TWI266378B - Baking apparatus, heat treatment method, manufacturing method of semiconductor device and pattern forming method - Google Patents
Baking apparatus, heat treatment method, manufacturing method of semiconductor device and pattern forming methodInfo
- Publication number
- TWI266378B TWI266378B TW093105904A TW93105904A TWI266378B TW I266378 B TWI266378 B TW I266378B TW 093105904 A TW093105904 A TW 093105904A TW 93105904 A TW93105904 A TW 93105904A TW I266378 B TWI266378 B TW I266378B
- Authority
- TW
- Taiwan
- Prior art keywords
- pattern
- heat treatment
- substrate
- hot plate
- resist
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003059399A JP3923023B2 (ja) | 2003-03-06 | 2003-03-06 | パターン形成方法および該パターン形成方法を用いた半導体装置の製造方法 |
JP2003112928A JP3797979B2 (ja) | 2003-04-17 | 2003-04-17 | ベーキング装置並びにそれを用いる基板の熱処理方法及び半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200425372A TW200425372A (en) | 2004-11-16 |
TWI266378B true TWI266378B (en) | 2006-11-11 |
Family
ID=33512858
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093105904A TWI266378B (en) | 2003-03-06 | 2004-03-05 | Baking apparatus, heat treatment method, manufacturing method of semiconductor device and pattern forming method |
TW094121975A TWI260691B (en) | 2003-03-06 | 2004-03-05 | Pattern forming method and method of manufacturing semiconductor device using the same |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094121975A TWI260691B (en) | 2003-03-06 | 2004-03-05 | Pattern forming method and method of manufacturing semiconductor device using the same |
Country Status (2)
Country | Link |
---|---|
US (2) | US20040253551A1 (zh) |
TW (2) | TWI266378B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100564579B1 (ko) * | 2003-09-29 | 2006-03-28 | 삼성전자주식회사 | 레지스트 리플로우 측정 키 및 이를 이용한 반도체 소자의미세 패턴 형성 방법 |
US7345309B2 (en) * | 2004-08-31 | 2008-03-18 | Lockheed Martin Corporation | SiC metal semiconductor field-effect transistor |
US20060222975A1 (en) * | 2005-04-02 | 2006-10-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated optical metrology and lithographic process track for dynamic critical dimension control |
JP5065082B2 (ja) * | 2008-02-25 | 2012-10-31 | 東京エレクトロン株式会社 | 基板の処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム |
US11222783B2 (en) | 2017-09-19 | 2022-01-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Using cumulative heat amount data to qualify hot plate used for postexposure baking |
KR20200021818A (ko) * | 2018-08-21 | 2020-03-02 | 세메스 주식회사 | 가열 플레이트, 이를 구비하는 기판 열처리 장치 및 가열 플레이트의 제조 방법 |
JP7208813B2 (ja) * | 2019-02-08 | 2023-01-19 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
CN113223937B (zh) * | 2021-04-21 | 2022-08-16 | 华虹半导体(无锡)有限公司 | 检测barc热板烘烤形成的挥发物的方法 |
CN116533308B (zh) * | 2023-07-06 | 2023-09-15 | 赣州市超跃科技有限公司 | 一种pcb切割监测系统、方法、装置及存储介质 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW277139B (zh) * | 1993-09-16 | 1996-06-01 | Hitachi Seisakusyo Kk | |
US5885353A (en) * | 1996-06-21 | 1999-03-23 | Micron Technology, Inc. | Thermal conditioning apparatus |
JP3516392B2 (ja) * | 2000-06-16 | 2004-04-05 | イビデン株式会社 | 半導体製造・検査装置用ホットプレート |
KR100412262B1 (ko) * | 2001-01-31 | 2003-12-31 | 삼성전자주식회사 | 베이크 장치 |
US6495802B1 (en) * | 2001-05-31 | 2002-12-17 | Motorola, Inc. | Temperature-controlled chuck and method for controlling the temperature of a substantially flat object |
KR101018259B1 (ko) * | 2002-09-10 | 2011-03-03 | 액셀리스 테크놀로지스, 인크. | 일정 온도 척을 사용하여 가변 온도 프로세스로 기판을 가열하는 방법 |
JP4047826B2 (ja) * | 2004-03-25 | 2008-02-13 | 東京エレクトロン株式会社 | 縦型熱処理装置及び移載機構の自動教示方法 |
CN1702849A (zh) * | 2004-05-26 | 2005-11-30 | 松下电器产业株式会社 | 温度异常检测方法及半导体制造装置 |
US7427728B2 (en) * | 2006-07-07 | 2008-09-23 | Sokudo Co., Ltd. | Zone control heater plate for track lithography systems |
US20090034581A1 (en) * | 2007-08-02 | 2009-02-05 | Tokyo Electron Limited | Method for hot plate substrate monitoring and control |
-
2004
- 2004-03-05 TW TW093105904A patent/TWI266378B/zh not_active IP Right Cessation
- 2004-03-05 US US10/792,863 patent/US20040253551A1/en not_active Abandoned
- 2004-03-05 TW TW094121975A patent/TWI260691B/zh not_active IP Right Cessation
-
2007
- 2007-10-11 US US11/907,352 patent/US20080096142A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20040253551A1 (en) | 2004-12-16 |
TW200425372A (en) | 2004-11-16 |
TWI260691B (en) | 2006-08-21 |
US20080096142A1 (en) | 2008-04-24 |
TW200539305A (en) | 2005-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |