TWI315448B - Photosensitive resin composition for forming lens - Google Patents

Photosensitive resin composition for forming lens

Info

Publication number
TWI315448B
TWI315448B TW095105814A TW95105814A TWI315448B TW I315448 B TWI315448 B TW I315448B TW 095105814 A TW095105814 A TW 095105814A TW 95105814 A TW95105814 A TW 95105814A TW I315448 B TWI315448 B TW I315448B
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
forming lens
lens
forming
Prior art date
Application number
TW095105814A
Other languages
English (en)
Other versions
TW200636388A (en
Inventor
Yasuaki Sugimoto
Satoshi Niikura
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200636388A publication Critical patent/TW200636388A/zh
Application granted granted Critical
Publication of TWI315448B publication Critical patent/TWI315448B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW095105814A 2005-03-11 2006-02-21 Photosensitive resin composition for forming lens TWI315448B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005068909A JP2006251464A (ja) 2005-03-11 2005-03-11 レンズ形成用感光性樹脂組成物

Publications (2)

Publication Number Publication Date
TW200636388A TW200636388A (en) 2006-10-16
TWI315448B true TWI315448B (en) 2009-10-01

Family

ID=37092019

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105814A TWI315448B (en) 2005-03-11 2006-02-21 Photosensitive resin composition for forming lens

Country Status (3)

Country Link
JP (1) JP2006251464A (zh)
KR (1) KR100740823B1 (zh)
TW (1) TWI315448B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090005976A (ko) 2007-07-09 2009-01-14 도쿄 오카 고교 가부시키가이샤 감광성 수지 조성물 및 이를 이용한 마이크로렌즈
KR101935033B1 (ko) 2012-10-23 2019-04-05 닛산 가가쿠 가부시키가이샤 비감광성 수지 조성물
JP6792207B2 (ja) 2015-12-21 2020-11-25 日産化学株式会社 樹脂組成物
KR102411927B1 (ko) 2016-07-28 2022-06-22 닛산 가가쿠 가부시키가이샤 수지 조성물
CN111801620B (zh) * 2018-12-21 2023-08-04 株式会社Lg化学 感光性树脂组合物、感光材料、滤色器和显示装置
JP7219607B2 (ja) * 2018-12-25 2023-02-08 東京応化工業株式会社 樹脂組成物、及びマイクロレンズパターンを備える基板の製造方法
WO2021090576A1 (ja) 2019-11-06 2021-05-14 日産化学株式会社 非感光性樹脂組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3092158B2 (ja) * 1989-12-01 2000-09-25 東ソー株式会社 レンズ形成用ポジ型感光材料
DE4002397A1 (de) * 1990-01-27 1991-08-01 Hoechst Ag Strahlungsempfindliches gemisch und hieraus hergestelltes strahlungsempfindliches aufzeichnungsmaterial
DE4006856A1 (de) * 1990-03-05 1991-09-12 Hoechst Ag Gefaerbtes positiv arbeitendes lichtempfindliches aufzeichnungsmaterial und verfahren zur herstellung eines farbpruefbildes unter verwendung dieses materials
JP3003808B2 (ja) * 1991-03-14 2000-01-31 東京応化工業株式会社 マイクロレンズ及びその製造方法
JP3082179B2 (ja) * 1992-07-03 2000-08-28 ジェイエスアール株式会社 レンズ用感光性樹脂組成物
JP3114166B2 (ja) * 1992-10-22 2000-12-04 ジェイエスアール株式会社 マイクロレンズ用感放射線性樹脂組成物
JPH07168359A (ja) * 1993-12-15 1995-07-04 Tosoh Corp マイクロレンズ用感光材料
DE4414896A1 (de) * 1994-04-28 1995-11-02 Hoechst Ag Positiv arbeitendes strahlungempfindliches Gemisch
JP3783512B2 (ja) * 2000-02-29 2006-06-07 Ｊｓｒ株式会社 感放射線性樹脂組成物およびそれから形成された層間絶縁膜
WO2003010602A1 (en) * 2001-07-26 2003-02-06 Ciba Specialty Chemicals Holding Inc. Photosensitive resin composition

Also Published As

Publication number Publication date
KR100740823B1 (ko) 2007-07-19
JP2006251464A (ja) 2006-09-21
KR20060097616A (ko) 2006-09-14
TW200636388A (en) 2006-10-16

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