TWI266378B - Baking apparatus, heat treatment method, manufacturing method of semiconductor device and pattern forming method - Google Patents

Baking apparatus, heat treatment method, manufacturing method of semiconductor device and pattern forming method

Info

Publication number
TWI266378B
TWI266378B TW093105904A TW93105904A TWI266378B TW I266378 B TWI266378 B TW I266378B TW 093105904 A TW093105904 A TW 093105904A TW 93105904 A TW93105904 A TW 93105904A TW I266378 B TWI266378 B TW I266378B
Authority
TW
Taiwan
Prior art keywords
pattern
heat treatment
substrate
hot plate
resist
Prior art date
Application number
TW093105904A
Other languages
English (en)
Other versions
TW200425372A (en
Inventor
Tsuyoshi Shibata
Yuji Kobayashi
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003059399A external-priority patent/JP3923023B2/ja
Priority claimed from JP2003112928A external-priority patent/JP3797979B2/ja
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of TW200425372A publication Critical patent/TW200425372A/zh
Application granted granted Critical
Publication of TWI266378B publication Critical patent/TWI266378B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW093105904A 2003-03-06 2004-03-05 Baking apparatus, heat treatment method, manufacturing method of semiconductor device and pattern forming method TWI266378B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003059399A JP3923023B2 (ja) 2003-03-06 2003-03-06 パターン形成方法および該パターン形成方法を用いた半導体装置の製造方法
JP2003112928A JP3797979B2 (ja) 2003-04-17 2003-04-17 ベーキング装置並びにそれを用いる基板の熱処理方法及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW200425372A TW200425372A (en) 2004-11-16
TWI266378B true TWI266378B (en) 2006-11-11

Family

ID=33512858

Family Applications (2)

Application Number Title Priority Date Filing Date
TW094121975A TWI260691B (en) 2003-03-06 2004-03-05 Pattern forming method and method of manufacturing semiconductor device using the same
TW093105904A TWI266378B (en) 2003-03-06 2004-03-05 Baking apparatus, heat treatment method, manufacturing method of semiconductor device and pattern forming method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW094121975A TWI260691B (en) 2003-03-06 2004-03-05 Pattern forming method and method of manufacturing semiconductor device using the same

Country Status (2)

Country Link
US (2) US20040253551A1 (zh)
TW (2) TWI260691B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100564579B1 (ko) * 2003-09-29 2006-03-28 삼성전자주식회사 레지스트 리플로우 측정 키 및 이를 이용한 반도체 소자의미세 패턴 형성 방법
US7345309B2 (en) * 2004-08-31 2008-03-18 Lockheed Martin Corporation SiC metal semiconductor field-effect transistor
US20060222975A1 (en) * 2005-04-02 2006-10-05 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated optical metrology and lithographic process track for dynamic critical dimension control
JP5065082B2 (ja) * 2008-02-25 2012-10-31 東京エレクトロン株式会社 基板の処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム
US11222783B2 (en) 2017-09-19 2022-01-11 Taiwan Semiconductor Manufacturing Co., Ltd. Using cumulative heat amount data to qualify hot plate used for postexposure baking
KR20200021818A (ko) * 2018-08-21 2020-03-02 세메스 주식회사 가열 플레이트, 이를 구비하는 기판 열처리 장치 및 가열 플레이트의 제조 방법
JP7208813B2 (ja) * 2019-02-08 2023-01-19 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN113223937B (zh) * 2021-04-21 2022-08-16 华虹半导体(无锡)有限公司 检测barc热板烘烤形成的挥发物的方法
CN116533308B (zh) * 2023-07-06 2023-09-15 赣州市超跃科技有限公司 一种pcb切割监测系统、方法、装置及存储介质

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW277139B (zh) * 1993-09-16 1996-06-01 Hitachi Seisakusyo Kk
US5885353A (en) * 1996-06-21 1999-03-23 Micron Technology, Inc. Thermal conditioning apparatus
JP3516392B2 (ja) * 2000-06-16 2004-04-05 イビデン株式会社 半導体製造・検査装置用ホットプレート
KR100412262B1 (ko) * 2001-01-31 2003-12-31 삼성전자주식회사 베이크 장치
US6495802B1 (en) * 2001-05-31 2002-12-17 Motorola, Inc. Temperature-controlled chuck and method for controlling the temperature of a substantially flat object
WO2004025710A2 (en) * 2002-09-10 2004-03-25 Axcelis Technologies, Inc. Method of heating a substrate in a variable temperature process using a fixed temperature chuck
JP4047826B2 (ja) * 2004-03-25 2008-02-13 東京エレクトロン株式会社 縦型熱処理装置及び移載機構の自動教示方法
CN1702849A (zh) * 2004-05-26 2005-11-30 松下电器产业株式会社 温度异常检测方法及半导体制造装置
US7427728B2 (en) * 2006-07-07 2008-09-23 Sokudo Co., Ltd. Zone control heater plate for track lithography systems
US20090034581A1 (en) * 2007-08-02 2009-02-05 Tokyo Electron Limited Method for hot plate substrate monitoring and control

Also Published As

Publication number Publication date
TWI260691B (en) 2006-08-21
TW200425372A (en) 2004-11-16
US20080096142A1 (en) 2008-04-24
US20040253551A1 (en) 2004-12-16
TW200539305A (en) 2005-12-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees