TWI268531B - Film carrier tape for mounting electronic parts and its preparation - Google Patents

Film carrier tape for mounting electronic parts and its preparation

Info

Publication number
TWI268531B
TWI268531B TW092136925A TW92136925A TWI268531B TW I268531 B TWI268531 B TW I268531B TW 092136925 A TW092136925 A TW 092136925A TW 92136925 A TW92136925 A TW 92136925A TW I268531 B TWI268531 B TW I268531B
Authority
TW
Taiwan
Prior art keywords
carrier tape
electronic parts
mounting electronic
film carrier
tin
Prior art date
Application number
TW092136925A
Other languages
English (en)
Other versions
TW200415692A (en
Inventor
Tatsuo Kataoka
Yoshikazu Akashi
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200415692A publication Critical patent/TW200415692A/zh
Application granted granted Critical
Publication of TWI268531B publication Critical patent/TWI268531B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Electroplating Methods And Accessories (AREA)
TW092136925A 2002-12-26 2003-12-25 Film carrier tape for mounting electronic parts and its preparation TWI268531B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002377257 2002-12-26

Publications (2)

Publication Number Publication Date
TW200415692A TW200415692A (en) 2004-08-16
TWI268531B true TWI268531B (en) 2006-12-11

Family

ID=33307846

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092136925A TWI268531B (en) 2002-12-26 2003-12-25 Film carrier tape for mounting electronic parts and its preparation

Country Status (4)

Country Link
US (1) US7060364B2 (zh)
KR (1) KR100558507B1 (zh)
CN (1) CN1329979C (zh)
TW (1) TWI268531B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4178415B2 (ja) * 2002-07-04 2008-11-12 三井金属鉱業株式会社 キャリア箔付電解銅箔
US20050224977A1 (en) * 2004-01-29 2005-10-13 Yusuke Yoshimura Wiring substrate and method using the same
JP2006024902A (ja) * 2004-06-07 2006-01-26 Shinko Electric Ind Co Ltd 極細線パターンを有する配線基板の製造方法および配線基板
JP4665531B2 (ja) * 2005-01-27 2011-04-06 日立電線株式会社 配線板の製造方法
JP2007165816A (ja) * 2005-11-15 2007-06-28 Mitsui Mining & Smelting Co Ltd プリント配線基板、その製造方法およびその使用方法
EP2373133A1 (en) * 2008-12-26 2011-10-05 JX Nippon Mining & Metals Corporation Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using the rolled copper foil or electrolytic copper foil
JP5436995B2 (ja) * 2009-09-14 2014-03-05 新光電気工業株式会社 配線基板及びその製造方法
KR101148099B1 (ko) 2010-10-01 2012-05-23 엘지이노텍 주식회사 탭 테이프 및 그 제조방법
KR101944795B1 (ko) * 2012-01-25 2019-04-17 삼성전자주식회사 테이프 필름 패키지 및 그의 제조방법
US10051746B2 (en) * 2014-12-16 2018-08-14 Amphenol Corporation High-speed interconnects for printed circuit boards
CN112292473A (zh) * 2018-06-01 2021-01-29 株式会社岛津制作所 导电膜形成方法、以及配线基板的制造方法
JP7243569B2 (ja) * 2019-10-25 2023-03-22 株式会社村田製作所 インダクタ部品およびインダクタ部品内蔵基板
JP7247860B2 (ja) * 2019-10-25 2023-03-29 株式会社村田製作所 インダクタ部品
JPWO2021171551A1 (zh) * 2020-02-28 2021-09-02
JP2021141089A (ja) * 2020-02-29 2021-09-16 太陽誘電株式会社 コイル部品、回路基板及び電子機器
JP2021150512A (ja) * 2020-03-19 2021-09-27 太陽誘電株式会社 コイル部品及び電子機器
JP7294300B2 (ja) * 2020-10-28 2023-06-20 株式会社村田製作所 インダクタ部品及びインダクタ部品実装基板
TWI791303B (zh) * 2021-10-12 2023-02-01 大陸商常州欣盛半導體技術股份有限公司 載帶金屬線路的製作方法、載帶

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3585010A (en) * 1968-10-03 1971-06-15 Clevite Corp Printed circuit board and method of making same
JPH0783168B2 (ja) * 1988-04-13 1995-09-06 株式会社日立製作所 プリント板の製造方法
US5147692A (en) * 1990-05-08 1992-09-15 Macdermid, Incorporated Electroless plating of nickel onto surfaces such as copper or fused tungston
US5017271A (en) * 1990-08-24 1991-05-21 Gould Inc. Method for printed circuit board pattern making using selectively etchable metal layers
TW289900B (zh) * 1994-04-22 1996-11-01 Gould Electronics Inc
US5573845A (en) * 1994-12-09 1996-11-12 Olin Corporation Superficial coating layer having acicular structures for electrical conductors
US5863666A (en) * 1997-08-07 1999-01-26 Gould Electronics Inc. High performance flexible laminate
US5935641A (en) * 1996-10-23 1999-08-10 Texas Instruments Incorporated Method of forming a piezoelectric layer with improved texture
US6242078B1 (en) * 1998-07-28 2001-06-05 Isola Laminate Systems Corp. High density printed circuit substrate and method of fabrication
JP2002252257A (ja) * 2000-12-18 2002-09-06 Mitsui Mining & Smelting Co Ltd 半導体キャリア用フィルム及びその製造方法
US6630743B2 (en) * 2001-02-27 2003-10-07 International Business Machines Corporation Copper plated PTH barrels and methods for fabricating
KR100604819B1 (ko) * 2003-06-12 2006-07-28 삼성전자주식회사 반도체 패키지용 배선 기판, 그 제조방법 및 이를 이용한반도체 패키지

Also Published As

Publication number Publication date
KR20040058061A (ko) 2004-07-03
US20040219341A1 (en) 2004-11-04
KR100558507B1 (ko) 2006-03-07
CN1329979C (zh) 2007-08-01
US7060364B2 (en) 2006-06-13
CN1512568A (zh) 2004-07-14
TW200415692A (en) 2004-08-16

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