TWI304642B - - Google Patents

Download PDF

Info

Publication number
TWI304642B
TWI304642B TW91103262A TW91103262A TWI304642B TW I304642 B TWI304642 B TW I304642B TW 91103262 A TW91103262 A TW 91103262A TW 91103262 A TW91103262 A TW 91103262A TW I304642 B TWI304642 B TW I304642B
Authority
TW
Taiwan
Prior art keywords
layer
wafers
oxide layer
wafer
thin
Prior art date
Application number
TW91103262A
Other languages
English (en)
Chinese (zh)
Inventor
Zhi-Hao Lin
Pu Fan Chen
Fei-Wen Zheng
Original Assignee
Taiwan Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg filed Critical Taiwan Semiconductor Mfg
Priority to TW91103262A priority Critical patent/TWI304642B/zh
Application granted granted Critical
Publication of TWI304642B publication Critical patent/TWI304642B/zh

Links

Landscapes

  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
TW91103262A 2002-02-25 2002-02-25 TWI304642B (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91103262A TWI304642B (ja) 2002-02-25 2002-02-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91103262A TWI304642B (ja) 2002-02-25 2002-02-25

Publications (1)

Publication Number Publication Date
TWI304642B true TWI304642B (ja) 2008-12-21

Family

ID=45070983

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91103262A TWI304642B (ja) 2002-02-25 2002-02-25

Country Status (1)

Country Link
TW (1) TWI304642B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111952153A (zh) * 2020-08-21 2020-11-17 浙江晶科能源有限公司 隧穿氧化层的制备方法、太阳能电池及其制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111952153A (zh) * 2020-08-21 2020-11-17 浙江晶科能源有限公司 隧穿氧化层的制备方法、太阳能电池及其制备方法
CN111952153B (zh) * 2020-08-21 2023-08-22 浙江晶科能源有限公司 隧穿氧化层的制备方法、太阳能电池及其制备方法

Similar Documents

Publication Publication Date Title
US9461138B2 (en) Non-volatile semiconductor memory with nitride sidewall contacting nitride layer of ONO gate stack and methods for producing the same
JP2933902B2 (ja) 不揮発性メモリ及びロジック構成要素を一体型不揮発性メモリを得るために0.3ミクロン以下の単一の製造プロセスに組み込むための方法
US7364969B2 (en) Semiconductor fabrication process for integrating formation of embedded nonvolatile storage device with formation of multiple transistor device types
US6468863B2 (en) Split gate field effect transistor (FET) device employing dielectric barrier layer and method for fabrication thereof
TW533588B (en) Flash memory and its manufacturing method
TWI249185B (en) Semiconductor device and method of manufacturing the same
CN101533776B (zh) 制造半导体存储器件的方法
JP2003163289A (ja) 半導体メモリの製造方法、及び該半導体メモリを含む半導体装置の製造方法
TWI304642B (ja)
JP2000031305A (ja) And型不揮発性半導体記憶装置およびその製造方法
US5744391A (en) Method to improve isolation between EEPROM devices via a field oxide anneal
CN109903797B (zh) 分栅快闪存储器的制造方法及分栅快闪存储器
TWI305397B (ja)
JP3140023B2 (ja) 半導体装置及びその製造方法
JP2006310484A (ja) 半導体装置の製造方法
JPH0774274A (ja) 半導体装置の製造方法
JPH10189922A (ja) フラッシュメモリ素子の製造方法
US7329577B2 (en) Method of manufacturing nonvolatile semiconductor storage device
US6017786A (en) Method for forming a low barrier height oxide layer on a silicon substrate
JP3138538B2 (ja) 半導体不揮発性記憶素子およびその製造方法
JPH1065026A (ja) 不揮発性半導体記憶装置の製造方法
KR19980043614A (ko) 비휘발성 메모리 소자의 제조방법
KR0150687B1 (ko) 플래쉬 이이피롬 제조방법
JPS6153869B2 (ja)
TW546815B (en) Method for forming tiny spacer in flash device process

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent