TWI266878B - Acceleration sensor device - Google Patents

Acceleration sensor device

Info

Publication number
TWI266878B
TWI266878B TW094136702A TW94136702A TWI266878B TW I266878 B TWI266878 B TW I266878B TW 094136702 A TW094136702 A TW 094136702A TW 94136702 A TW94136702 A TW 94136702A TW I266878 B TWI266878 B TW I266878B
Authority
TW
Taiwan
Prior art keywords
acceleration sensor
regulation plate
support frame
protective case
circuit
Prior art date
Application number
TW094136702A
Other languages
English (en)
Other versions
TW200624811A (en
Inventor
Isao Sakaguchi
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Publication of TW200624811A publication Critical patent/TW200624811A/zh
Application granted granted Critical
Publication of TWI266878B publication Critical patent/TWI266878B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/09—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by piezoelectric pick-up
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
TW094136702A 2004-11-08 2005-10-20 Acceleration sensor device TWI266878B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004323761A JP4337099B2 (ja) 2004-11-08 2004-11-08 加速度センサ

Publications (2)

Publication Number Publication Date
TW200624811A TW200624811A (en) 2006-07-16
TWI266878B true TWI266878B (en) 2006-11-21

Family

ID=36319018

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094136702A TWI266878B (en) 2004-11-08 2005-10-20 Acceleration sensor device

Country Status (6)

Country Link
US (1) US7716984B2 (zh)
JP (1) JP4337099B2 (zh)
KR (1) KR100906573B1 (zh)
CN (1) CN101057148B (zh)
TW (1) TWI266878B (zh)
WO (1) WO2006049004A1 (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2007020701A1 (ja) * 2005-08-18 2009-02-19 株式会社シーアンドエヌ 加速度センサ装置
CN101427365B (zh) 2006-09-06 2011-06-15 日立金属株式会社 半导体传感器件的制造方法
JP5100439B2 (ja) * 2007-11-14 2012-12-19 京セラ株式会社 センサモジュール、センサ付ホイール、およびタイヤ組立体
JP2009222687A (ja) * 2008-03-19 2009-10-01 Kyocera Corp 加速度センサ装置および加速度センサ装置の製造方法
US8468887B2 (en) * 2008-04-14 2013-06-25 Freescale Semiconductor, Inc. Resonant accelerometer with low sensitivity to package stress
JP5417737B2 (ja) * 2008-04-23 2014-02-19 パナソニック株式会社 慣性力センサ
US20120133042A1 (en) 2009-05-21 2012-05-31 Panasonic Electric Works Co., Ltd. Mounting structure of chip and module using the same
JP5652775B2 (ja) 2009-05-29 2015-01-14 トレックス・セミコンダクター株式会社 加速度センサー素子およびこれを有する加速度センサー
US8371160B2 (en) * 2009-12-16 2013-02-12 Meggitt (San Juan Capistrano), Inc. Weatherized direct-mount absolute pressure sensor
KR20130016607A (ko) * 2011-08-08 2013-02-18 삼성전기주식회사 관성센서 및 그 제조방법
JP2014110369A (ja) * 2012-12-04 2014-06-12 Seiko Epson Corp ベース基板、振動子、発振器、センサー、電子デバイス、電子機器、および移動体
ITMI20122241A1 (it) * 2012-12-27 2014-06-28 St Microelectronics Srl Dispositivo elettronico integrato per il monitoraggio di sforzo meccanico all'interno di una struttura solida
RU2526789C1 (ru) * 2013-03-12 2014-08-27 Открытое акционерное общество "Научно-исследовательский институт физических измерений" Чувствительный элемент интегрального акселерометра
DE102013220908B4 (de) * 2013-10-15 2015-09-24 Continental Automotive Gmbh Sensorelement
CN103941041B (zh) * 2014-03-28 2016-08-17 武汉瑞芯科微电子技术有限公司 一种三框架结构的单质量块三轴mems加速度计
CN104392024B (zh) * 2014-10-31 2018-01-05 吉林大学 微流道加速度计感应腔设计参数的优化方法
CN104849494B (zh) * 2015-06-08 2016-11-23 鄢碧珠 一种精度可调的加速度传感器
JP6653479B2 (ja) * 2015-07-07 2020-02-26 パナソニックＩｐマネジメント株式会社 慣性力センサ
US11187761B1 (en) * 2017-11-01 2021-11-30 SeeScan, Inc. Three-axis measurement modules and sensing methods
US10732195B2 (en) 2018-01-26 2020-08-04 Honeywell International Inc. Vibrating beam accelerometer
DE102018212858A1 (de) * 2018-08-01 2020-02-06 Siemens Healthcare Gmbh Magnetresonanzeinrichtung, Magnetresonanzsystem und zugehöriges Betriebsverfahren

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2730201B2 (ja) * 1989-08-07 1998-03-25 株式会社デンソー 半導体加速度センサ
JPH04274005A (ja) 1991-03-01 1992-09-30 Nec Corp 半導体加速度センサ
JPH05119057A (ja) * 1991-10-23 1993-05-14 Nec Corp 半導体加速度センサ
JPH05223842A (ja) 1992-02-17 1993-09-03 Hitachi Ltd 加速度センサ
JP2776142B2 (ja) * 1992-05-15 1998-07-16 株式会社日立製作所 加速度センサ
JPH06242141A (ja) 1993-02-22 1994-09-02 Tokai Rika Co Ltd 半導体加速度センサ
JP3136888B2 (ja) 1994-03-08 2001-02-19 日産自動車株式会社 加速度センサの感度調整装置
JPH0815300A (ja) 1994-06-29 1996-01-19 Takata Kk 衝突検出センサ
JPH08105913A (ja) 1994-10-06 1996-04-23 Japan Aviation Electron Ind Ltd シリコン加速度計
JPH08110351A (ja) 1994-10-12 1996-04-30 Nippondenso Co Ltd 半導体力学センサ装置
JP3345649B2 (ja) 1994-12-07 2002-11-18 日本航空電子工業株式会社 シリコン加速度計
JP2658949B2 (ja) 1995-02-23 1997-09-30 日本電気株式会社 半導体加速度センサ
JP3281217B2 (ja) * 1995-05-23 2002-05-13 富士電機株式会社 半導体式加速度センサと該センサのセンサ素子の特性評価方法
US6892578B2 (en) * 2002-11-29 2005-05-17 Hitachi Metals Ltd. Acceleration sensor
JP2004198280A (ja) * 2002-12-19 2004-07-15 Hitachi Metals Ltd 加速度センサ
US20040226373A1 (en) * 2003-05-12 2004-11-18 Hitachi Metals, Ltd. Acceleration sensor device
JP4416460B2 (ja) * 2003-09-16 2010-02-17 トレックス・セミコンダクター株式会社 加速度センサー
US7562575B2 (en) * 2005-08-05 2009-07-21 Hitachi Metals, Ltd. Impact-resistant acceleration sensor

Also Published As

Publication number Publication date
CN101057148B (zh) 2010-11-10
US20090071248A1 (en) 2009-03-19
WO2006049004A1 (ja) 2006-05-11
JP2006133123A (ja) 2006-05-25
KR100906573B1 (ko) 2009-07-10
TW200624811A (en) 2006-07-16
CN101057148A (zh) 2007-10-17
JP4337099B2 (ja) 2009-09-30
KR20070085897A (ko) 2007-08-27
US7716984B2 (en) 2010-05-18

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MM4A Annulment or lapse of patent due to non-payment of fees