JPWO2021171551A1 - - Google Patents

Info

Publication number
JPWO2021171551A1
JPWO2021171551A1 JP2022502772A JP2022502772A JPWO2021171551A1 JP WO2021171551 A1 JPWO2021171551 A1 JP WO2021171551A1 JP 2022502772 A JP2022502772 A JP 2022502772A JP 2022502772 A JP2022502772 A JP 2022502772A JP WO2021171551 A1 JPWO2021171551 A1 JP WO2021171551A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022502772A
Other languages
Japanese (ja)
Other versions
JPWO2021171551A5 (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021171551A1 publication Critical patent/JPWO2021171551A1/ja
Publication of JPWO2021171551A5 publication Critical patent/JPWO2021171551A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP2022502772A 2020-02-28 2020-02-28 Pending JPWO2021171551A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/008286 WO2021171551A1 (ja) 2020-02-28 2020-02-28 金属膜付物体

Publications (2)

Publication Number Publication Date
JPWO2021171551A1 true JPWO2021171551A1 (zh) 2021-09-02
JPWO2021171551A5 JPWO2021171551A5 (zh) 2022-09-14

Family

ID=77491147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022502772A Pending JPWO2021171551A1 (zh) 2020-02-28 2020-02-28

Country Status (4)

Country Link
JP (1) JPWO2021171551A1 (zh)
CN (1) CN114929926A (zh)
TW (1) TWI765565B (zh)
WO (1) WO2021171551A1 (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09123343A (ja) * 1995-11-02 1997-05-13 Mitsui Toatsu Chem Inc 積層体
WO2019230967A1 (ja) * 2018-06-01 2019-12-05 株式会社島津製作所 導電膜形成方法、および配線基板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037257A (en) * 1997-05-08 2000-03-14 Applied Materials, Inc. Sputter deposition and annealing of copper alloy metallization
CN1329979C (zh) * 2002-12-26 2007-08-01 三井金属矿业株式会社 电子部件封装用薄膜载带及其制造方法
JP6236120B2 (ja) * 2015-06-24 2017-11-22 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6541530B2 (ja) * 2015-09-24 2019-07-10 三ツ星ベルト株式会社 ビア充填基板並びにその製造方法及び前駆体
WO2018043184A1 (ja) * 2016-08-31 2018-03-08 大日本印刷株式会社 貫通電極基板、貫通電極基板の製造方法及び実装基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09123343A (ja) * 1995-11-02 1997-05-13 Mitsui Toatsu Chem Inc 積層体
WO2019230967A1 (ja) * 2018-06-01 2019-12-05 株式会社島津製作所 導電膜形成方法、および配線基板の製造方法

Also Published As

Publication number Publication date
TW202146230A (zh) 2021-12-16
TWI765565B (zh) 2022-05-21
CN114929926A (zh) 2022-08-19
WO2021171551A1 (ja) 2021-09-02

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