TWI285257B - Heterodyne reflectometer for film thickness monitoring and method for implementing - Google Patents
Heterodyne reflectometer for film thickness monitoring and method for implementing Download PDFInfo
- Publication number
- TWI285257B TWI285257B TW095106373A TW95106373A TWI285257B TW I285257 B TWI285257 B TW I285257B TW 095106373 A TW095106373 A TW 095106373A TW 95106373 A TW95106373 A TW 95106373A TW I285257 B TWI285257 B TW I285257B
- Authority
- TW
- Taiwan
- Prior art keywords
- phase shift
- thickness
- frequency
- heterodyne
- grating
- Prior art date
Links
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0641—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of polarization
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2290/00—Aspects of interferometers not specifically covered by any group under G01B9/02
- G01B2290/30—Grating as beam-splitter
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/066,933 US7339682B2 (en) | 2005-02-25 | 2005-02-25 | Heterodyne reflectometer for film thickness monitoring and method for implementing |
| US11/178,856 US20060285120A1 (en) | 2005-02-25 | 2005-07-10 | Method for monitoring film thickness using heterodyne reflectometry and grating interferometry |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200710370A TW200710370A (en) | 2007-03-16 |
| TWI285257B true TWI285257B (en) | 2007-08-11 |
Family
ID=36941619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095106373A TWI285257B (en) | 2005-02-25 | 2006-02-24 | Heterodyne reflectometer for film thickness monitoring and method for implementing |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20060285120A1 (enExample) |
| JP (1) | JP4819065B2 (enExample) |
| KR (1) | KR20070110390A (enExample) |
| TW (1) | TWI285257B (enExample) |
| WO (1) | WO2006093709A2 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI386618B (zh) * | 2007-08-16 | 2013-02-21 | Micron Technology Inc | 用於特性化微電子工件層之厚度及表面起伏的系統和方法 |
| TWI451938B (zh) * | 2010-05-10 | 2014-09-11 | Samsung Electronics Co Ltd | 化學機械研磨設備之調節器 |
| TWI658251B (zh) * | 2017-09-26 | 2019-05-01 | 日商歐姆龍股份有限公司 | 位移測量裝置、測量系統、及位移測量方法 |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7781349B2 (en) * | 2005-09-12 | 2010-08-24 | Imec | Method and system for optimizing a BARC stack |
| US20070059849A1 (en) * | 2005-09-12 | 2007-03-15 | Interuniversitair Microelktronica Centrum (Imec) | Method and system for BARC optimization for high numerical aperture applications |
| US7589843B2 (en) * | 2005-09-27 | 2009-09-15 | Verity Instruments, Inc. | Self referencing heterodyne reflectometer and method for implementing |
| US20100122456A1 (en) * | 2008-11-17 | 2010-05-20 | Chen-Hua Yu | Integrated Alignment and Bonding System |
| US8908161B2 (en) * | 2011-08-25 | 2014-12-09 | Palo Alto Research Center Incorporated | Removing aluminum nitride sections |
| CN103890539B (zh) * | 2011-10-26 | 2016-05-25 | 三菱电机株式会社 | 膜厚测定方法 |
| JP6079697B2 (ja) * | 2013-07-11 | 2017-02-15 | 株式会社村田製作所 | 電子部品の厚さ測定方法、これを用いる電子部品連の製造方法、これによって製造された電子部品連、および、電子部品の検査装置 |
| KR102292209B1 (ko) | 2014-07-28 | 2021-08-25 | 삼성전자주식회사 | 반도체 계측 시스템 및 이를 이용한 반도체 소자의 계측 방법 |
| WO2017211545A1 (en) * | 2016-06-09 | 2017-12-14 | Asml Netherlands B.V. | Metrology apparatus |
| JP6800800B2 (ja) * | 2017-04-06 | 2020-12-16 | 株式会社ニューフレアテクノロジー | 成長速度測定装置および成長速度検出方法 |
| JP6285597B1 (ja) * | 2017-06-05 | 2018-02-28 | 大塚電子株式会社 | 光学測定装置および光学測定方法 |
| TWI794416B (zh) | 2018-02-28 | 2023-03-01 | 美商賽格股份有限公司 | 多層堆疊結構之計量方法及干涉儀系統 |
| DE102019104260B4 (de) * | 2019-02-20 | 2025-09-11 | Stefan Böttger | Photothermisches Verfahren und Vorrichtung zur Bestimmung einer Schichtdicke einer auf ein Substrat aufgebrachten Schicht |
| CN110715931B (zh) * | 2019-10-29 | 2022-04-12 | 上海御微半导体技术有限公司 | 一种透明样品缺陷自动检测方法和检测装置 |
| KR20220101070A (ko) | 2019-11-26 | 2022-07-19 | 하마마츠 포토닉스 가부시키가이샤 | 광학 유닛 및 막두께 계측 장치 |
| WO2022204560A1 (en) | 2021-03-26 | 2022-09-29 | Aiyer Arun Anath | Optical sensor for surface inspection and metrology |
| CN114894712B (zh) * | 2022-03-25 | 2023-08-25 | 业成科技（成都）有限公司 | 光学量测设备及其校正方法 |
| CN115451839A (zh) * | 2022-08-25 | 2022-12-09 | 中钞印制技术研究院有限公司 | 安全产品表面涂层厚度的检测方法 |
| TWI812482B (zh) * | 2022-09-23 | 2023-08-11 | 中國鋼鐵股份有限公司 | 旋轉機械系統與平衡方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4688940A (en) * | 1985-03-12 | 1987-08-25 | Zygo Corporation | Heterodyne interferometer system |
| JPS63128211A (ja) * | 1986-11-19 | 1988-05-31 | Hitachi Ltd | スペ−シング測定方法 |
| JPH0221203A (ja) * | 1988-07-09 | 1990-01-24 | Brother Ind Ltd | 位相差検出装置 |
| JP3042225B2 (ja) * | 1992-10-30 | 2000-05-15 | キヤノン株式会社 | 表面状態検査方法及びそれを用いた表面状態検査装置 |
| US5450205A (en) * | 1993-05-28 | 1995-09-12 | Massachusetts Institute Of Technology | Apparatus and method for real-time measurement of thin film layer thickness and changes thereof |
| US5548401A (en) * | 1993-08-23 | 1996-08-20 | Nippon Telegraph And Telephone Public Corporation | Photomask inspecting method and apparatus |
| FR2716531B1 (fr) * | 1994-02-18 | 1996-05-03 | Saint Gobain Cinematique Contr | Procédé de mesure d'épaisseur d'un matériau transparent. |
| CN1131741A (zh) * | 1995-03-22 | 1996-09-25 | 载歌公司 | 光学间隙测量装置和方法 |
| US6172752B1 (en) * | 1996-08-04 | 2001-01-09 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for simultaneously interferometrically measuring optical characteristics in a noncontact manner |
| FR2780778B3 (fr) * | 1998-07-03 | 2000-08-11 | Saint Gobain Vitrage | Procede et dispositif pour la mesure de l'epaisseur d'un materiau transparent |
| US6261152B1 (en) * | 1998-07-16 | 2001-07-17 | Nikon Research Corporation Of America | Heterdoyne Thickness Monitoring System |
| US6710881B1 (en) * | 1999-09-28 | 2004-03-23 | Nanyang Technological University | Heterodyne interferometry for small spacing measurement |
| US7339682B2 (en) * | 2005-02-25 | 2008-03-04 | Verity Instruments, Inc. | Heterodyne reflectometer for film thickness monitoring and method for implementing |
-
2005
- 2005-07-10 US US11/178,856 patent/US20060285120A1/en not_active Abandoned
-
2006
- 2006-02-21 WO PCT/US2006/005937 patent/WO2006093709A2/en not_active Ceased
- 2006-02-21 JP JP2007557085A patent/JP4819065B2/ja not_active Expired - Fee Related
- 2006-02-21 KR KR1020077022039A patent/KR20070110390A/ko not_active Ceased
- 2006-02-24 TW TW095106373A patent/TWI285257B/zh active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI386618B (zh) * | 2007-08-16 | 2013-02-21 | Micron Technology Inc | 用於特性化微電子工件層之厚度及表面起伏的系統和方法 |
| TWI451938B (zh) * | 2010-05-10 | 2014-09-11 | Samsung Electronics Co Ltd | 化學機械研磨設備之調節器 |
| TWI658251B (zh) * | 2017-09-26 | 2019-05-01 | 日商歐姆龍股份有限公司 | 位移測量裝置、測量系統、及位移測量方法 |
| US10444360B2 (en) | 2017-09-26 | 2019-10-15 | Omron Corporation | Displacement measurement device, measurement system, and displacement measurement method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4819065B2 (ja) | 2011-11-16 |
| JP2008533447A (ja) | 2008-08-21 |
| WO2006093709A3 (en) | 2007-05-31 |
| TW200710370A (en) | 2007-03-16 |
| KR20070110390A (ko) | 2007-11-16 |
| US20060285120A1 (en) | 2006-12-21 |
| WO2006093709A2 (en) | 2006-09-08 |
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