TWI266861B - Apparatus and method of inspecting mura-defect and method of fabricating photomask - Google Patents

Apparatus and method of inspecting mura-defect and method of fabricating photomask Download PDF

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Publication number
TWI266861B
TWI266861B TW094142753A TW94142753A TWI266861B TW I266861 B TWI266861 B TW I266861B TW 094142753 A TW094142753 A TW 094142753A TW 94142753 A TW94142753 A TW 94142753A TW I266861 B TWI266861 B TW I266861B
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TW
Taiwan
Prior art keywords
light
pattern
moiré
inspected
repeating pattern
Prior art date
Application number
TW094142753A
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English (en)
Chinese (zh)
Other versions
TW200626870A (en
Inventor
Junichi Tanaka
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of TW200626870A publication Critical patent/TW200626870A/zh
Application granted granted Critical
Publication of TWI266861B publication Critical patent/TWI266861B/zh

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95676Masks, reticles, shadow masks

Landscapes

  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW094142753A 2004-12-06 2005-12-05 Apparatus and method of inspecting mura-defect and method of fabricating photomask TWI266861B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004353249A JP4480009B2 (ja) 2004-12-06 2004-12-06 欠陥検査装置及び方法、並びにフォトマスクの製造方法

Publications (2)

Publication Number Publication Date
TW200626870A TW200626870A (en) 2006-08-01
TWI266861B true TWI266861B (en) 2006-11-21

Family

ID=36665002

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094142753A TWI266861B (en) 2004-12-06 2005-12-05 Apparatus and method of inspecting mura-defect and method of fabricating photomask

Country Status (5)

Country Link
US (1) US7724361B2 (enExample)
JP (1) JP4480009B2 (enExample)
KR (1) KR100710721B1 (enExample)
CN (1) CN100454511C (enExample)
TW (1) TWI266861B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4480001B2 (ja) * 2004-05-28 2010-06-16 Hoya株式会社 ムラ欠陥検査マスク、ムラ欠陥検査装置及び方法、並びにフォトマスクの製造方法
JP4771871B2 (ja) * 2006-06-15 2011-09-14 Hoya株式会社 パターン欠陥検査方法、パターン欠陥検査用テストパターン基板、及びパターン欠陥検査装置、並びにフォトマスクの製造方法、及び表示デバイス用基板の製造方法
CN100454006C (zh) * 2006-09-07 2009-01-21 哈尔滨工业大学 一种基于机器视觉的液晶显示器斑痕缺陷检测方法与系统
KR100850113B1 (ko) * 2006-12-27 2008-08-04 동부일렉트로닉스 주식회사 포토 레지스트 패턴의 결함 검출 방법
JP2008170371A (ja) * 2007-01-15 2008-07-24 Hoya Corp パターン欠陥検査方法、及びパターン欠陥検査装置
KR100945918B1 (ko) * 2007-02-02 2010-03-05 주식회사 하이닉스반도체 마스크 결함 검사 방법 및 검사 장치
KR101702887B1 (ko) 2007-04-18 2017-02-06 마이크로닉 마이데이타 에이비 무라 검출 및 계측을 위한 방법 및 장치
KR100892486B1 (ko) 2007-08-01 2009-04-10 경희대학교 산학협력단 다층 주기 구조물의 물리량 산출 방법
KR100902877B1 (ko) 2007-11-15 2009-06-16 (주)티이에스 반도체 제조용 마스크의 크롬면 감지장치
KR100980329B1 (ko) * 2008-04-22 2010-09-06 한국표준과학연구원 기판 결함 검출용 적외선 검사 장치의 보정을 위한 기준패턴 제조 장치 및 그를 이용한 제조 방법
KR20130051796A (ko) * 2011-11-10 2013-05-21 (주)쎄미시스코 기판 검사장치
CN103969853B (zh) * 2013-02-05 2016-06-01 北京京东方光电科技有限公司 阵列基板及其检测方法和检测装置
JP5777068B2 (ja) * 2013-03-01 2015-09-09 レーザーテック株式会社 マスク評価装置
WO2014140047A2 (en) 2013-03-12 2014-09-18 Micronic Mydata AB Method and device for writing photomasks with reduced mura errors
EP2972589B1 (en) 2013-03-12 2017-05-03 Micronic Mydata AB Mechanically produced alignment fiducial method and alignment system
KR102242559B1 (ko) 2014-12-01 2021-04-20 삼성전자주식회사 광학 검사 장치
CN104914133B (zh) * 2015-06-19 2017-12-22 合肥京东方光电科技有限公司 摩擦缺陷检测装置
JP6436883B2 (ja) * 2015-09-11 2018-12-12 東芝メモリ株式会社 欠陥検査方法及び欠陥検査装置
CN105628344B (zh) * 2016-01-29 2019-02-01 深圳英伦科技股份有限公司 背光模组及其透光均匀性检测系统及其led混珠搭配方法
CN105549240B (zh) * 2016-03-11 2018-09-21 京东方科技集团股份有限公司 液晶显示器件的水波纹等级的测量方法和装置
US10446423B2 (en) * 2016-11-19 2019-10-15 Applied Materials, Inc. Next generation warpage measurement system
KR101937187B1 (ko) * 2017-05-11 2019-01-14 주식회사 에이치비테크놀러지 필름표면의 불량 검출 장치
US10983430B2 (en) 2018-02-22 2021-04-20 Taiwan Semiconductor Manufacturing Company, Ltd. Mask assembly and haze acceleration method
KR102580487B1 (ko) * 2018-06-18 2023-09-21 주식회사 케이씨텍 패드 모니터링 장치 및 이를 포함하는 패드 모니터링 시스템, 패드 모니터링 방법
CN109814328B (zh) * 2019-03-28 2022-06-10 京东方科技集团股份有限公司 虚拟掩膜板、掩膜板及其制作方法
CN109916657A (zh) * 2019-04-25 2019-06-21 天津益三友色母料有限公司 色母料取样检测装置

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JPH0480762A (ja) * 1990-07-23 1992-03-13 Canon Inc 位置検出装置及びその検出方法
KR100203530B1 (ko) 1994-09-16 1999-06-15 니시무로 타이죠 결함검사장치
US5790247A (en) * 1995-10-06 1998-08-04 Photon Dynamics, Inc. Technique for determining defect positions in three dimensions in a transparent structure
JP3921554B2 (ja) * 1997-01-20 2007-05-30 積水化学工業株式会社 折り畳みコンテナ
JPH10300447A (ja) 1997-04-23 1998-11-13 K L Ee Akurotetsuku:Kk 表面パターンむら検出方法及び装置
US6482557B1 (en) * 2000-03-24 2002-11-19 Dupont Photomasks, Inc. Method and apparatus for evaluating the runability of a photomask inspection tool
US6919957B2 (en) * 2000-09-20 2005-07-19 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimen
JP3615181B2 (ja) * 2001-11-06 2005-01-26 株式会社東芝 露光装置の検査方法、焦点位置を補正する露光方法、および半導体装置の製造方法

Also Published As

Publication number Publication date
US20060158642A1 (en) 2006-07-20
KR20060063732A (ko) 2006-06-12
CN100454511C (zh) 2009-01-21
JP2006162891A (ja) 2006-06-22
TW200626870A (en) 2006-08-01
JP4480009B2 (ja) 2010-06-16
US7724361B2 (en) 2010-05-25
KR100710721B1 (ko) 2007-04-23
CN1786698A (zh) 2006-06-14

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