TWI310394B - - Google Patents

Download PDF

Info

Publication number
TWI310394B
TWI310394B TW94130450A TW94130450A TWI310394B TW I310394 B TWI310394 B TW I310394B TW 94130450 A TW94130450 A TW 94130450A TW 94130450 A TW94130450 A TW 94130450A TW I310394 B TWI310394 B TW I310394B
Authority
TW
Taiwan
Prior art keywords
compound
temperature
nitrogen
reaction
hours
Prior art date
Application number
TW94130450A
Other languages
English (en)
Chinese (zh)
Other versions
TW200712123A (en
Inventor
Pi Tao Kuo
Taniuchi Akira
Original Assignee
Chin Yee Chemical Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chin Yee Chemical Ind Co Ltd filed Critical Chin Yee Chemical Ind Co Ltd
Priority to TW094130450A priority Critical patent/TW200712123A/zh
Publication of TW200712123A publication Critical patent/TW200712123A/zh
Application granted granted Critical
Publication of TWI310394B publication Critical patent/TWI310394B/zh

Links

Landscapes

  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
TW094130450A 2005-09-06 2005-09-06 The nitrogen-containing curing agent and used thereof in the epoxy resin composition TW200712123A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094130450A TW200712123A (en) 2005-09-06 2005-09-06 The nitrogen-containing curing agent and used thereof in the epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094130450A TW200712123A (en) 2005-09-06 2005-09-06 The nitrogen-containing curing agent and used thereof in the epoxy resin composition

Publications (2)

Publication Number Publication Date
TW200712123A TW200712123A (en) 2007-04-01
TWI310394B true TWI310394B (enrdf_load_stackoverflow) 2009-06-01

Family

ID=45072231

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130450A TW200712123A (en) 2005-09-06 2005-09-06 The nitrogen-containing curing agent and used thereof in the epoxy resin composition

Country Status (1)

Country Link
TW (1) TW200712123A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI403556B (zh) * 2010-02-12 2013-08-01 Elite Material Co Ltd A resin composition, and a prepreg, a laminate, and a circuit board comprising the resin composition

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395768B (zh) * 2009-12-18 2013-05-11 Elite Material Co Ltd Polymer Materials and Their Applications

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI403556B (zh) * 2010-02-12 2013-08-01 Elite Material Co Ltd A resin composition, and a prepreg, a laminate, and a circuit board comprising the resin composition

Also Published As

Publication number Publication date
TW200712123A (en) 2007-04-01

Similar Documents

Publication Publication Date Title
JP5030297B2 (ja) 積層板用樹脂組成物、プリプレグ及び積層板
JP4120780B2 (ja) フェノール性水酸基を有するポリイミド樹脂の製造方法
JP5719562B2 (ja) 高分子量エポキシ樹脂、該高分子量エポキシ樹脂を用いる樹脂フィルム、樹脂組成物、および硬化物
JP6764470B2 (ja) マレイミド樹脂、硬化性樹脂組成物およびその硬化物
JP6515255B1 (ja) 硬化性樹脂組成物、ワニス、プリプレグ、硬化物、及び、積層板または銅張積層板
WO2017170844A1 (ja) 熱硬化性樹脂組成物、プリプレグ及びその硬化物
JP5734603B2 (ja) フェノール性樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及び硬化物
TW201125838A (en) Polyhydroxy compound, method for producing the same and epoxy resin composition and cured product thereof
WO2018123806A1 (ja) アルケニル基含有樹脂、硬化性樹脂組成物およびその硬化物
KR20180092934A (ko) 에폭시 수지 조성물, 프리프레그, 에폭시 수지 조성물 성형체 및 그 경화물
TWI310394B (enrdf_load_stackoverflow)
TWI441846B (zh) An epoxy resin, a method for producing the same, an epoxy resin composition, and a cured product
JP5328064B2 (ja) 多価フェノール化合物、熱硬化性樹脂組成物及びその硬化物
JP7268256B1 (ja) エポキシ樹脂、硬化性樹脂組成物、およびその硬化物
JP2000154225A (ja) 高耐熱低誘電率熱硬化性樹脂
US10766887B2 (en) Benzoxazine-based mixture and use thereof
JPWO2018199157A1 (ja) マレイミド樹脂組成物、プリプレグ及びその硬化物
JP5170724B2 (ja) エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
KR102295391B1 (ko) 벤족사진 및 이를 이용한 폴리벤족사진의 제조방법
EP0241133A2 (en) Polymaleimide compound and a composition containing the same
TWI895448B (zh) 多元羥基樹脂、其製造方法、及包含其的環氧樹脂組成物、以及環氧樹脂硬化物
JP7132385B1 (ja) エポキシ樹脂、硬化性樹脂組成物、およびその硬化物
WO2022265096A9 (ja) エポキシ樹脂、硬化性樹脂組成物、およびその硬化物
JP2012046615A (ja) エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物
TWI600674B (zh) 二環戊二烯-酚樹脂與2,6二甲基苯酚共聚物環氧樹脂製造與應用