TWI311819B - Substrate for mounting light emitting element, light emitting element package body, display apparatus, and illumination apparatus - Google Patents

Substrate for mounting light emitting element, light emitting element package body, display apparatus, and illumination apparatus Download PDF

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Publication number
TWI311819B
TWI311819B TW95119607A TW95119607A TWI311819B TW I311819 B TWI311819 B TW I311819B TW 95119607 A TW95119607 A TW 95119607A TW 95119607 A TW95119607 A TW 95119607A TW I311819 B TWI311819 B TW I311819B
Authority
TW
Taiwan
Prior art keywords
light
emitting element
emitting
package
substrate
Prior art date
Application number
TW95119607A
Other languages
English (en)
Chinese (zh)
Other versions
TW200802923A (en
Inventor
Masakazu Ohashi
Ken-Ichi Uruga
Masanori Ito
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of TW200802923A publication Critical patent/TW200802923A/zh
Application granted granted Critical
Publication of TWI311819B publication Critical patent/TWI311819B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
TW95119607A 2005-03-24 2006-06-02 Substrate for mounting light emitting element, light emitting element package body, display apparatus, and illumination apparatus TWI311819B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005085885A JP2006269757A (ja) 2005-03-24 2005-03-24 発光素子実装用基板、発光素子パッケージ体、表示装置及び照明装置

Publications (2)

Publication Number Publication Date
TW200802923A TW200802923A (en) 2008-01-01
TWI311819B true TWI311819B (en) 2009-07-01

Family

ID=37205402

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95119607A TWI311819B (en) 2005-03-24 2006-06-02 Substrate for mounting light emitting element, light emitting element package body, display apparatus, and illumination apparatus

Country Status (2)

Country Link
JP (1) JP2006269757A (ja)
TW (1) TWI311819B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412163B (zh) * 2010-10-18 2013-10-11 Advanced Optoelectronic Tech 發光二極體封裝結構及其製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4936465B2 (ja) * 2007-09-18 2012-05-23 パナソニック株式会社 発光装置
JP5368809B2 (ja) 2009-01-19 2013-12-18 ローム株式会社 Ｌｅｄモジュールの製造方法およびｌｅｄモジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412163B (zh) * 2010-10-18 2013-10-11 Advanced Optoelectronic Tech 發光二極體封裝結構及其製造方法

Also Published As

Publication number Publication date
JP2006269757A (ja) 2006-10-05
TW200802923A (en) 2008-01-01

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MM4A Annulment or lapse of patent due to non-payment of fees