TWI290613B - Position detecting method and position detecting device and position detecting system - Google Patents

Position detecting method and position detecting device and position detecting system Download PDF

Info

Publication number
TWI290613B
TWI290613B TW095133991A TW95133991A TWI290613B TW I290613 B TWI290613 B TW I290613B TW 095133991 A TW095133991 A TW 095133991A TW 95133991 A TW95133991 A TW 95133991A TW I290613 B TWI290613 B TW I290613B
Authority
TW
Taiwan
Prior art keywords
camera
stage
movement
substrate
moved
Prior art date
Application number
TW095133991A
Other languages
English (en)
Chinese (zh)
Other versions
TW200720621A (en
Inventor
Mamoru Egi
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Publication of TW200720621A publication Critical patent/TW200720621A/zh
Application granted granted Critical
Publication of TWI290613B publication Critical patent/TWI290613B/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/002Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/30Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02Testing optical properties
    • G01M11/0242Testing optical properties by measuring geometrical properties or aberrations
    • G01M11/025Testing optical properties by measuring geometrical properties or aberrations by determining the shape of the object to be tested
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/70Determining position or orientation of objects or cameras

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Optics & Photonics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Analytical Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095133991A 2005-09-22 2006-09-14 Position detecting method and position detecting device and position detecting system TWI290613B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005275571A JP2007085912A (ja) 2005-09-22 2005-09-22 位置測定方法及び位置測定装置並びに位置測定システム

Publications (2)

Publication Number Publication Date
TW200720621A TW200720621A (en) 2007-06-01
TWI290613B true TWI290613B (en) 2007-12-01

Family

ID=37973032

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095133991A TWI290613B (en) 2005-09-22 2006-09-14 Position detecting method and position detecting device and position detecting system

Country Status (3)

Country Link
JP (1) JP2007085912A (ko)
KR (1) KR100724261B1 (ko)
TW (1) TWI290613B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007108037A (ja) * 2005-10-14 2007-04-26 Omron Corp 位置測定方法、距離測定方法及び位置測定装置
KR100863700B1 (ko) * 2008-02-18 2008-10-15 에스엔유 프리시젼 주식회사 비전 검사 시스템 및 이것을 이용한 피검사체의 검사 방법
JP5433848B2 (ja) * 2008-10-01 2014-03-05 株式会社ミツトヨ 画像測定装置
JP5454404B2 (ja) * 2010-07-20 2014-03-26 新日鐵住金株式会社 エッジ検出方法及び検出システム、帯材の走行状況測定方法及び測定システム、帯材の走行制御方法及び制御システム、並びに、帯材の製造方法及び製造システム
TW201241399A (en) * 2011-04-07 2012-10-16 xi-ming Xu Laser measurement device
CN108759676B (zh) * 2018-07-12 2023-11-03 浙江大学 基于棋盘格的传动箱端面大尺寸形位公差检测装置与方法
DE112019006323T5 (de) * 2018-12-21 2021-09-09 Omron Corporation Verfahren zum korrigieren von durch lineare skalen erfassten werten
CN111982078B (zh) * 2019-05-21 2022-03-29 中国石油天然气股份有限公司 钻井平台稳定性精密激光监测装置及激光漂移校准方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2621416B2 (ja) * 1988-09-22 1997-06-18 松下電器産業株式会社 移動量の測定用プレート
JP2003065746A (ja) * 2001-08-29 2003-03-05 Japan Em Co Ltd 座標測定装置および計測方法
JP2004348045A (ja) * 2003-05-26 2004-12-09 Fuji Photo Film Co Ltd 基準マーク位置測定装置

Also Published As

Publication number Publication date
TW200720621A (en) 2007-06-01
JP2007085912A (ja) 2007-04-05
KR20070033878A (ko) 2007-03-27
KR100724261B1 (ko) 2007-05-31

Similar Documents

Publication Publication Date Title
TWI290613B (en) Position detecting method and position detecting device and position detecting system
JP2006234553A (ja) 外観検査装置および外観検査方法
TW200935047A (en) Apparatus and method for inspection
TWI457534B (zh) 視覺檢測系統及利用該系統的座標變換方法
CN113496523A (zh) 三维标定视觉系统的系统及方法
KR20100096684A (ko) 3차원 형상 측정장치 및 측정방법
KR20200002916A (ko) 레이저 가공 장치
CN110612428A (zh) 使用特征量的三维测量方法及其装置
JP2007108037A (ja) 位置測定方法、距離測定方法及び位置測定装置
JP5096852B2 (ja) 線幅測定装置および線幅測定装置の検査方法
JP2011071225A (ja) アライメント装置
CN115943483A (zh) 位置控制装置、位置控制方法、位置控制程序以及接合装置
JP4791568B2 (ja) 3次元測定装置
JP4664015B2 (ja) 電子部品実装方法および電子部品実装装置
JP6976205B2 (ja) チップ位置測定装置
JP2017116401A (ja) 基板位置調整装置および基板位置調整方法
JP2005172610A (ja) 3次元測定装置
WO2021120911A1 (zh) 一种板状工件的三维坐标校准方法
KR20230096038A (ko) 실장 장치, 실장 방법 및 실장 제어 프로그램
JP2005221287A (ja) 基板検査方法及び基板検査装置
JP2010282100A (ja) カメラ設置位置検出装置及び検出方法並びにカメラ設置位置検出用治具
JP6706164B2 (ja) アライメント装置、露光装置、およびアライメント方法
JP2009204306A (ja) 複数のカメラを用いた撮像方法および計測装置
JP4419504B2 (ja) 画像補正装置及び画像補正方法
JP3912092B2 (ja) 形状測定方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees