圖係繪示沿著第3圖中之X-X剖面線之剖視圖。本發明之軟性電路板之第一較佳實施例係包括一主體2、複數個金手指21以及一保護層22。該些金手指21係間隔地設置於該主體2之至少一表面上。該主體2之該表面上定義有插拔部211及插拔保護部212,該主體2更至少包括一基板(圖中未示),該基板之材質係例如為聚酯樹脂或聚亞醯胺樹脂。各該金手指21之材質係為金屬,例如為銅箔或金。各該金手指21係位於主體2之插拔部211及插拔保護部212,該插拔保護部212位於靠近該主體2之一前緣23處,各該插拔保護部212具有一第一寬度A。而各該金手指21具有一第二寬度B,且該第二寬度B係等於該第一寬度A。該保護層22係覆蓋該些插拔保護部212。該保護層22具有一橫邊221,該橫邊221與該主體2之該前緣23係為平行。該保護層22之材質係例如為聚亞醯胺樹脂或聚苯乙烯。 First, please refer to FIG. 3 and FIG. 4 together, which are respectively a top view and a side cross-sectional view of a first preferred embodiment of the flexible circuit board of the present invention. Fig. 4 is a cross-sectional view taken along line X-X of Fig. 3. A first preferred embodiment of the flexible circuit board of the present invention includes a body 2, a plurality of gold fingers 21, and a protective layer 22. The gold fingers 21 are spaced apart from each other on at least one surface of the body 2. The surface of the main body 2 defines an insertion portion 211 and a plug protection portion 212. The main body 2 further includes at least one substrate (not shown), and the material of the substrate is, for example, a polyester resin or a polyamidamide. Resin. The material of each of the gold fingers 21 is made of metal, such as copper foil or gold. Each of the gold finger 21 is located at the insertion portion 211 of the main body 2 and the insertion and removal protection portion 212. The insertion protection portion 212 is located near a front edge 23 of the main body 2, and each of the insertion protection portions 212 has a first Width A. Each of the gold fingers 21 has a second width B, and the second width B is equal to the first width A. The protective layer 22 covers the plug protection portions 212. The protective layer 22 has a lateral edge 221 that is parallel to the leading edge 23 of the body 2. The material of the protective layer 22 is, for example, a polyimide resin or polystyrene.

請再參閱第5圖所示,其係繪示本發明之軟性電路板之第二較佳實施例之俯視示意圖。本發明之軟性電路板之第二較佳實施例係包括一主體2、複數個金手指21以及一保護層22。各該金手指21係間隔地設置於該主體2之至少一表面上,該主體2該表 面上定義有一插拔部211及一插拔保護部212。各該金手指21係位於主體2之插拔部211及插拔保護部212,該插拔保護部212位於靠近該主體2之一前緣23處。該保護層22係覆蓋該些插拔保護部212。與前述第一較佳實施例之不同處在於,該第二寬度B係大於該第一寬度A。 Please refer to FIG. 5 again, which is a top plan view showing a second preferred embodiment of the flexible circuit board of the present invention. A second preferred embodiment of the flexible circuit board of the present invention includes a body 2, a plurality of gold fingers 21, and a protective layer 22. Each of the gold fingers 21 is disposed at least on a surface of the main body 2 at intervals An insertion portion 211 and a plug protection portion 212 are defined on the surface. Each of the gold fingers 21 is located at the insertion and extraction portion 211 of the main body 2 and the insertion and removal protection portion 212 . The insertion and removal protection portion 212 is located near the front edge 23 of the main body 2 . The protective layer 22 covers the plug protection portions 212. The difference from the foregoing first preferred embodiment is that the second width B is greater than the first width A.

請再一併參閱第6圖所示,其係繪示本發明之軟性電路板之第三較佳實施例之俯視示意圖。本發明之軟性電路板之第三較佳實施例係包括一主體2、複數個金手指21以及一保護層22。該些金手指21係間隔地設置於該主體2之至少一表面上,該主體2之至少一表面上定義有一插拔部211及一插拔保護部212。各該金手指21係位於該主體2之該插拔部211及該插拔保護部212,該插拔保護部212位於靠近該主體2之一前緣23處。該保護層22係覆蓋該些插拔保護部212,該保護層22具有一橫邊221。與前述第一較佳實施例之不同處在於,該橫邊221與該主體2之該前緣23係為不平行。 Please refer to FIG. 6 again, which is a schematic top view of a third preferred embodiment of the flexible circuit board of the present invention. A third preferred embodiment of the flexible circuit board of the present invention includes a body 2, a plurality of gold fingers 21, and a protective layer 22. The gold fingers 21 are spaced apart from each other on at least one surface of the main body 2, and at least one surface of the main body 2 defines an insertion portion 211 and a plug protection portion 212. Each of the gold fingers 21 is located at the insertion portion 211 of the main body 2 and the insertion protection portion 212 . The insertion protection portion 212 is located near a front edge 23 of the main body 2 . The protective layer 22 covers the plug protection portions 212 , and the protective layer 22 has a lateral edge 221 . The difference from the foregoing first preferred embodiment is that the lateral edge 221 and the leading edge 23 of the body 2 are not parallel.

請再一併參閱第7圖所示,其係繪示本發明之軟性電路板之第四較佳實施例之俯視示意圖。本發明之軟性電路板之第四較佳實施例係包括一主體2、複數個金手指21以及複數個保護層22。該些金手指21係間隔地設置於該主體2之至少一表面上,該主體2之至少一表面上定義有一插拔部211及一插拔保護部212。各該金手指21位於該主體2之該插拔部211及該插拔保護部212,該插拔保護部212位於靠近該主體2之一前緣23處。與前述第一較佳實施例之不同處在於,各該保護層23係分別覆蓋該些插拔保護部212以及該些金手指21之相異於該些插拔保護部212處。各該保護層22具有一橫邊221。各該橫邊221與該主體之該前緣23係為平行。 Referring to FIG. 7, a schematic top view of a fourth preferred embodiment of the flexible circuit board of the present invention is shown. A fourth preferred embodiment of the flexible circuit board of the present invention includes a body 2, a plurality of gold fingers 21, and a plurality of protective layers 22. The gold fingers 21 are spaced apart from each other on at least one surface of the main body 2, and at least one surface of the main body 2 defines an insertion portion 211 and a plug protection portion 212. Each of the gold fingers 21 is located at the insertion portion 211 of the main body 2 and the insertion protection portion 212 . The insertion protection portion 212 is located near a front edge 23 of the main body 2 . The difference from the first preferred embodiment is that each of the protective layers 23 covers the plug protection portions 212 and the gold fingers 21 are different from the plug protection portions 212. Each of the protective layers 22 has a lateral side 221. Each of the lateral sides 221 is parallel to the leading edge 23 of the body.

請再一併參閱第8圖所示,其係繪示本發明之軟性電路板之第五較佳實施例之俯視示意圖。本發明之軟性電路板之第五較佳實施例係包括一主體2、複數個金手指21以及複數個保護層22。該些金手指21係間隔地設置於該主體2之至少一表面上,該主體2之至少一表面上定義有一插拔部211及一插拔保護部212。各該金手指21位於該主體2之該插拔部211及該插拔保護部212,該插拔保護部212位於靠近該主體2之 一前緣23處。各該保護層22係分別覆蓋該些插拔保護部212及該些金手指21之相異於該些插拔保護部212處。各該保護層22具有一橫邊221。與前述第四較佳實施例之不同處在於,各該橫邊221與該主體2之該前緣23係為不平行。 Please refer to FIG. 8 again, which is a schematic top view of a fifth preferred embodiment of the flexible circuit board of the present invention. A fifth preferred embodiment of the flexible circuit board of the present invention includes a body 2, a plurality of gold fingers 21, and a plurality of protective layers 22. The gold fingers 21 are spaced apart from each other on at least one surface of the main body 2, and at least one surface of the main body 2 defines an insertion portion 211 and a plug protection portion 212. Each of the gold fingers 21 is located at the insertion and removal portion 211 of the main body 2 and the insertion and removal protection portion 212 . The insertion and removal protection portion 212 is located adjacent to the main body 2 . A leading edge 23 points. Each of the protective layers 22 covers the plug protection portions 212 and the gold fingers 21 different from the plug protection portions 212. Each of the protective layers 22 has a lateral side 221. The difference from the foregoing fourth preferred embodiment is that each of the lateral sides 221 and the leading edge 23 of the main body 2 are not parallel.

在前述本發明之軟性電路板之第三較佳實施例、第四較佳實施例以及第五較佳實施例中,該第二寬度B係等於或大於該第一寬度A。 In the third preferred embodiment, the fourth preferred embodiment, and the fifth preferred embodiment of the foregoing flexible circuit board of the present invention, the second width B is equal to or greater than the first width A.

需特別說明,本發明之軟性電路板之第二至第五較佳實施例中,各該金手指21之材質係為金屬,例如為銅箔或金。且該保護層之材質係例如為聚亞醯胺樹脂或聚苯乙烯。 It should be noted that in the second to fifth preferred embodiments of the flexible circuit board of the present invention, the material of each of the gold fingers 21 is metal, such as copper foil or gold. And the material of the protective layer is, for example, polyamidamide resin or polystyrene.

需再特別說明,本發明之軟性電路板之第一至第五較佳實施例中,該主體2至少包括一基板及一黏合層,由於主體2之構造並非本發明之要點所在,且其為熟知本發明之技術領域之相關人員能夠輕易了解,故於此不再贅述。 It should be further noted that in the first to fifth preferred embodiments of the flexible circuit board of the present invention, the main body 2 includes at least a substrate and an adhesive layer. Since the structure of the main body 2 is not the main point of the present invention, Those skilled in the art who are familiar with the present invention can easily understand it, and thus will not be described again.

需又特別說明,本發明之軟性電路板之第一至第五較佳實施例係舉單面具有金手指21之軟性電路板為例,但本發明之軟性電路板亦可為雙面具有金手指21之軟性電路板,僅為舉例但不為所限。 It should be particularly noted that the first to fifth preferred embodiments of the flexible circuit board of the present invention are exemplified by a flexible circuit board having a gold finger 21 on one side, but the flexible circuit board of the present invention may also have gold on both sides. The flexible circuit board of the finger 21 is merely an example but not limited.

需再特別說明,前述金手指21之厚薄需視設計上之需求而定,由於並非本發明之要點所在,故於此亦不再贅述。 It should be further noted that the thickness of the aforementioned gold finger 21 is determined by the design requirements, and since it is not the gist of the present invention, it will not be repeated here.

需又特別說明,本發明之軟性電路板更可搭配組設例如補強板或遮光片等零件,由於並非本發明之要點所在,故於此亦不再贅述。 It should be noted that the flexible circuit board of the present invention can be further equipped with components such as a reinforcing plate or a light shielding plate. Since it is not the gist of the present invention, it will not be described herein.

綜上所述,本發明之軟性電路板至少具有下述之優點:本發明以該保護層22覆蓋該些插拔保護部212,因此本發明之軟性電路板多次插拔後,不易發生材料剝落之情形,改善了電流導通不良等諸多缺失。 In summary, the flexible circuit board of the present invention has at least the following advantages: the present invention covers the plug protection portions 212 with the protective layer 22, so that the flexible circuit board of the present invention is difficult to generate materials after being inserted and removed multiple times. The situation of peeling off has improved many defects such as poor current conduction.

以上所述僅為舉例性,而非為限制性者。任何未脫離本發明之精神與範疇,而對 其進行之等效修改或變更,均應包含於後附之申請專利範圍中。 The above is intended to be illustrative only and not limiting. Any departure from the spirit and scope of the present invention Equivalent modifications or changes made by them shall be included in the scope of the appended patent application.

2‧‧‧主體 2‧‧‧ Subject

21‧‧‧金手指 21‧‧‧Gold Fingers

211‧‧‧插拔部 211‧‧‧plugging department

212‧‧‧插拔保護部 212‧‧‧Plug and Protection Department

22‧‧‧保護層 22‧‧‧Protective layer

221‧‧‧橫邊 221‧‧‧ transverse side

23‧‧‧前緣 23‧‧‧ Leading edge

A‧‧‧第一寬度 A‧‧‧first width

B‧‧‧第二寬度 B‧‧‧second width

X-X‧‧‧剖面線 X-X‧‧‧ hatching

Claims (12)

一種軟性電路板,係包括:一主體,該主體定義有一插拔部及一插拔保護部;複數個金手指,該些金手指之材質係為金屬,各該金手指係間隔地設置於該主體之至少一表面上,且各該金手指係位於該主體之該插拔部及該插拔保護部,該插拔保護部位於靠近該主體之一前緣處;以及一保護層,位於靠近該主體之該前緣處且覆蓋該些插拔保護部。 A flexible circuit board includes: a main body defining an insertion portion and a plug protection portion; a plurality of gold fingers, wherein the gold fingers are made of metal, and each of the gold fingers is spaced apart from the At least one surface of the main body, and each of the gold fingers is located at the insertion portion of the main body and the insertion protection portion, the insertion protection portion is located near a front edge of the main body; and a protective layer is located close to The leading edge of the body covers and covers the plug protection portions. 如申請專利範圍第1項所述之軟性電路板,其中各該金手指之材質係為銅箔或金。 The flexible circuit board of claim 1, wherein the material of the gold finger is copper foil or gold. 如申請專利範圍第1項所述之軟性電路板,其中該保護層之材質係為聚亞醯胺樹脂或聚苯乙烯。 The flexible circuit board of claim 1, wherein the protective layer is made of polyamido resin or polystyrene. 如申請專利範圍第1項所述之軟性電路板,其中各該插拔部係具有一第一寬度,而各該金手指係具有一第二寬度,且該第二寬度係等於或大於該第一寬度。 The flexible circuit board of claim 1, wherein each of the plugging portions has a first width, and each of the gold finger systems has a second width, and the second width is equal to or greater than the first a width. 如申請專利範圍第1項所述之軟性電路板,其中該保護層具有一橫邊,該橫邊與該主體之該前緣係為平行。 The flexible circuit board of claim 1, wherein the protective layer has a lateral edge that is parallel to the leading edge of the body. 如申請專利範圍第1項所述之軟性電路板,其中該保護層具有一橫邊,該橫邊與該主體之該前緣係為不平行。 The flexible circuit board of claim 1, wherein the protective layer has a lateral edge that is non-parallel to the leading edge of the body. 一種軟性電路板,係包括:一主體,該主體定義有一插拔部及一插拔保護部;複數個金手指,該些金手指之材質係為金屬,各該金手指係間隔地設置於該主體之至少一表面上,且各該金手指係位於該主體之該插拔部及該插拔保護部,該插拔保護部位於靠近該主體之一前緣處;以及複數個保護層,各該保護層係分別覆蓋該些插拔保護部以及覆蓋該些金手指之部份表面且露出該些金手指之另一部份表面。 A flexible circuit board includes: a main body defining an insertion portion and a plug protection portion; a plurality of gold fingers, wherein the gold fingers are made of metal, and each of the gold fingers is spaced apart from the At least one surface of the main body, and each of the gold finger is located at the insertion portion of the main body and the insertion protection portion, the insertion protection portion is located near a front edge of the main body; and a plurality of protective layers, each The protective layer covers the plug protection portions and the surface of the portion covering the gold fingers and exposes the surface of the other portion of the gold fingers. 如申請專利範圍第7項所述之軟性電路板,其中各該金手指之材質係為銅箔或金。 The flexible circuit board of claim 7, wherein the material of the gold finger is copper foil or gold. 如申請專利範圍第7項所述之軟性電路板,其中該些保護層之材質係為聚亞醯胺樹脂或聚苯乙烯。 The flexible circuit board of claim 7, wherein the protective layer is made of polyamido resin or polystyrene. 如申請專利範圍第7項所述之軟性電路板,其中各該插拔部具有一第一寬度,而各該金手指具有一第二寬度,且該第二寬度係等於或大於該第一寬度。 The flexible circuit board of claim 7, wherein each of the insertion portions has a first width, and each of the gold fingers has a second width, and the second width is equal to or greater than the first width. . 如申請專利範圍第7項所述之軟性電路板,其中該保護層具有一橫邊,該橫邊與該主體之該前緣係為平行。 The flexible circuit board of claim 7, wherein the protective layer has a lateral edge that is parallel to the leading edge of the body. 如申請專利範圍第7項所述之軟性電路板,其中該保護層具有一橫邊,該橫邊與該主體之該前緣係為不平行。 The flexible circuit board of claim 7, wherein the protective layer has a lateral edge that is non-parallel to the leading edge of the body.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104918420A (en) * 2014-03-11 2015-09-16 深南电路有限公司 Processing method of gold finger, and circuit board structure with gold finger

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200906235A (en) * 2007-07-20 2009-02-01 Foxconn Advanced Tech Inc Flexible printed circuit board
TW200952584A (en) * 2008-06-10 2009-12-16 Compeq Mfg Co Ltd Rigid-flexible printed circuit board with peelable mask and method of making

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2669240Y (en) * 2003-12-09 2005-01-05 陈荣村 Protection device for heat running-channel temp. controller
CN101854773B (en) * 2009-03-30 2013-02-13 鸿富锦精密工业(深圳)有限公司 Gold finger protecting device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200906235A (en) * 2007-07-20 2009-02-01 Foxconn Advanced Tech Inc Flexible printed circuit board
TW200952584A (en) * 2008-06-10 2009-12-16 Compeq Mfg Co Ltd Rigid-flexible printed circuit board with peelable mask and method of making

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104918420A (en) * 2014-03-11 2015-09-16 深南电路有限公司 Processing method of gold finger, and circuit board structure with gold finger
CN104918420B (en) * 2014-03-11 2018-03-16 深南电路有限公司 A kind of processing method of golden finger and the board structure of circuit with golden finger

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