TWI282561B - A laminate tape of anisotropic conductive films and a manufacturing method thereof - Google Patents

A laminate tape of anisotropic conductive films and a manufacturing method thereof Download PDF

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Publication number
TWI282561B
TWI282561B TW093105274A TW93105274A TWI282561B TW I282561 B TWI282561 B TW I282561B TW 093105274 A TW093105274 A TW 093105274A TW 93105274 A TW93105274 A TW 93105274A TW I282561 B TWI282561 B TW I282561B
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film
anisotropic conductive
conductive film
laminated
width
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TW093105274A
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TW200426859A (en
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Yasuhiro Suga
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Sony Chemicals Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)

Description

1282561 玖、發明說明： 【發明所屬之技術領域】 本發明係關於異向導電性膜之技術領域，特別是關於 將異向導電性膜夾於2片膜間而成之積層膜之技術領域。 【先前技術】 圖6a之符號11 〇為積層膠帶，係將含導電性粒子之異 向導電性膜112夾於底膜111及覆膜U3間而構成。 積層膠〒11 0，係以如圖61)所示之刀縫11 §等將既定 寬度的原板11 9沿寬度方向切斷而製成，由丨片原板可得 到複數條的積層膠帶11 〇。 然後，將原板11 9切斷後所得到之積層膠帶丨丨〇捲繞 成數十公尺長之捲軸狀，以供保管並運輸。 使用異向導電性膜112將半導體晶片貼附於基板時， 係將所需量之膜由捲軸拉出，先將覆膜113剝離，使異向 導電性臈112單面露出並將該面貼附於基板等’切斷後， 將底臈111剝離，再將半導體晶片等放置於異向導電 112上，並緊壓使其貼附。 、 ⑹Π77 P穴朋1示仔日-，異向 膜H2會從底膜ln及覆膜113間擠出。 圖6a之符號115表示該擠出部分，若存在該擠 不膜113無法從異向導電性膜112上剝離: 不此將異向導電性膜112從底膜 上几整剝離的問題。 先則，擠出之發生據推測係導因 程，故钭斜u ^ Ί 口於原板的切斷 子上刃118的形狀或切斷條件等進行改良。 1282561 又，切斷原板119等積層體之技術亦廣泛使用於異向 導電性膜以外領域，在該等領域對於上刀與下刃的形狀亦 嘗試進行改良。 又，本發明之關連技術有日本專利特開2〇〇1 —1 98879 號。 本發明係為解決上述先前技術之問題點而創作，目的 為提供異向導電性膜端面不會從基材膜擠出的積層膠帶。 【發明内容】 本發明之發明人等推測，如上述擠出部分115之發生 原因，係將積層膜捲繞為捲軸狀時或捲繞後將異向導電性 膜緊麼所造成。若能控㈣軸的捲繞條件或保存條件應可 防止擠出，然而卻發現到，藉由改良積層臈的構造、或改 變所使用異向導電性膜之黏度則所得之改善效果更佳。 /本發明係基於上述見解而創作，本發明之積層膠帶， 係將具有接著性之軟性樹脂中分散導電性粒子而成之異向 導電性膜以底膜及覆膜炎住而構《，該軟性樹脂☆抓二 黏度為108mPa. sec以下，且該異向導電性膜在寬度方面 的緣部分，係較底膜與覆膜在寬度方向的緣部分退縮5〇“ m以上。 本發明之積層膠帶之製造方法，係將具有接著性之軟 性樹脂中分散導電性粒子而成之異向導電性膜以底膜及覆 膜而構成積層構造原板，將該原板切斷為複數條的積 層膠ν，並將该積層膠帶捲繞，該軟性樹脂係使用於它 之站度為10 mPa . sec以下者，且設捲繞前之積層膠帶中 1282561 ”向導電丨生膜之寬度為WA(mm)、厚度為t(mm)、且底膜及 復膜覓度之較窄者為WP(mm)時，WASWPX (t - 0.002)/t。 【實施方式】 圖3之符號1 0為本發明積層膠帶之一例，在具有接著 性之軚性樹脂中分散導電性粒子而成之異向導電性膜工2， 係被夾在聚對苯二甲酸乙二醇酯製之底膜丨丨及覆膜13間 〇 °又異向導電性膜之寬度為WA(mm)、厚度為t(mm)，且 底膜及覆臈寬度之較窄者為Wp(mm)，捲繞時異向導電性膜 12壓細後之壓縮量為Q(mm)時，異向導電性膜之寬I滿足 式（1)。 WA<WPx(t- Q)/t-**(i) 依實驗觀察，當積層膠帶10捲繞為捲軸狀時，壓縮量 Q最大為2//m，故異向導電性膜12之寬度Wa最大為WpX (t - 0.002)/t以下。即，上述（1)中之Q為〇〇〇2，且異向 導電性膜12之寬度ψΑ必須滿足式。 WASWPX(t- 〇.〇〇2)/t…（2) 圖4a之符號ι〇ι、1〇2為本發明之積層膠帶，形狀為 4mmx 10mm之平面。此處所使用之底膜n、異向導電性膜 12、覆膜13之厚度分別為5〇//m、45#m、25"，且異向 導電性膜12係將既定量導電性微粒子分散於3〇它時黏度 為1 08mPa · sec以下之軟性樹脂而構成。 將積層膠帶10ι、1〇2配置於玻璃底板31上，並如圖 4b所示，蓋上玻璃製上板32後，施以荷重lkg之配重35 1282561 ，放置24小時，則異向導電性膜12會因荷重而變寬、寬 度加大。 圖4c之符號la係於23。(：放置24小時後之異向導電性 膜12見度，而lb係各試樣的覆膜丨3於4mm之部分寬度。 可預想成，經過231下放置24小時後之寬度la，會等於 積層膜10捲繞為捲軸狀保存時之異向導電性膜丨2寬度。 以施加荷重前異向導電性膜12之寬度' $ 3·9關者 作為試樣！，寬度^為3.8mm者作為試樣2,測定上述寬 度la、lb。將測定結果表示於下表卜表1中比較例係不 滿足上述⑴式之習知技術測定結果，其異向導電性膜之寬 度 WA 為 4. 0mm。 表1測定結果 ACF之寬 la 比較例 4mm A 9R A on 試樣1 3. 9mm A ΠΓ： —-- 試樣2 3. 8mm Λ：· LlU 4. 05 ^b. LX) 4.08 4. UO 4. 08 4.10 4 15 4. 03 4 La ~ Lr 擠出 0. 20 0.12 0.03~^ 上· J. XJ 〇T〇5~ Uo 0 益 4.05 105- 甙樣1中LA - LB大於〇， 膜11及覆膜13的邊緣外向擠 。因此，實際使用上沒有問題 而異向導電性膜12雖由底 出，但可以簡單剝離覆膜1 3 相 與底 由 對於此，比較例在剝離覆们3日寺，異肖導電性膜 膜11間會產生間隙，报難完整剝下覆膜13。、 該等結果可預想出 在實際使用上， 只要擠出量為 12 1282561 0. 1 mm以下則不致產生實際使用上的問題。 (實施例） 其次，說明上述積層膜1 0之製程。 圖la、圖lb及圖2a、圖2b之符號19為原板，圖ic 、圖Id及圖2a之符號10係積層膜。 原板19 ’如圖2a所示，係以寬的異向導電性膜12夾 於寬的底膜11及覆膜丨3間的狀態來捲繞為捲軸狀，從該 原板19製得積層臈10時，係將原板19由捲軸切出，使其 以固定速度在並列之複數下刃17上方行進，並依圖化所 示’將位在原板19上方的上刃18壓在覆膜13上。 此處上刃18為圓盤狀，係沿原板19的行進方向配置 ，朝原板行進方向之同方向以和原板丨9相等的速度旋轉 〇 上刃18抵接於覆膜13並施壓於覆膜13時，以軟性樹 脂構成之異向導電性膜12會被覆膜13緊壓，於是往上刃 18壓住部分的兩側退縮。 上刃18的邊緣銳利，若將上刃丨8強力緊壓於原板j 9 ，如圖lc所示，異向導電性膜12會以被覆膜13壓退的狀 態被切斷。 如圖lc所示，一旦上刀18進入原板19而形成切斷至 底膜11之狀態後，若邊使上刀丨8旋轉邊使原板丨9以固定 速度繼續行進，則異向導電性膜12，會在往上刃18切斷 部分的兩側壓退的狀態下與覆膜13及底膜^ 一起被切斷 1282561 圖6a係說明先前技術之積層膜，圖6b係說明原板之 切斷狀態。 (二）元件代表符號 10、 110 積層膜 l〇i積層膠帶 1〇2積層膠帶 11、 111 底膜 12 > 112 異向導電性膜 13、113 覆膜 16 覆膜之切斷部分 17 下刃 18、118 上刃 1 9、11 9 原板 31 玻璃底板 3 2 玻璃上板 3 4 i、3 4 2軟性樹脂 35 配重 115 擠出部分 WA異向導電性膜寬度 wp底膜與覆膜寬度較窄者之寬度 ws異向導電性膜之寬度方向端部與底膜或覆膜寬度 方向端部間之距離 T 異向導電性膜厚度

Claims (1)

  1. 拾、申請專利範園： 圆觸_總，_專觸_換本2_ 1. 一種異向導電性腺夕^册 膜之積層膠▼，係將具接著性軟性 樹脂中分散導電性粒子而成之異向導電性膜以底膜及覆膜 失住而構成，該軟性樹脂於抓之黏度為i〇8mPa . sec以 下’且該異向導電性膜在寬度方面的緣部分，係較底膜與 覆膜寬度方向的緣部分退縮5〇//m以上。 2· -種異向導電性膜之積層膠帶之製造方法，係將具 有接著性之軟性樹脂中分散導電性粒子而成之異向導電性 膜以底膜及覆膜夾住而構成積層構造原板，將該原板切斷 為複數條的積層膠帶，並將該積層膠帶捲繞而進行製造； 該軟性樹脂係使用於3(rc之黏度為l〇8mPa . sec以下 者，且設捲繞前之積層膠帶中異向導電性膜之寬 WA(_)、厚度4 t(_)、且底膜及覆膜寬度之較窄 WP(mra)時，wA^pX(卜 〇 〇〇2)/t。 … _ 拾壹、圖式：
    如次頁 12
TW093105274A 2003-03-04 2004-03-01 A laminate tape of anisotropic conductive films and a manufacturing method thereof TWI282561B (en)

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JP2003056659A JP3921452B2 (ja) 2003-03-04 2003-03-04 異方導電性フィルムの積層テープ製造方法

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KR101025369B1 (ko) * 2005-08-04 2011-03-28 히다치 가세고교 가부시끼가이샤 이방도전필름 및 그 제조방법
JP5104034B2 (ja) * 2007-05-23 2012-12-19 日立化成工業株式会社 異方導電接続用フィルム及びリール体
CN109961875B (zh) * 2017-12-22 2020-05-19 扬州腾飞电缆电器材料有限公司 一种绝缘夹持型半导电带及其制造工艺

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JP4181231B2 (ja) * 1997-04-25 2008-11-12 日立化成工業株式会社 異方導電性接着フィルムの製造法
JP2002022920A (ja) * 2000-07-04 2002-01-23 Toppan Printing Co Ltd カラーフィルタ及びその製造方法
JP2003142176A (ja) * 2001-10-31 2003-05-16 Optrex Corp 異方性導電膜構造

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WO2004078472A1 (ja) 2004-09-16
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TW200426859A (en) 2004-12-01
JP3921452B2 (ja) 2007-05-30

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