TWI312867B - - Google Patents
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- Publication number
- TWI312867B TWI312867B TW96101463A TW96101463A TWI312867B TW I312867 B TWI312867 B TW I312867B TW 96101463 A TW96101463 A TW 96101463A TW 96101463 A TW96101463 A TW 96101463A TW I312867 B TWI312867 B TW I312867B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal
- needle
- signal
- pin
- probe
- Prior art date
Links
- 239000002184 metal Substances 0.000 claims description 68
- 229910052751 metal Inorganic materials 0.000 claims description 68
- 239000000523 sample Substances 0.000 claims description 66
- 230000005540 biological transmission Effects 0.000 claims description 42
- 230000008054 signal transmission Effects 0.000 claims description 5
- 210000000245 forearm Anatomy 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 241000255925 Diptera Species 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 3
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims 1
- 241000282320 Panthera leo Species 0.000 claims 1
- 230000004323 axial length Effects 0.000 claims 1
- 238000005253 cladding Methods 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96101463A TW200829923A (en) | 2007-01-15 | 2007-01-15 | High frequency suspension arm probe |
| SG200718122-5A SG144798A1 (en) | 2007-01-15 | 2007-11-28 | Cantilever-type probe mechanism and method of making cantilever-type probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96101463A TW200829923A (en) | 2007-01-15 | 2007-01-15 | High frequency suspension arm probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200829923A TW200829923A (en) | 2008-07-16 |
| TWI312867B true TWI312867B (enExample) | 2009-08-01 |
Family
ID=39710876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96101463A TW200829923A (en) | 2007-01-15 | 2007-01-15 | High frequency suspension arm probe |
Country Status (2)
| Country | Link |
|---|---|
| SG (1) | SG144798A1 (enExample) |
| TW (1) | TW200829923A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI467190B (enExample) * | 2011-07-22 | 2015-01-01 | ||
| CN108022848A (zh) * | 2016-11-01 | 2018-05-11 | 稳懋半导体股份有限公司 | 改良式同轴探针结构 |
| TWI687692B (zh) * | 2015-03-31 | 2020-03-11 | 義大利商探針科技公司 | 用於高頻應用的垂直接觸探針及具有垂直接觸探針的對應測試頭 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI461698B (zh) * | 2010-09-30 | 2014-11-21 | Mpi Corp | Probe unit and its making method |
| TWI458987B (zh) * | 2013-04-26 | 2014-11-01 | Mpi Corp | 探針模組 |
| CN119414056A (zh) * | 2024-10-31 | 2025-02-11 | 昆山德普福电子科技有限公司 | 射频测试探针装置 |
-
2007
- 2007-01-15 TW TW96101463A patent/TW200829923A/zh not_active IP Right Cessation
- 2007-11-28 SG SG200718122-5A patent/SG144798A1/en unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI467190B (enExample) * | 2011-07-22 | 2015-01-01 | ||
| TWI687692B (zh) * | 2015-03-31 | 2020-03-11 | 義大利商探針科技公司 | 用於高頻應用的垂直接觸探針及具有垂直接觸探針的對應測試頭 |
| CN108022848A (zh) * | 2016-11-01 | 2018-05-11 | 稳懋半导体股份有限公司 | 改良式同轴探针结构 |
| CN108022848B (zh) * | 2016-11-01 | 2020-10-27 | 稳懋半导体股份有限公司 | 改良式同轴探针结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| SG144798A1 (en) | 2008-08-28 |
| TW200829923A (en) | 2008-07-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MC4A | Revocation of granted patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |