TWI312812B - - Google Patents

Download PDF

Info

Publication number
TWI312812B
TWI312812B TW95107803A TW95107803A TWI312812B TW I312812 B TWI312812 B TW I312812B TW 95107803 A TW95107803 A TW 95107803A TW 95107803 A TW95107803 A TW 95107803A TW I312812 B TWI312812 B TW I312812B
Authority
TW
Taiwan
Prior art keywords
coating
film
coating chamber
line
replaceable
Prior art date
Application number
TW95107803A
Other languages
Chinese (zh)
Other versions
TW200734474A (en
Inventor
Chia Ming Hsu
Original Assignee
Chienkuo Technology Universit
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chienkuo Technology Universit filed Critical Chienkuo Technology Universit
Priority to TW095107803A priority Critical patent/TW200734474A/en
Publication of TW200734474A publication Critical patent/TW200734474A/en
Application granted granted Critical
Publication of TWI312812B publication Critical patent/TWI312812B/zh

Links

Landscapes

  • Physical Vapour Deposition (AREA)

Description

1312812 九、發明說明: 【.發明所屬之技術領域】 本發明係有關一種玎置換式鍍膜艙之鍍膜裝置,尤指 一種具快速裝拆功用之鍍膜裝置。 •, 【先前技術】 目前應用於電子、光電以及機械產業研究或生產的真 空鐘膜系統大致上包括了蒸鍍(CVD,PVD)、濺鍍 φ (Spattering)以及電漿氮化(Plasma nitrogenizing)等。 製輕主要是於鍍膜艙中利用輝光放電使氬氣離子 以加熱蒸發方式^的原子被激發而附著在元件表面,或 以形成具有特定^材氣化’再附著於較冷之元件表面, 鍍膜艙在每隔的薄膜°為維持锻膜的品質’該真空 同時,均需停檣二時間(一般約一週)或所鑛薄膜成份不 ,以綠減真空賴艙進行清潔,才能再次使用 由於該真办你^ #清潔真空鑛‘二艙為鑛膜過程中之主要設備,因此, 作效率之業界而言致鍍f製程完全中斷,對相當重視工 的停機時間及節。^何能縮短因清潔真空鍍膜艙所造成 '巾在無塵室中_^潔人力實為業界所急待解決的問題。 境問題,更是錢模。工錢膜搶’則因容易引起污染無塵環 室因穿著防護衣,二質不良搞因之一 ’且工作人員在無塵 。 $接影響清潔真空鍍麟作業之效率 【發明内容】 5 1312812 本發明之主要目的,在於 可置換式鍍膜艙之鍛膜裂置,、係^問題而提供1 抽插式連接裂置,以連接鑛二逮 管路、控制迴路、冷卻管線,如抽氣管路、壤氣 裝=材元二:裝後,即 • 騎前述之目的,本發=:停機時間的功用。 艙並供Α&連結之抽氣管路;及 膜擒;及錢體供應源連結之進氣管路供輸入氣體至錢 置之一控制系統驅動鍍膜艙之控制迴路;及 二㈣置之冷卻管線迴路供冷卻液(水)循4 應卻料整合抽氣管路、進氣管路、控制迴路、a 籲 P官峪了為與鍍膜艙截斷或連結狀態。 v _ 之上述及其他目的與優點,不難從下述所選用 只各詳細說明與附圖中,獲得深入了解。 、 當然,本發明在某些另件上,或另件之安排上容許 所不同,钽所選用之實施例,則於本說明書 ㈣’料附財展示其構造。 切細1312812 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a coating device for a bismuth displacement coating chamber, and more particularly to a coating device with a quick assembly and disassembly function. •, [Prior Art] Vacuum film systems currently used in the research, production, or production of the electronics, optoelectronics, and mechanical industries generally include vapor deposition (CVD, PVD), sputtering pr (Spattering), and plasma nitriding (Plasm nitrogenizing). Wait. The light is mainly caused by the glow discharge in the coating chamber, the atom of the argon ion is heated and evaporated, and the atom is excited to adhere to the surface of the element, or to form a specific material to be vaporized and then adhered to the surface of the cold component. In every other film, the quality of the forged film is maintained. 'The vacuum needs to be stopped for two times (usually about one week) or the film composition of the ore is not cleaned by the green vacuum chamber to be used again. Really do you ^ #清洁真空矿's second compartment is the main equipment in the process of mining film, therefore, the efficiency of the industry, the plating process is completely interrupted, paying considerable attention to the downtime and section of the work. ^ How can I shorten the problem caused by cleaning the vacuum coating chamber? The towel is in the clean room. The problem of the environment is even more money. The money film is robbed, because it is easy to cause pollution, the dust-free ring room is wearing protective clothing, and the quality is bad. One of the workers is dust-free. $Influence of efficiency of clean vacuum plating operation [Invention] 5 1312812 The main object of the present invention is to provide a 1 push-pull connection split for the forging film splitting of the replaceable coating chamber, and to connect Mine 2 arrest pipeline, control loop, cooling pipeline, such as pumping pipeline, petrogas loading = material element 2: after installation, ie • riding the above purpose, this hair =: the function of downtime. The tank is connected to the pumping line connected to the Α & and the membrane 擒; and the inlet line of the money source is supplied to the control circuit of the control system to drive the coating chamber; and the cooling line of the second (four) The circuit for the coolant (water) should be integrated into the exhaust line, the intake line, the control circuit, and the auspicious P is cut off or connected to the coating chamber. The above and other objects and advantages of v _ are not difficult to obtain from the following detailed descriptions and detailed descriptions. Of course, the present invention allows for differences in certain parts, or arrangements of parts, and the selected embodiment is shown in the specification (4). Shred

【實施方式;J 請參間第1圖至第2圖’圖中所示者為本發明 之實例結構,此僅供說明之用,在專利申請上並不受此 6 1312812 種結構之限制。 本實施例之可置換式鍍膜艙之鍍膜裝置用於濺鍍機 時,如第1圖所示,其具有至少一鍍膜艙1 0,俾供一待 鍍膜之元件可置於該鍍膜艙1 0内進行鍍膜,並包括: (a )連結於鍍膜艙1 0並供真空泵2連結之抽氣管路2 1 〇 (b )自一外部氣體供應源3連結之進氣管路3 1供輸入 氣體至鍍膜艙。 (c) 供鍍膜裝置之一控制系統4驅動鍍膜艙10之控制 線路4 1。 (d) 連結鍍膜裝置之冷卻系統5及供循環於鍍膜艙10 外壁之冷卻管路51。 (e ) —連接器6,整合抽氣管路2 1、進氣管路3 1、 控制線路4 1、冷卻管路5 1,可為與鍍膜艙1 0 截斷或連結狀態。 第2圖為本發明應用於鍍膜製程之流程示意,如同一 般鍍膜製程,本發明之鍍膜裝置可對鍍膜艙1 0内之元件 進行鍍膜,當鍍膜製程完成後,利用連接器6快速分離抽 氣管路21、進氣管路31、控制線路4 1、冷卻管路5 1為截斷狀態,而可將鍍膜艙1 0移出,此時可利用另一 乾淨之鍍膜艙(該鍍膜艙尺寸大小及形狀可與先前之鍍膜 艙不相同,但連結於連接器6之端子6 A必須都一樣,以 便與另一端之連接器端子6 B快速插接結合。)再經連接 器6結合至本鍍膜裝置,而此替換後之鍍膜艙具備同樣規 7 1312812 袼之連接器端子6 A而可連結真空泵2、氣體供應源3、 控制系統4、冷卻系統5,以達到縮短停機時間的功用。 本發明具有下列之優點: 1.裝卸速度快:由於本發明係將對應於該鑛膜艙之 相關管路與設備迴路等,均已規劃整理後藉由連 接裝置相連接對應之機能單元,因此,可在預備 連接的鍍膜艙1 0事先備置好鍍膜元件及靶材, 而完成鍍膜的元件可在鍍膜艙離線移出後再進行 取出作業’因而大幅縮短裝卸的速度。 2 ·停機時間短:因該鍍膜艙的裝卸置換速度快,清 理鍍膜艙的作業可統一於另一作業區處理,因此 可縮短停機的時間。 3 .由於鍍膜艙可經常離線進行清理,故能常態的保 持艙室内之高度潔淨要求,同時也保持潔淨室全 面經常處於所要求之潔淨度。因而可大幅減少鍍 膜元件被污染機會,能有效改善製品良率。 4 ·可適用於不同規格之鑛膜艙,例如單餘或多繪之 鍍膜艙之置換。 本發明可應用於多數類型之鍍膜裝置,凡舉如運用於 蒸鍍裝置、濺鍍裝置或電漿氮化裝置等,同樣可達到前述 各項功效。 以上所述實施例之揭示係用以說明本發明,並非用以 限制本發明,故舉凡數值之變更或等效元件之置換仍應隸 屬本發明之範轉。 1312812 【圖式簡單說明】 第1圖係本發明鍍膜裝置之簡要架構示意圖。 第2圖為本發明應用於鍍膜製程之流程示意。 【主要元件符號說明】 (本發明部分) 鍍膜艙1 0 抽氣管路21 進氣管路31 控制線路41 冷卻管路51 真空泵2 氣體供應源3 控制系統4 冷卻系統5 連接器6[Embodiment; J, please refer to Fig. 1 to Fig. 2] The figure shows an example structure of the present invention, which is for illustrative purposes only and is not limited by the structure of the 6 1312812 patent application. When the coating device of the replaceable coating chamber of the embodiment is used in a sputtering machine, as shown in FIG. 1, it has at least one coating chamber 10, and a component to be coated can be placed in the coating chamber. The coating is carried out, and includes: (a) an air suction line 2 1 connected to the coating chamber 10 and connected to the vacuum pump 2, and (b) an intake line 3 1 connected from an external gas supply source 3 for inputting gas to Coating cabin. (c) A control circuit 4 for the coating device drives the control circuit 4 of the coating chamber 10. (d) A cooling system 5 that connects the coating device and a cooling line 51 that is circulated to the outer wall of the coating chamber 10. (e) - the connector 6, the integrated exhaust line 2 1 , the intake line 3 1 , the control line 4 1 , and the cooling line 5 1 may be disconnected or connected to the coating chamber 10 . 2 is a schematic flow chart of the invention applied to the coating process. Like the general coating process, the coating device of the present invention can coat the components in the coating chamber 10, and after the coating process is completed, the connector 6 is used to quickly separate the exhaust pipe. The road 21, the intake line 31, the control line 4 1 and the cooling line 5 1 are in a cut-off state, and the coating chamber 10 can be removed, and another clean coating chamber can be utilized (the size and shape of the coating chamber) It may be different from the previous coating chamber, but the terminal 6 A connected to the connector 6 must be the same so as to be quickly plugged into the connector terminal 6 B at the other end.) After being coupled to the coating device via the connector 6, The replaced coating chamber has the connector terminal 6 A of the same specification 7 1312812 而 and can be connected to the vacuum pump 2, the gas supply source 3, the control system 4, and the cooling system 5 to achieve the function of reducing the down time. The invention has the following advantages: 1. Fast loading and unloading speed: since the invention relates to the relevant pipelines and equipment loops corresponding to the capsule membrane, etc., it has been planned to be connected and connected to the corresponding functional unit by the connecting device, The coating element and the target can be prepared in advance in the coating chamber 10 to be connected, and the completed coating element can be removed after the coating chamber is removed offline, thereby greatly reducing the speed of loading and unloading. 2 · Short downtime: Due to the fast loading and unloading speed of the coating chamber, the cleaning of the coating chamber can be handled uniformly in another working area, thus reducing the downtime. 3. Since the coating chamber can be cleaned off-line frequently, it can maintain the high cleanliness requirements of the cabin in the normal state, while maintaining the cleanliness of the clean room. Therefore, the chance of contamination of the coating element can be greatly reduced, and the product yield can be effectively improved. 4 · It can be applied to different types of ore chambers, such as replacement of coating chambers with single or multiple paintings. The present invention can be applied to most types of coating devices, such as those used in vapor deposition devices, sputtering devices, or plasma nitriding devices, and the like. The above description of the embodiments is intended to be illustrative of the invention, and is not intended to limit the scope of the invention. 1312812 [Simple description of the drawings] Fig. 1 is a schematic diagram showing the schematic structure of the coating device of the present invention. Fig. 2 is a schematic flow chart showing the application of the invention to a coating process. [Description of main component symbols] (part of the invention) Coating chamber 1 0 Exhaust line 21 Intake line 31 Control line 41 Cooling line 51 Vacuum pump 2 Gas supply source 3 Control system 4 Cooling system 5 Connector 6

連接器端子6 A、6 BConnector terminals 6 A, 6 B

Claims (1)

1312812 i ' _ _ 〜’口:f1312812 i ' _ _ ~' mouth: f 十、,請專利範圍: 1·一種可置換式鍍膜艙之鍍膜裝置, 供一f鍍膜之錯可置於該__俾 f吉於麵搶並供真空^ 搶^-外部氣體供應源連結之進氣管路供輸入氣體至鍵膜 、“丄供鍍膜裝置之、控制•、統驅動錢膜驗之控制迴路;及 、、、《錄膜裝置之冷卻見線迴路供冷卻液循環於鑛膜艏外壁; ^ 一連接器,整合抽氣管路、進氣管路、控制迴路、冷卻 皆路可為與鍍膜艙截斷或連結狀態。 申凊專利範圍第1項所述之可置換式鑛膜搶之鑛膜裝置, 係為蒸鍍裝置、滅鐘装置或電漿氮化裝置之任一種。Ten, please patent scope: 1. A coating device for the replaceable coating chamber, for the error of a f coating can be placed in the __俾f 吉 于 抢 and for vacuum ^ 抢 ^ - external gas supply source The intake pipeline supplies the input gas to the key film, the control circuit of the coating device, the control system, and the driving film; and the cooling circuit of the film recording device for circulating the coolant to the film艏External wall; ^ A connector, integrated pumping line, intake line, control circuit, cooling circuit can be cut off or connected with the coating chamber. The replaceable mining membrane film mentioned in the first paragraph of the patent scope of the application The mineral film device is any one of a vapor deposition device, a clock elimination device or a plasma nitriding device.
TW095107803A 2006-03-08 2006-03-08 Film-coating device with replaceable coating chamber TW200734474A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095107803A TW200734474A (en) 2006-03-08 2006-03-08 Film-coating device with replaceable coating chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095107803A TW200734474A (en) 2006-03-08 2006-03-08 Film-coating device with replaceable coating chamber

Publications (2)

Publication Number Publication Date
TW200734474A TW200734474A (en) 2007-09-16
TWI312812B true TWI312812B (en) 2009-08-01

Family

ID=45072654

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095107803A TW200734474A (en) 2006-03-08 2006-03-08 Film-coating device with replaceable coating chamber

Country Status (1)

Country Link
TW (1) TW200734474A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI486469B (en) * 2010-04-22 2015-06-01 Hon Hai Prec Ind Co Ltd Coating system

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI396760B (en) * 2008-06-13 2013-05-21 Hon Hai Prec Ind Co Ltd Automatic coating device
TWI415967B (en) * 2008-11-28 2013-11-21 Hon Hai Prec Ind Co Ltd Holder for holding workpieces to be sputtered and sputtering method using the same
TWI384085B (en) * 2009-05-07 2013-02-01 Univ Kao Yuan Reciprocating two-section atmospheric pressure plasma coating system
TWI452168B (en) * 2010-06-21 2014-09-11 Hon Hai Prec Ind Co Ltd Plasma coating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI486469B (en) * 2010-04-22 2015-06-01 Hon Hai Prec Ind Co Ltd Coating system

Also Published As

Publication number Publication date
TW200734474A (en) 2007-09-16

Similar Documents

Publication Publication Date Title
TWI312812B (en)
US7874262B2 (en) Masking system for the masking of a crank chamber of an internal combustion engine
JP5363910B2 (en) Vacuum pump
JP2009534574A5 (en)
JP5010875B2 (en) Cleaning device and cleaning method
TWI647331B (en) Film forming device, exhaust device, and exhaust method
US9580805B2 (en) Vapor deposition system and method
JP2008186864A (en) Cleaning method of gate valve, and substrate treatment system
TW201116720A (en) Gas discharge structure, and device and method for plasma processing
CN107413715A (en) The clean method of target
TWI757969B (en) Plasma enhanced anneal chamber for wafer outgassing
JP6322508B2 (en) Vacuum processing equipment
US20210079514A1 (en) Sputtering Method and Sputtering Apparatus
KR20210026366A (en) The bonding device for transfering graphene film
CN111621769A (en) Exhaust duct of semiconductor manufacturing apparatus
JP4816616B2 (en) Gas shower head, processing apparatus, processing method, and maintenance method of processing apparatus
CN101360844A (en) Sputtering target, sputtering target material and process for producing these
TWI447249B (en) System for supplying mixed gases, sputtering apparatus and sputtering method
JP6316759B2 (en) Gas supply system cleaning method and substrate processing apparatus
JP2009123723A (en) Vacuum treatment apparatus or method for vacuum treatment
TWI311590B (en)
US8609241B2 (en) Coated article and method of making the same
JP2008181799A (en) Plasma processing device, and plasma processing method
CN108917448B (en) High-uniformity ultrathin heat exchange tube
JP6422074B2 (en) Vacuum processing equipment