TWI274430B - Light emitting device - Google Patents
Light emitting device Download PDFInfo
- Publication number
- TWI274430B TWI274430B TW094133671A TW94133671A TWI274430B TW I274430 B TWI274430 B TW I274430B TW 094133671 A TW094133671 A TW 094133671A TW 94133671 A TW94133671 A TW 94133671A TW I274430 B TWI274430 B TW I274430B
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- illuminating
- illuminating device
- illuminant
- emitting
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 30
- 239000013078 crystal Substances 0.000 claims description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 18
- 229910052782 aluminium Inorganic materials 0.000 claims description 17
- 239000003292 glue Substances 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 230000000694 effects Effects 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 3
- 238000002347 injection Methods 0.000 claims 3
- 239000007924 injection Substances 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 claims 1
- 206010011224 Cough Diseases 0.000 claims 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims 1
- 241000283973 Oryctolagus cuniculus Species 0.000 claims 1
- 238000006124 Pilkington process Methods 0.000 claims 1
- 229920000265 Polyparaphenylene Polymers 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000008602 contraction Effects 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 239000008187 granular material Substances 0.000 claims 1
- MJIHNNLFOKEZEW-UHFFFAOYSA-N lansoprazole Chemical group CC1=C(OCC(F)(F)F)C=CN=C1CS(=O)C1=NC2=CC=CC=C2N1 MJIHNNLFOKEZEW-UHFFFAOYSA-N 0.000 claims 1
- 230000001795 light effect Effects 0.000 claims 1
- 150000004986 phenylenediamines Chemical class 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- -1 poly phenylene Polymers 0.000 claims 1
- 239000002243 precursor Substances 0.000 claims 1
- 239000012815 thermoplastic material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000012858 packaging process Methods 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 3
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 210000004508 polar body Anatomy 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009313 farming Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- OGFYIDCVDSATDC-UHFFFAOYSA-N silver silver Chemical compound [Ag].[Ag] OGFYIDCVDSATDC-UHFFFAOYSA-N 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094133671A TWI274430B (en) | 2005-09-28 | 2005-09-28 | Light emitting device |
US11/429,235 US20070069219A1 (en) | 2005-09-28 | 2006-05-08 | Light emitting device |
DE102006038099A DE102006038099A1 (de) | 2005-09-28 | 2006-08-14 | Licht emittierende Vorrichtung |
KR1020060078395A KR100863612B1 (ko) | 2005-09-28 | 2006-08-18 | 발광소자 |
JP2006262966A JP4825095B2 (ja) | 2005-09-28 | 2006-09-27 | 発光装置 |
US12/487,651 US8017964B2 (en) | 2005-09-28 | 2009-06-19 | Light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094133671A TWI274430B (en) | 2005-09-28 | 2005-09-28 | Light emitting device |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI274430B true TWI274430B (en) | 2007-02-21 |
TW200713635A TW200713635A (en) | 2007-04-01 |
Family
ID=37832775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094133671A TWI274430B (en) | 2005-09-28 | 2005-09-28 | Light emitting device |
Country Status (5)
Country | Link |
---|---|
US (2) | US20070069219A1 (ko) |
JP (1) | JP4825095B2 (ko) |
KR (1) | KR100863612B1 (ko) |
DE (1) | DE102006038099A1 (ko) |
TW (1) | TWI274430B (ko) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008154952A1 (de) * | 2007-06-18 | 2008-12-24 | Osram Gesellschaft mit beschränkter Haftung | Elektronisches bauteil und verfahren zum herstellen eines elektronischen bauteils |
KR100937136B1 (ko) * | 2007-12-24 | 2010-01-18 | (주)루미브라이트 | 복수의 패키지를 모듈화한 리드프레임을 이용한 발광다이오드 모듈 |
CN101621101A (zh) * | 2008-06-30 | 2010-01-06 | 展晶科技(深圳)有限公司 | 发光二极管及其制造方法 |
KR100989579B1 (ko) * | 2008-12-26 | 2010-10-25 | 루미마이크로 주식회사 | 칩온보드형 발광 다이오드 패키지 및 그것의 제조 방법 |
US8269248B2 (en) * | 2009-03-02 | 2012-09-18 | Thompson Joseph B | Light emitting assemblies and portions thereof |
TWI483418B (zh) | 2009-04-09 | 2015-05-01 | Lextar Electronics Corp | 發光二極體封裝方法 |
EP2346100B1 (en) * | 2010-01-15 | 2019-05-22 | LG Innotek Co., Ltd. | Light emitting apparatus and lighting system |
KR101028243B1 (ko) * | 2010-04-01 | 2011-04-11 | 엘지이노텍 주식회사 | 발광 모듈 |
KR101037508B1 (ko) * | 2010-03-25 | 2011-05-26 | 안복만 | 엘이디 실장용 회로기판 및 이의 제조방법 |
DE102010023343A1 (de) | 2010-06-10 | 2011-12-15 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterkörper, Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterkörpers und strahlungsemittierendes Halbleiterbauelement |
US8253330B2 (en) * | 2010-11-30 | 2012-08-28 | GEM Weltronics TWN Corporation | Airtight multi-layer array type LED |
TWI414714B (zh) | 2011-04-15 | 2013-11-11 | Lextar Electronics Corp | 發光二極體杯燈 |
CN102588762A (zh) * | 2011-01-06 | 2012-07-18 | 隆达电子股份有限公司 | 发光二极管杯灯 |
CN102509761A (zh) * | 2012-01-04 | 2012-06-20 | 日月光半导体制造股份有限公司 | 芯片构装 |
JP7231809B2 (ja) * | 2018-06-05 | 2023-03-02 | 日亜化学工業株式会社 | 発光装置 |
CN111584471B (zh) * | 2020-05-12 | 2022-08-16 | 深圳雷曼光电科技股份有限公司 | 显示屏及其制造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS592169A (ja) * | 1982-06-29 | 1984-01-07 | Fujitsu Ltd | 3次元画像メモリ設定装置 |
JP2000006467A (ja) * | 1998-06-24 | 2000-01-11 | Matsushita Electron Corp | 画像書込みデバイス |
JP2002134793A (ja) * | 2000-10-26 | 2002-05-10 | Omron Corp | 光素子用光学デバイス |
JP2004055168A (ja) * | 2002-07-16 | 2004-02-19 | Ichikoh Ind Ltd | Ledランプモジュール |
KR20040020240A (ko) * | 2002-08-30 | 2004-03-09 | 엘지이노텍 주식회사 | 발광다이오드 램프 및 그 제조방법 |
US7091653B2 (en) * | 2003-01-27 | 2006-08-15 | 3M Innovative Properties Company | Phosphor based light sources having a non-planar long pass reflector |
US7075225B2 (en) * | 2003-06-27 | 2006-07-11 | Tajul Arosh Baroky | White light emitting device |
JP2005071798A (ja) * | 2003-08-25 | 2005-03-17 | Seiko Epson Corp | 照明装置、電気光学装置及び電子機器 |
TWI241042B (en) * | 2004-03-11 | 2005-10-01 | Chen-Lun Hsingchen | A low thermal resistance LED device |
TWI244226B (en) * | 2004-11-05 | 2005-11-21 | Chen Jen Shian | Manufacturing method of flip-chip light-emitting device |
-
2005
- 2005-09-28 TW TW094133671A patent/TWI274430B/zh active
-
2006
- 2006-05-08 US US11/429,235 patent/US20070069219A1/en not_active Abandoned
- 2006-08-14 DE DE102006038099A patent/DE102006038099A1/de not_active Withdrawn
- 2006-08-18 KR KR1020060078395A patent/KR100863612B1/ko active IP Right Grant
- 2006-09-27 JP JP2006262966A patent/JP4825095B2/ja active Active
-
2009
- 2009-06-19 US US12/487,651 patent/US8017964B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US8017964B2 (en) | 2011-09-13 |
TW200713635A (en) | 2007-04-01 |
KR20070035951A (ko) | 2007-04-02 |
KR100863612B1 (ko) | 2008-10-15 |
US20070069219A1 (en) | 2007-03-29 |
JP2007096320A (ja) | 2007-04-12 |
JP4825095B2 (ja) | 2011-11-30 |
DE102006038099A1 (de) | 2007-03-29 |
US20090250717A1 (en) | 2009-10-08 |
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