TWI285257B - Heterodyne reflectometer for film thickness monitoring and method for implementing - Google Patents

Heterodyne reflectometer for film thickness monitoring and method for implementing Download PDF

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Publication number
TWI285257B
TWI285257B TW095106373A TW95106373A TWI285257B TW I285257 B TWI285257 B TW I285257B TW 095106373 A TW095106373 A TW 095106373A TW 95106373 A TW95106373 A TW 95106373A TW I285257 B TWI285257 B TW I285257B
Authority
TW
Taiwan
Prior art keywords
phase shift
thickness
frequency
heterodyne
grating
Prior art date
Application number
TW095106373A
Other languages
English (en)
Chinese (zh)
Other versions
TW200710370A (en
Inventor
Arun Ananth Aiyer
Mark A Meloni
Kenneth C Harvey
Andrew Weeks Kueny
Original Assignee
Verity Instr Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/066,933 external-priority patent/US7339682B2/en
Application filed by Verity Instr Inc filed Critical Verity Instr Inc
Publication of TW200710370A publication Critical patent/TW200710370A/zh
Application granted granted Critical
Publication of TWI285257B publication Critical patent/TWI285257B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0641—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of polarization
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2290/00—Aspects of interferometers not specifically covered by any group under G01B9/02
    • G01B2290/30—Grating as beam-splitter

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
TW095106373A 2005-02-25 2006-02-24 Heterodyne reflectometer for film thickness monitoring and method for implementing TWI285257B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/066,933 US7339682B2 (en) 2005-02-25 2005-02-25 Heterodyne reflectometer for film thickness monitoring and method for implementing
US11/178,856 US20060285120A1 (en) 2005-02-25 2005-07-10 Method for monitoring film thickness using heterodyne reflectometry and grating interferometry

Publications (2)

Publication Number Publication Date
TW200710370A TW200710370A (en) 2007-03-16
TWI285257B true TWI285257B (en) 2007-08-11

Family

ID=36941619

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106373A TWI285257B (en) 2005-02-25 2006-02-24 Heterodyne reflectometer for film thickness monitoring and method for implementing

Country Status (5)

Country Link
US (1) US20060285120A1 (enExample)
JP (1) JP4819065B2 (enExample)
KR (1) KR20070110390A (enExample)
TW (1) TWI285257B (enExample)
WO (1) WO2006093709A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI386618B (zh) * 2007-08-16 2013-02-21 Micron Technology Inc 用於特性化微電子工件層之厚度及表面起伏的系統和方法
TWI451938B (zh) * 2010-05-10 2014-09-11 Samsung Electronics Co Ltd 化學機械研磨設備之調節器
TWI658251B (zh) * 2017-09-26 2019-05-01 日商歐姆龍股份有限公司 位移測量裝置、測量系統、及位移測量方法

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US7781349B2 (en) * 2005-09-12 2010-08-24 Imec Method and system for optimizing a BARC stack
US20070059849A1 (en) * 2005-09-12 2007-03-15 Interuniversitair Microelktronica Centrum (Imec) Method and system for BARC optimization for high numerical aperture applications
US7589843B2 (en) * 2005-09-27 2009-09-15 Verity Instruments, Inc. Self referencing heterodyne reflectometer and method for implementing
US20100122456A1 (en) * 2008-11-17 2010-05-20 Chen-Hua Yu Integrated Alignment and Bonding System
US8908161B2 (en) * 2011-08-25 2014-12-09 Palo Alto Research Center Incorporated Removing aluminum nitride sections
WO2013061417A1 (ja) * 2011-10-26 2013-05-02 三菱電機株式会社 膜厚測定方法
JP6079697B2 (ja) * 2013-07-11 2017-02-15 株式会社村田製作所 電子部品の厚さ測定方法、これを用いる電子部品連の製造方法、これによって製造された電子部品連、および、電子部品の検査装置
KR102292209B1 (ko) 2014-07-28 2021-08-25 삼성전자주식회사 반도체 계측 시스템 및 이를 이용한 반도체 소자의 계측 방법
WO2017211545A1 (en) * 2016-06-09 2017-12-14 Asml Netherlands B.V. Metrology apparatus
JP6800800B2 (ja) * 2017-04-06 2020-12-16 株式会社ニューフレアテクノロジー 成長速度測定装置および成長速度検出方法
JP6285597B1 (ja) * 2017-06-05 2018-02-28 大塚電子株式会社 光学測定装置および光学測定方法
TWI794416B (zh) * 2018-02-28 2023-03-01 美商賽格股份有限公司 多層堆疊結構之計量方法及干涉儀系統
DE102019104260B4 (de) * 2019-02-20 2025-09-11 Stefan Böttger Photothermisches Verfahren und Vorrichtung zur Bestimmung einer Schichtdicke einer auf ein Substrat aufgebrachten Schicht
CN110715931B (zh) * 2019-10-29 2022-04-12 上海御微半导体技术有限公司 一种透明样品缺陷自动检测方法和检测装置
KR102930188B1 (ko) * 2019-11-26 2026-02-24 하마마츠 포토닉스 가부시키가이샤 광학 유닛 및 막두께 계측 장치
US12062583B2 (en) * 2021-03-11 2024-08-13 Applied Materials Israel Ltd. Optical metrology models for in-line film thickness measurements
US11442025B1 (en) 2021-03-26 2022-09-13 Arun Anath Aiyer Optical sensor for surface inspection and metrology
CN114894712B (zh) * 2022-03-25 2023-08-25 业成科技（成都）有限公司 光学量测设备及其校正方法
CN115451839A (zh) * 2022-08-25 2022-12-09 中钞印制技术研究院有限公司 安全产品表面涂层厚度的检测方法
TWI812482B (zh) * 2022-09-23 2023-08-11 中國鋼鐵股份有限公司 旋轉機械系統與平衡方法
CN116817810B (zh) * 2023-07-03 2026-05-12 中国航发北京航空材料研究院 单晶空心工作叶片的测厚方法
CN117030660B (zh) * 2023-07-25 2026-04-28 武汉理工大学 一种测量铁电薄膜电光系数的装置

Family Cites Families (13)

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US4688940A (en) * 1985-03-12 1987-08-25 Zygo Corporation Heterodyne interferometer system
JPS63128211A (ja) * 1986-11-19 1988-05-31 Hitachi Ltd スペ−シング測定方法
JPH0221203A (ja) * 1988-07-09 1990-01-24 Brother Ind Ltd 位相差検出装置
JP3042225B2 (ja) * 1992-10-30 2000-05-15 キヤノン株式会社 表面状態検査方法及びそれを用いた表面状態検査装置
US5450205A (en) * 1993-05-28 1995-09-12 Massachusetts Institute Of Technology Apparatus and method for real-time measurement of thin film layer thickness and changes thereof
US5548401A (en) * 1993-08-23 1996-08-20 Nippon Telegraph And Telephone Public Corporation Photomask inspecting method and apparatus
FR2716531B1 (fr) * 1994-02-18 1996-05-03 Saint Gobain Cinematique Contr Procédé de mesure d'épaisseur d'un matériau transparent.
CN1131741A (zh) * 1995-03-22 1996-09-25 载歌公司 光学间隙测量装置和方法
US6172752B1 (en) * 1996-08-04 2001-01-09 Matsushita Electric Industrial Co., Ltd. Method and apparatus for simultaneously interferometrically measuring optical characteristics in a noncontact manner
FR2780778B3 (fr) * 1998-07-03 2000-08-11 Saint Gobain Vitrage Procede et dispositif pour la mesure de l'epaisseur d'un materiau transparent
US6261152B1 (en) * 1998-07-16 2001-07-17 Nikon Research Corporation Of America Heterdoyne Thickness Monitoring System
US6710881B1 (en) * 1999-09-28 2004-03-23 Nanyang Technological University Heterodyne interferometry for small spacing measurement
US7339682B2 (en) * 2005-02-25 2008-03-04 Verity Instruments, Inc. Heterodyne reflectometer for film thickness monitoring and method for implementing

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI386618B (zh) * 2007-08-16 2013-02-21 Micron Technology Inc 用於特性化微電子工件層之厚度及表面起伏的系統和方法
TWI451938B (zh) * 2010-05-10 2014-09-11 Samsung Electronics Co Ltd 化學機械研磨設備之調節器
TWI658251B (zh) * 2017-09-26 2019-05-01 日商歐姆龍股份有限公司 位移測量裝置、測量系統、及位移測量方法
US10444360B2 (en) 2017-09-26 2019-10-15 Omron Corporation Displacement measurement device, measurement system, and displacement measurement method

Also Published As

Publication number Publication date
TW200710370A (en) 2007-03-16
JP4819065B2 (ja) 2011-11-16
WO2006093709A3 (en) 2007-05-31
JP2008533447A (ja) 2008-08-21
US20060285120A1 (en) 2006-12-21
WO2006093709A2 (en) 2006-09-08
KR20070110390A (ko) 2007-11-16

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