TWI265906B - Substrate transporting apparatus and substrate processing apparatus - Google Patents

Abstract

Disclosed is a substrate transporting apparatus having a second and a third inner substrate transporting devices (120) (130) that include a pair of substrate transporting portions (120a), (120b), (130a), (130b) in parallel arrangement and spaced by a horizontal transportation path. The substrate transporting portion comprises: support members (111a), (111b) and transporting arm members (122a), (122b) for supporting peripheries of the substrates (G), an arm interval regulating mechanism (123) for regulating intervals between the transporting arm members, and an arm sliding mechanism (125) causing the arm interval regulating mechanism to slide towards the direction for transporting the substrates. When the objects to be transported are not substrates, intervals between the transporting arm members (122a), (122b) are reduced to cause the second inner substrate transporting device (130) to recede to a location between an anti-corrosion agent applicator (CT) (23a) and a reduced-pressure dehydrating device (VD) so as to reduce the space to be occupied by the apparatus.

Description

1265906 (1) Technical Field of the Invention The present invention relates to a substrate transfer device for transporting a large-sized glass substrate in the manufacture of a liquid crystal display device (LCD), and a substrate process including the substrate transfer device. Device. [Prior Art] In the photolithography process of an LCD, a resist film is formed on a glass substrate for LCD (hereinafter referred to as "LCD substrate" or "substrate"), and the resist film is exposed, developed, and then formed into a predetermined film. Circuit pattern. The resist film is formed on the substrate by a so-called spin coating method. The spin coating method is a spin chuck in which a substrate is adsorbed and held in a resisting coating unit in a slightly horizontal posture, and a resist liquid is supplied to the center of the substrate, and the substrate is rotated by a spin chuck to cause etching. The liquid diffuses to the entire upper surface of the substrate. Next, the substrate is transferred from the resist coating unit to the resist removing unit (edge processing device), and the resist removing unit removes an unnecessary resist film from the peripheral portion of the substrate. Further, the substrate is transferred to a heating unit, heated to a predetermined temperature, and the solvent in the resist film is volatilized to stabilize the resist film. The conveyance of the substrate from the resist coating unit to the uranium-removing agent removal unit is performed by a dedicated substrate transfer device. The substrate transfer device is provided with a pair of transfer arms for holding the periphery of the substrate. The distance between the resist applying unit and the resist removing unit is set to a distance at which the transport arm can retreat when the transport arm does not transport the non-substrate carrying the substrate. -4 - (2) 1265906 In recent years, as a purpose of manufacturing a large-screen liquid crystal TV, a large-sized LCD substrate in which one side exceeds 1 m is used as a processing target. Specifically, the size of the substrate is increased from 850x1000mm to 1000x1200mm. In order to transport such an ultra-large substrate, it is necessary to expand the width and interval of the transfer arm of the substrate transfer device. If the width or spacing of the transfer arms is to be expanded without the transfer arm affecting the surrounding components within the transfer path, the distance from the resist application unit to the resist removal unit must be further expanded (resist coating) The intermediate standby space of the substrate transfer device during the coating or resist removal process). However, if the distance between the resist coating/resist removing units is increased, the size of the device will increase, and the floor area (grounding area) in the cleaning chamber in the device will increase. problem. On the other hand, the cleaning chamber for the manufacture of LCDs is extremely large, so it is difficult to make the ground area of the device larger. On the other hand, as a problem in the manufacture of an LCD, there is a so-called "transfer trace" of a screen defect on the screen of the final product. The transfer mark is such that when the support member such as the vacuum suction pad is brought into contact with the back surface of the substrate coated with the resist, the film thickness of the resist is locally affected by the influence of the heat caused by the contact. In the case of a change, an image defect occurs at a position corresponding to the film thickness variation region. The problem of the transfer mark is described in detail in the U.S. Patent No. 5 3 0 64 5 5 B1. In order to prevent the occurrence of such a transfer mark, the transfer arm (vacuum suction seat, etc.) of the substrate transfer device is not allowed to contact the central portion of the back surface of the substrate (corresponding to the portion of the liquid crystal display), and the transfer arm must be Contacting from the outer peripheral end of the substrate by -5-(3) 1265906 is limited to 15 mm to be limited to the peripheral rigidity of the substrate, and there is insufficient transport of the large-sized base on the transport arm. [Invention] The ground contact area at the substrate of the device of the present invention) In the case of the rectangular substrate of the present invention, the rectangular substrate is used to change the configuration, and when the movable adjustment mechanism is transported along the arm member, the interval is narrower. The narrow range of water in the rectangular substrate of the present invention. However, if the edge portion of the support portion is contacted, the substrate tends to be displaced from the position during the transfer or during transportation as the size of the substrate increases. Therefore, it is necessary to be able to safely and reliably. It is an object of the present invention to provide a substrate transfer device and a device having the same, which is capable of safely and reliably transporting a large area without causing a transfer mark without causing a transfer mark. The two transfer arm members having the shape of the pair of peripheral edges are attached to the back surface of the rectangular substrate and are used to hold the holding portion and movably support the two transfer arm members. The arm spacing adjusting mechanism that supports the arm spacing adjusting mechanism and the arm sliding mechanism that moves the arm to the horizontal conveying path; and the adjusting mechanism adjusts the two conveying intervals to be suitable for the rectangular shape during transportation The second processing viewpoint of the size of the substrate is not the case where the two transfer arm members are spaced apart from each other, and the substrate processing apparatus includes a conveyance flat conveyance path and is provided along the horizontal conveyance path, -6 - (4) 1265906 A first processing unit that performs a predetermined process on a rectangular substrate, and is disposed along the horizontal transport path, and a rectangular substrate a second processing unit that performs a predetermined process and a pair of board conveying units that are disposed substantially symmetrically with respect to each other across the horizontal transport path, and the above-described first processing unit and the second processing unit The substrate processing unit of the substrate transfer device that holds the rectangular substrate in a horizontal direction and transports the rectangular substrate along the horizontal conveyance path, and the substrate conveyance unit includes a shape corresponding to the circumference of the rectangular substrate The two transfer arm members are attached to the transfer arm member, abutting against the rear surface of the rectangular substrate, and holding the holding portion of the rectangular substrate, and movably supporting the two transfer arm members for changing the two An arm spacing adjusting mechanism that is spaced apart from each other, and an arm sliding mechanism that movably supports the arm spacing adjusting mechanism to move the arm spacing adjusting mechanism along the horizontal conveying path; and the arm spacing adjusting mechanism is configured to convey Adjusting the mutual spacing of the two transfer arm members to fit the rectangular substrate When the container is not transported, the distance between the two transfer arm members is narrower than the interval between the two transport arm members. When the arm slide mechanism is not transported, the two transport arm members that are spaced apart from each other are retracted to Between the first processing unit and the second processing unit, the substrate transfer device and the substrate processing device according to the present invention can adjust the distance between the two transfer arm members in the substrate transport direction. The interval between the two transport arm members can be reduced to retract the (5) 1265906 to a predetermined position, thereby reducing the space required for the evacuation of the transport arm member, and reducing the floor area of the entire device. In the case of the substrate transfer device, when changing the size of the substrate to be transported, the distance between the transfer arm members can be easily adjusted by matching the size of the substrate. Therefore, it is not necessary to change the size of the substrate every time, as in the conventional method, the operator has to It is such a complicated process that the installation position is changed so that the mutual spacing of the conveyance arm members becomes a predetermined interval. According to a third aspect of the present invention, a substrate transfer device includes: a transfer arm member having a shape corresponding to a peripheral edge of a rectangular substrate; and a transfer arm member attached to the rear surface of the rectangular substrate to hold the substrate a holding portion of the rectangular substrate, the movable arm member is movably supported, and the transport arm member is moved in a direction perpendicular to the transport path, and an arm position adjusting mechanism that advances and retracts the transport arm member with respect to the substrate and movably supports the arm member An arm position adjusting mechanism that moves the arm position adjusting mechanism along the horizontal conveying path; and the arm position adjusting mechanism transmits one of the carrying arm members and the other carrying arm member during transportation The mutual spacing is adjusted to be suitable for the size of the rectangular substrate, and the distance between the transfer arm members is narrower than the interval during transportation when not being conveyed. According to a fourth aspect of the present invention, a substrate processing apparatus includes: a horizontal conveyance path for transporting a rectangular substrate; a first processing unit provided along the horizontal conveyance path to perform predetermined processing on the rectangular substrate; and the horizontal conveyance path along the horizontal conveyance path Providing a second processing unit that performs a predetermined process on the rectangular substrate, and a pair of substrate transporting portions that are disposed substantially symmetrically with respect to (6) 1265906 via the horizontal transport path, by the first processing unit The substrate processing device of the substrate transfer device in which the pair of substrate transporting portions between the second processing units and the rectangular substrate are held in a horizontal direction and transported along the horizontal transport path, the substrate transporting unit includes: a transport arm member having a shape corresponding to a peripheral edge of a rectangular substrate, and a transport arm member attached to the rear surface of the rectangular substrate and holding the transport arm member, and movably supporting the transport arm member The transport arm member moves in a direction perpendicular to the transport path, and the transport is performed An arm position adjusting mechanism for advancing and retracting the arm member with respect to the substrate, and an arm sliding mechanism that movably supports the arm position adjusting mechanism to move the arm position adjusting mechanism along the horizontal conveying path; and the arm position adjusting mechanism is conveyed The distance between the one of the transport arm members and the other of the transport arm members is adjusted to be suitable for the size of the rectangular substrate, and the distance between the transport arm members is greater than the interval during transport when not being transported. The expansion causes the transport arm member to be retracted from the horizontal transport path. According to the substrate transfer device and the substrate processing device according to the third and fourth aspects, the distance between the first processing unit and the second processing unit can be shortened by retracting the transport arm member in a direction perpendicularly intersecting the substrate transport direction. In this way, the floor area of the device can be reduced. Such a substrate transfer device is suitably used, for example, in a space in a direction perpendicular to the substrate conveyance direction, and the first processing portion is wider than the second processing portion. According to a fifth aspect of the present invention, a substrate processing apparatus includes: a horizontal conveyance path for transporting a -9-(7) 1265906 rectangular substrate; and a first processing unit for performing a predetermined process on the rectangular substrate along the horizontal conveyance path. a second processing unit that performs a predetermined process on the rectangular substrate along the horizontal transport path, and a third processing unit that is provided along the horizontal transport path and performs another predetermined process on the rectangular substrate, and has a level interposed therebetween The pair of first substrate conveying portions that are disposed to face each other in a substantially symmetrical manner, and the rectangular substrate is held horizontally by the pair of first substrate conveying portions between the first processing unit and the second processing unit a first substrate transfer device that transports the same along the horizontal conveyance path, and a pair of second substrate conveyance portions that are disposed substantially symmetrically with respect to each other across the horizontal conveyance path, by the second processing unit The pair of second substrate conveying portions between the third processing portions hold the rectangular substrate slightly horizontally and along the above The substrate processing apparatus of the second substrate transporting apparatus that transports the flat transport path, the first substrate transporting unit includes a first transport arm member having a shape corresponding to a peripheral edge of the rectangular substrate, and is attached to the first The transport arm member abuts against the rear surface of the peripheral edge of the rectangular substrate, holds the holding portion of the rectangular substrate, and movably supports the first transfer arm member to face the first transfer arm member perpendicularly intersecting the transport path An arm position adjusting mechanism that moves the first transfer arm member forward and backward with respect to the substrate, and an arm slide mechanism that movably supports the arm position adjusting mechanism to move the arm position adjusting mechanism along the horizontal conveyance path; The board conveyance unit includes two second conveyance arm members having a shape corresponding to a peripheral edge of the rectangular substrate, and is attached to the second −10 (8) 1265906 conveyance arm member to abut against the periphery of the rectangular substrate. a rear surface for holding the rectangular substrate, and movably supporting the first transfer arm member a second arm slide mechanism that changes a distance between the second transfer arm members and a second arm slide mechanism that movably supports the arm interval adjustment mechanism to move the arm interval adjustment mechanism along the horizontal conveyance path; The mechanism adjusts the distance between the first transfer arm member on one side and the first transfer arm member on the other side to be suitable for the size of the rectangular substrate during transportation, and the first transfer is performed when not being transported. The distance between the arm members is increased more than the interval between the transporting members to retract the first transport arm member from the horizontal transport path, and the arm spacing adjusting mechanism transfers the two transport arm members to each other during transport. The interval is adjusted to be suitable for the size of the rectangular substrate, and when the non-transporting is performed, the interval between the two transfer arm members is narrower than the interval between the conveyance, and the second transfer arm member is retracted to the second processing unit and the Between the third processing units. [Embodiment]

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is suitable for applying a resist liquid to a substrate for a liquid crystal display device (LCD) (hereinafter referred to as "LCD substrate" or "substrate") to form an anti-uranium film" and then maintaining resistance under reduced pressure. The resist film is dried, and then the unnecessary resist film formed on the periphery of the LCD substrate is removed, and in the case of performing such a series of resist coating processing units, it is intended to be provided with such a resist coating. The processing unit is applied, and the resist application and development processing device from the rinsing of the LCD -11 - (9) 1265906 substrate to the resist coating treatment to the development processing is performed in a consistent manner. Fig. 1 is a plan view showing a schematic structure of a resist coating/development processing system. The uranium-improving agent application/development processing system 100 includes a cassette unit (porting/receiving unit) 1 for mounting a cassette C for accommodating a plurality of substrates G, and is provided with a resist for the substrate G. The processing unit 2 of the processing unit of the plurality of processing units in which the agent is applied and developed in series, and the interface portion 3 for receiving the substrate G between the exposure unit 4 and the processing unit 2 are respectively The cassette portion 1 and the interface portion 3 are disposed. On the other hand, in Fig. 1, the long axis direction of the uranium-improving agent coating/development processing system 1 is the X direction, and the direction perpendicular to the X direction on the plane is the Y direction. The cassette unit 1 includes a mounting table 9 on which the cassette C can be placed in the Y direction, and a transport device 1 for carrying out the loading and unloading of the substrate G between the processing unit 2 and the mounting unit 2 9 Carrying the cassette C between the outside and the outside. The transport device 11 includes a substrate transport picker 11a, and is movable between the transport path 10 provided along the arrangement direction of the cassette C, that is, the Y direction, and is carried out between the cassette C and the processing unit 2 by the substrate transport pickup 11a. The substrate G is carried in and out. The processing unit 2 basically has parallel two-row transport lines A·B for transporting the substrate G extending in the X direction, and is arranged along the transport line A from the cassette portion 1 side toward the dielectric surface portion 3, and is arranged with gas washing and washing. A processing unit (S CR ) 21, a first heat treatment unit 26, a resist coating processing unit 23, and a second heat treatment unit 27. Further, along the transport line B, from the interfacial portion 3 toward the cassette portion 1, there are arranged: a second heat treatment unit 27, a development processing unit (-12-(10) 1265906 DEV) 24, and an i-line UV irradiation unit (i) -UV) 25 and a third heat treatment unit 28. A part of the gas scrubbing treatment unit (SCR) 21 is provided with an excimer UV irradiation unit (e-UV) 22. The excimer UV irradiation unit (e-UV) 22 is an organic substance that is first provided to remove the substrate G during the gas washing and rinsing process, and the i-line UV irradiation unit (i-UV is set to perform decolorization processing for development). The gas washing and rinsing processing unit (SCR) 21, in which the substrate G is subjected to a rinsing process and a drying process while being conveyed in a horizontal posture. Similarly, in the development processing unit (DEV) 24, in the process The middle substrate G is subjected to development processing, rinsing processing, and drying processing while being conveyed in a horizontal posture. In the gas washing and rinsing processing unit (S CR ) 2 1 and the development processing unit (DEV) 24, the substrate G is transported. For example, it is carried out by roller conveyance or belt conveyance, and the conveyance port and the discharge port of the substrate G are disposed on the opposite short sides. The conveyance of the substrate G toward the i-line UV irradiation unit (i-UV) 25 is The same mechanism as that of the transport mechanism of the development processing unit (DEV) 24 is continuously performed.

The resist coating processing unit 23 is sequentially disposed such that the resist is dropped down to the substrate G held at a slight level, and the resist G is expanded to the substrate by rotating the substrate G at a predetermined number of revolutions. a resist coating apparatus (CT) 23a for forming a resist film, a vacuum drying apparatus (VD) 23b for drying a resist film formed on the substrate G under reduced pressure, and A peripheral resist removal device (ER • 13-(11) 1265906 ) 23c ° by a solvent discharge head that can scan the periphery of the substrate G to remove excess resist adhering to the periphery of the substrate G The inside of the application processing unit 23 is in communication with a device handling unit (PASS) 65 provided in a heat treatment unit block (TB) 32 to be described later, and a device handling unit (PASS) provided in the heat treatment unit block (TB) 34. The substrate conveyance from the equipment handling unit (PASS) 65 to the resist coating apparatus (CT) 23a is performed by the first internal substrate conveying apparatus 1 1 (refer to Fig. 5) from the resist coating. The substrate transport from the apparatus (CT) 23a to the vacuum drying apparatus (VD) 23b is performed by the second internal substrate transporting apparatus 120, and from the vacuum drying apparatus (VD) 23b to the peripheral resist removing apparatus (ER). The substrate transfer of 23c is performed by the third internal substrate transfer device 130, and the substrate transfer from the peripheral resist removal device (ER) 23c to the device transfer unit (PASS) 69 is performed by the fourth internal substrate. The conveying device 140 performs. The first heat treatment unit 26 is two heat treatment unit blocks (TB) 3 1 and 3 2 having a heat treatment unit for performing heat treatment on the substrate G, and the heat treatment unit block (TB ) 3 1 is set. On the side of the resist coating processing unit 23. A first handling device 33 is disposed between the two heat treatment unit blocks (TB) 31, 32. As shown in Fig. 2, the heat treatment unit block (TB) 31 of the first heat treatment unit 26 is a four-stage structure which is sequentially stacked from below, and is a device handling unit for receiving the substrate G. (PASS) 61. Two dehydration baking units (DHP) 62 and 63 for deicing and baking the substrate G, and a adhesion enhancer coating unit (AD) 64 for hydrophobizing the substrate G. The heat treatment unit block (TB) 32 has a four-stage stack structure starting from -14 (12) 1265906, respectively: a device transport unit (PASS) 65 for receiving the substrate G, The two cooling units (C Ο L ) 6 6 and 6 7 for cooling the substrate G and the adhesion enhancer coating unit (AD ) for hydrophobizing the substrate G 6 8 ° first conveying device 33 are used The receiving of the substrate G from the gas washing and rinsing processing unit (SCR) 21 via the equipment handling unit (PASS) 61, the loading and unloading of the substrate G between the heat treatment units, and the receiving via the equipment handling unit (PASS) 6) The substrate G from the resist coating processing unit 23. The first conveying device 33 has a guide rail 91 that extends vertically, a lifting member 92 that moves up and down along the guide rail 9 1 , a base member 913 that is rotatably provided on the lifting member 92 , and a forwardly retractable On the base member 93, a substrate holding arm 94 for holding the substrate G is held. The lifting and lowering of the lifting member 92 is performed by the motor 94, and the rotation of the base member 93 is performed by the motor 96. The forward and backward movement of the substrate holding arm 94 is performed by the motor 97, and the first conveying device 33 can be moved up and down. Move, move back and forth, rotate and move, and can reach any unit of heat treatment unit block (TB) 3 1 , 3 2 . The second heat treatment unit portion 27 is two heat treatment unit blocks (TB) 34, 35 which are formed by stacking heat treatment units for performing heat treatment on the substrate G, and the heat treatment unit block (TB) 34 is disposed in the anti-uranium On the side of the agent coating processing unit 23, a heat treatment unit block (TB) 35 is provided on the side of the development processing unit (DEV) 24. Between the two heat treatment unit blocks 34, 35, a second handling device 36 is provided. -15- (13) 1265906 As shown in Fig. 3, the heat treatment unit block (TB) 3 4 of the second heat treatment unit 27 is a four-segment structure which is stacked from the bottom, respectively: equipment for performing substrate transfer The transport unit (PASS) 69 and the three pre-baking units (PREBAKE) 70, 71, and 72 for pre-baking the substrate G. The heat treatment unit block (TB) 35 is composed of a four-stage structure starting from the bottom, respectively: a device handling unit (PASS) 73 for performing substrate transfer, and a cooling unit (COL) for cooling the substrate G. Two pre-baking units (PREBAKE) 75, 76 ° second carrying device 36 for pre-baking the substrate G are used to: receive the resist from the device handling unit (PASS) 69 The substrate G of the deposition processing unit 23, the substrate G between the heat treatment units, and the substrate G from the development processing unit (DEV) 24 via the device transfer unit (PASS) 73, and the interface to be described later The substrate transfer portion of the portion 3 is the transfer and reception of the substrate G of the extended cooling stage (EXT · COL) 44. The second handling device 36 has the same configuration as the first handling device 33 and can be connected to one of the units of the heat treatment unit blocks (TB) 34, 35. The third heat treatment unit portion 28 is two heat treatment unit blocks (TB) 37, 38 having a heat treatment unit for heat-treating the substrate 〇, and the heat treatment unit block (TB) 37 is disposed on the image. On the processing unit (DEV) 24 side, the heat treatment unit block (TB) is disposed on the side of the cassette portion 1. Between the two heat treatment unit blocks (TB) 3 7 and 3 8 , a third conveying device 39 is provided. -16- (14) 1265906 As shown in Fig. 4, the heat treatment unit block (TB) 37 of the third heat treatment unit 28 is a four-segment structure which is stacked from the bottom, and is: equipment handling for substrate transfer Unit (PASS) 77, three post-baking units (P0BAKE) 78, 79, 80 for performing post-baking treatment on the substrate G. The heat treatment unit block (TB) 38, which starts from the bottom, is a four-segment structure, which is: post-bake unit (P0BAKE) 81, equipment handling and cooling unit for substrate transfer and cooling (PASS • C Ο L) 8 2. Two post-baking units (POBAKE) 83, 84 for performing post-baking treatment on the substrate G. The third transfer device 3 9 is configured to receive the substrate G from the i-line UV illumination unit (i-UV) 25 via the device transfer unit (PASS) 77, and carry out the substrate G between the heat treatment units. The loading and delivery of the substrate G facing the cassette unit 1 via the equipment handling/cooling unit (PASS·COL) 82 are carried out. The third conveying device 39 has the same configuration as the first conveying device 33 and can be connected to one of the units of the heat treatment unit blocks (TB) 37, 38. As described above, the processing unit 2 constitutes the two-row transport lines A and B, and arranges the respective processing units and transporting devices in accordance with the basic processing order, and a space 40 is provided between the transport lines A-B. Further, a shuttle (substrate mounting member) 41 that is reciprocally movable in the space 40 is provided. The shuttle 4 1 is formed to hold the substrate G, and the substrate G is transferred between the conveyance lines A - B via the shuttle 41. The transfer of the substrate G to the shuttle 4 1 is performed by the above-described first to second transfer devices 33, 36, and 39. The interface table 3 includes a transfer device 42 that carries out the loading and unloading of the substrate G by the -17-(15) 1265906 between the processing unit 2 and the exposure device 4, a buffer table (BUF) 43 that arranges the buffer cassette, and An extension/cooling stage (EXT · COL ) 44 having a substrate transfer portion having a cooling function is provided, and an external device block 45 in which a titrator (TITLER) and a peripheral exposure device are stacked on top of each other is provided adjacent to the transfer device 42. The transport device 42 includes a substrate transport arm 42a'. The substrate transport arm 42a carries out the loading and unloading of the substrate G between the processing unit 2 and the exposure device 4. In the resist application and development processing system 100 of such a structure, first, the substrate G disposed in the cassette C of the mounting table 9 of the cassette unit 1 is directly loaded into the processing device 1 1 The excimer UV irradiation unit (e-UV) 22 of the portion 2 performs a gas pre-washing treatment. Next, the roller is transported by, for example, a plurality of rollers 16. The substrate G is carried into a gas washing and washing unit (SCR) 21 to perform gas washing. After the gas washing and rinsing treatment, the substrate G is carried out by, for example, roller transportation to the equipment handling unit (PASS) 61 of the heat treatment unit block (TB) 3 1 belonging to the first heat treatment single edge portion 26. The substrate G disposed on the equipment handling unit (PASS) 61 is initially transported to one of the dewatering and baking units (DHP) 62, 63 of the heat treatment unit block (T B ) 31 for heat treatment. Next, the substrate G is transported to one of the cooling units (C Ο L ) 6 6 and 6 7 of the heat treatment unit block (TB) 32 for cooling treatment, and then, in order to improve the stability of the resist, The adhesion enhancer coating unit (AD) 64 transported to the heat treatment unit block (TB) 3 1 or the adhesion enhancer coating unit (AD) 6 2 of the heat treatment unit block (TB) 3 2 The HMD s is densely coated (16) 1265906 with a fortifier (hydrophobic treatment). Then, the substrate G is transported to one of the cooling units (COL) 66, 67 for cooling, and then transported to the equipment handling unit (PASS) 65 of the heat treatment unit block (TB) 32. The conveyance processing of the substrate G for performing the series of processes is performed by the first conveyance device. The substrate G disposed on the device transport unit (PASS) 65 is carried into the resist application processing unit 23 by the first internal substrate transfer device 1 10 (see Fig. 5). The substrate G is first loaded into a resist coating device (CT) 23a, whereby the resist is spin-coated on the substrate G. Next, the substrate G is transported to the reduced-pressure drying device (VD) 23b by the second internal substrate conveying device 1 20 (see Fig. 5), thereby performing pressure reduction drying. Next, the substrate G is transported to the peripheral resist removing device (ER) 2 3 c by the third internal substrate transfer device 130 (see FIG. 5), thereby removing excess resist from the periphery of the substrate G. Agent. After the peripheral resist removal process is completed, the substrate G is carried out from the resist coating processing unit 23 by the fourth internal substrate transfer device 140 (refer to FIG. 5), and is transferred to the second heat treatment unit 27. Equipment handling unit (PASS) 69 of heat treatment unit block (TB) 34. The substrate G disposed on the equipment handling unit (PASS) 69 is transported to the pre-baking unit (PREBAKE) 70, 71, 72 and heat treatment of the heat treatment unit block (TB) 3 4 by the second conveying device 36. One of the pre-baking units (PREBAKE) 75, 76 of the unit block (TB) 35 is pre-baked and then transported to the heat treatment unit block (-19-(17) 1265906 TB) 35 for cooling. The unit (COL) 74 cools it to a predetermined temperature. By means of the second handling device 36, it is transported to the equipment handling station (PASS) 73 of the heat treatment unit block (TB) 35. Then, the substrate G is transported to the extension/cooling stage (EXT · COL ) 44 of the dielectric surface portion 3 by the second transfer device 36, and is transported to the periphery of the external device block 45 by the transfer device 42 of the dielectric surface portion 3. The exposure device (EE) performs exposure for removing the peripheral resist, and then is transported to the exposure device 4 by the transport device 42, whereby the resist film on the substrate G is exposed to form a predetermined pattern. The substrate G is carried to the exposure device 4 by a buffer cassette housed on a buffer table (BUF) 43. After the end of the exposure, the substrate G is carried into the titrator (TITLER) of the upper section of the external device block 45 by the transfer device 42 of the interposer 3 to record the predetermined information on the substrate G, and is placed on the extension. • Cooling station (EXT.COL) 44. The substrate G is transported from the extension/cooling stage (EXT · COL ) 44 to the material handling unit (PASS) 73 belonging to the heat treatment unit block (TB) 35 of the second heat treatment unit 27 by the second transport unit 36. From the equipment handling unit (PASS) 73 to the transport mechanism in which the development processing unit (DEV) 24 is extended, for example, by moving the roller mechanism, the substrate G is carried from the equipment handling unit (PASS) 73 to the development processing. A unit (DEV) 24, by which the development processing is carried out. In the development process, first, a developer liquid is applied to the substrate G to form a developing solution, and a developing reaction is performed while the substrate G is being transported at a predetermined speed. Next, by stopping the conveyance of the substrate G and adjusting the substrate G to an inclined posture, the developing liquid on the -20-(18) 1265906 LCD substrate is dropped, and pure water is blown onto the substrate G to stop the development reaction. . Then, the substrate G is transported in a slightly horizontal position, and pure water is supplied to the substrate G for rinsing treatment so that the residue of the developing liquid does not remain. Then, dry air is blown onto the substrate G to dry the substrate G. After the completion of the development processing, the substrate G is transported to the i-line UV irradiation unit (i-UV) 25 by a continuous transport mechanism from the development processing unit (DEV) 24, whereby the substrate G is subjected to a decoloring process. Then, the substrate G is carried out to the heat treatment unit block (TB) belonging to the third heat treatment unit 28 by the roller transport mechanism 16 (roller stage) in the i-line UV irradiation unit (i-UV) 25. Equipment handling unit (PASS) 77. The substrate G disposed on the equipment handling unit (PASS) 77 is transported to the post-baking unit (POBAKE) 78, 79, 80 and the heat treatment unit area of the heat treatment unit block (TB) 37 by the third conveying device 39. One of the post-baking units (POBAKE) 8 1 , 83 , and 84 of the block (TB ) 38 is subjected to post-baking treatment, and then transported to the equipment handling and cooling unit of the heat treatment unit block (TB) 38 (PASS) COL) 82 This is cooled to a predetermined temperature, and the conveying device 1 1 of the cassette unit 1 is housed in a predetermined cassette C of the cassette unit 1. Next, the structure of the resist coating processing unit 23 and the conveyance method of the substrate G therein, and the conveyance of the substrate G between the equipment handling unit (PASS) 65 and the resist coating processing unit 23 will be described in detail. The method and the manner of transporting the LCD substrate between the uranium-improving agent coating processing unit 23 and the equipment handling unit (PASS) 69. (19) 1265906 Fig. 5 is a schematic plan view showing a schematic configuration of the resist coating processing unit 23, the equipment handling unit (PASS) 65, and the equipment handling unit (PASS) 69. The equipment handling unit (PASS) 65 has a table portion 101 for placing the substrate G and a lifting rod 102 that is disposed at a predetermined position up and down through the table portion, and from the equipment handling unit (PASS) 65 to the resist. The area of the coating device (CT) 23a is provided with a first *internal substrate conveying device 110 for transporting the substrate G. The first *internal substrate conveying device 11A is provided with a pair of substrate conveying portions 11a, 110b. The pair of substrate transporting portions 1 1 0a and 1 1 Ob are arranged symmetrically with respect to each other across the substrate G on the mesa 10 1 . The resist coating device (CT) 23a has a spinning chuck 51 for holding the substrate G, freely rotatable and freely moving up, and a substrate G disposed to surround the spinning chuck 51. Coat cup 50. As the spinning chuck 5 1, for example, a method of holding the substrate G by vacuum suction is suitable. The vacuum drying device (VD) 23b has a table portion 55 for allowing the substrate G to be freely moved up and down, and a decompression chamber 52 for burying the substrate g placed on the table portion 55 therein. A support rod (not shown) is provided at a predetermined position on the surface of the table portion 5 5 to support the L C D substrate at a point. The decompression chamber 52 is composed of a lower container and an upper cover. When the upper cover is raised and the decompression chamber 52 is opened, the substrate G is carried into the table portion 55, or the substrate G is carried out from the table portion 55. The peripheral resist removing device (ER) 23c has a land portion 54 for placing the substrate G, and -22·(20) 1265906 along the substrate G placed on the land portion 54. The removal head 53 moves linearly. When the head 53 is removed, a certain amount of solvent is discharged while discharging in one direction to dissolve the resist adhering to the periphery of the substrate G, and then the dissolved resist and the discharged solvent are sucked and recovered. Thus, the dissolved resist does not diffuse into the inside of the substrate G and is inside the resist coating processing unit 23, and is provided for transporting the substrate G from the resist coating device (CT) 23a. The second internal substrate conveying device 120 to the vacuum drying device (VD) 23b, and the third internal substrate conveying device for conveying the substrate G from the vacuum drying device (VD) to the peripheral resist removing device (ER) 23c Device 130. The second internal substrate conveying device 120 is retracted between the resist coating device (CT) 23a and the decompression drying device (VD) 23b during the non-substrate conveyance, and the third internal substrate conveying device 1 30 is When the substrate is not transported, it is evacuated between the reduced-pressure drying device (VD) 23b and the peripheral resist removing device (ER) 23c. As shown in Fig. 6, the substrate G is conveyed on the roller table 16 in the equipment carrying port 65, and moved to the inlet side table 1 〇 1 to be stopped. Then, the plurality of rod portions 1〇2 are raised by the lift cylinder 103, and the rod portion 102 protrudes from the table portion 1 〇 1 by the hole portion 10 1 a of the table transporting table portion 1 0 1 . The substrate G is lifted to a position above the predetermined height above the table 1 〇 1 by the rod portion 102. Next, the first internal substrate conveying device 110 extends the pair of substrate conveying portions 1 10a and 1 10b directly below the substrate G from the left and right to lower the rod portion 102. Thereby, the substrate G is transferred from the rod portion 1 〇 2 to the pair of substrate conveying portions 110a and 110b. The substrate G is carried in the X direction by the first internal substrate conveying device 11 -23 -23 - (21) 1265906. Similarly to the inlet-side equipment transport port 65, the roller table 16 may be provided on the downstream side of the table portion 103 of the exit-side equipment transport port 69. The substrate G is carried out by the roller table 15 after being delivered to the table portion 103 from the fourth internal substrate conveying device 140. Fig. 7 is a plan view showing in detail one of the substrate transporting portions 11a of the first internal substrate transporting device 110. The pair of substrate conveying portions 140a and 140b of the other substrate conveying portion 110b and the fourth internal substrate conveying device 140 have substantially the same structure as the one of the substrate conveying portions 110a, and therefore the description thereof will be omitted. The substrate transporting portion 11a has a transport arm 1 1 2 including holding members 1 1 1 a and 1 1 1 b for holding the peripheral edge of the LCD substrate, and an arm position for sliding the transport arm 1 1 2 in the Y direction. The adjustment mechanism 1 1 3 and the arm slide mechanism 1 15 that slides the arm position adjustment mechanism 1 1 3 in the X direction (substrate conveyance direction). The transport arm 112 includes a front arm member 1 1 2a for holding the peripheral edge portion of the substrate on the front side in the substrate transport direction (X direction), and a peripheral portion of the substrate for holding the rear side in the substrate transport direction (X direction). The rear arm member 1 12b, the arm coupling member 112c that slidably connects the front and rear members 1 12a and 1 12b, and the arm position adjusting mechanism 1 1 3 that advances or retracts the front and rear arm members 112a and 112b. The front and rear arm members 1 12a and 1 12b have a slightly L-shaped projection on the horizontal plane, and one end of the L-shaped wrist is coupled to each other by the arm coupling members 1 1 2c. In other words, the transport arm 1 1 2 is a U-shaped projection in the horizontal plane of the full-24-(22) 1265906 body, and is disposed in the X-direction peripheral portion and the Y-direction peripheral edge corresponding to approximately half of the substrate G. unit. In the pair of front and rear transfer arms 1 12a, 1 12b, two kinds of holding members 1 1 1 a and 1 1 1 b are mounted at a plurality of positions. The first holding members Π 1 a are respectively mounted to protrude inward from the slight midpoint of the L-shaped wrists of the two arm members 112a and Π 2b, and there are four in total. The first holding member 1 1 1 a is provided with a suction seat 203 (see Fig. 8) for adsorbing the back surface of the substrate G as will be described later. The second holding member 1 1 1 b has four attachments near the ends of the L-shaped wrists of the two arm members I 12a, 1 12b, and four are mounted near the curved portion, and the arm position adjusting mechanism 1 1 3 There is one centrally mounted long axis, a total of nine. The second holding member 1 1 1 b is only a structure for supporting the substrate G. The substrate transporting portion 1 1 〇 a on one of the sides is provided with four first holding members 1 1 1 a and nine second holding members 1 1 1 b. Thereby, the entirety of the first inner substrate conveying device 1 1 具备 is provided with a total of eight first holding members II 1 a and a total of eighteen second holding members 1 1 1 b. The arm position adjusting mechanism 1 13 has a rod portion 207 extending in the Y direction and a rodless cylinder 1 16 that is fitted to the slider 208 that can slide in the Y direction, and a guide that extends in the Y direction. a guide portion 2 1 0 , a slider 2 1 1 that is slidable in the Y direction by being fitted to the guide portion 2 1 0 , and a base 1 for holding the rodless cylinder 1 16 and the guide portion 2 1 0 1 4. The slider 208 can be slid in the Y direction by introducing air into the inside of the substrate G side or the opposite side in the Y direction. The upper surface of the slider 208 is coupled to the arm coupling member 1 1 2 c, and by sliding the slider 2 0 8 in the Y direction (23) 1265906, the carrier arm 1 1 2 can be made relative to the table 1 〇1 The substrate G placed thereon advances and retreats. The ends of the rods 207 are fixed to the end members 2 0 9 a, 2 09b, and the end members 209a, 209b are fixed to the base; [14. The upper surface portion of the slider 2 1 1 is also coupled to the arm coupling members 1 1 2c. Although the slider 21 1 itself does not have its own function of walking, when the slider 208 is slid, the slider 21 1 fitted to the guiding portion 210 is moved along with the slider 208, and the carrying arm is raised. 1 1 2 action stability. End members 212a and 212b are fixed to the end portion of the guide portion 210 in the Y direction. The base 114 is provided with a pair of stoppers 214a and 214b for preventing the position of the conveyance arm 112 from being displaced in the Y direction and for positioning the conveyance arm 112 at the end in the Y direction. The arm joint member 12c is provided with a stopper seat 215 that abuts against the stoppers 214a, 214b. When the transport arm 112 is slid together with the slider 208, the transport arm 112 is partially positioned in the Y-direction end by abutting the stopper base 215 against the stopper 214a or the stopper 214b. A guide portion 217 extending in the X direction is provided between the equipment handling unit (PASS) 65 and the equipment handling unit (PASS) 69. The arm slide mechanism 1 15 has a coupling member 2 1 8 fitted to the guide portion 21 17 and an X-direction conveying mechanism 2 1 9 that slides the coupling member 2 18 in the X direction. The base 11 4 is coupled to the coupling member 2 1 8 to slide the arm position adjusting mechanism 1 1 3 in the X direction, that is, the carrier arm 2 can be slid in the X direction. As the X-direction transport mechanism 2 1 9, an air cylinder, a belt transport device, a ball circulation type transport device, or the like can be used. In Fig. 7, the retracted position of the transport arm 1 1 2 when the base-26-(24) 1265906 plate G is carried from the first transport device 3 3 to the entry side table 1 ο 1 is indicated by a solid line, and The two-dot dotted line shows the position at which the transport arm 1 1 2 is advanced toward the entry side table 1 。. In the first internal substrate conveying device 11A, in order to enable the transfer arm 1 1 2 to be retracted to the γ-direction end portion in the device transport unit (PASS) 65, the device handling unit (PASS) 65 and the resist are coated. The interval of the coating device (CT) 2 3 a is reduced, and the ground contact area of the resist coating processing unit 23 can be reduced. In particular, when the substrate G is large, the effect of reducing the ground contact area is remarkable. In order to make the area of the substrate G of the device handling unit (PASS) 65 actually smaller than the resist coating device (CT) 23a, the first internal substrate conveying device 11 is suitable for use in a space in which the γ direction is easily secured. Happening. The weight of the substrate G of 1 0 0 0 m m X 1 2 0 0 m m is about 3 kg, and the conveyance speed of the first internal substrate conveying device 11 is about 1000 to 1500 mm / sec. Fig. 8 is a cross-sectional view showing a more detailed configuration of the first holding member 1 1 1 a. The first holding member 1 1 1 a has a cylindrical member 20 1 having an internal space 2 0 1 a, a mounting member 202 for mounting the cylindrical member 20 1 to the carrying arm 1 1 2 , and a cylindrical member The adsorption seat 203 at the upper end of the 201, and the adsorption seat fixing member 024 for fixing the adsorption seat 203 to the cylindrical member 201. At the lower end of the tubular member 201, a pressure reducing line 205 that communicates with a vacuum pump (not shown) is provided, and the internal space 201a of the tubular member 201 can be decompressed. A hole portion 203a is formed in the upper surface portion of the adsorption seat 203. When the internal space 201a of the cylindrical member 201 is depressurized, the hole portion 203a adsorbs the substrate G, and the base portion of the adsorption seat 203 is adsorbed and held. (25) 1265906 Plate G. When the substrate G is adsorbed on the upper surface portion of the adsorption holder 203, the substrate g is held only by the peripheral portion thereof (within 15 mm from the outer peripheral end of the substrate), so that the entire substrate is scratched. The adsorption seat 203 is a soft material excellent in abrasion resistance and corrosion resistance, and is made of, for example, a soft material of (viton) (trade name of fluorinated ethylene rubber). Therefore, the suction seat 202 can be tilted in response to the bending manner of the substrate G. On the other hand, when a suction holder that cannot be tilted is used, when the substrate is deflected, a gap is formed between the upper surface portion of the suction seat and the substrate G, and the substrate G cannot be held. However, if the first holding member 1 1 1 a is used, there is an advantage that the substrate G which is bent into a concave shape can be surely held. The second internal substrate conveying device 120 has a pair of substrate conveying portions 12A and 120b that are disposed to face each other with a slight symmetry in the γ direction, and the third internal substrate conveying device 1 3 具有 has a relatively symmetric arrangement in the Y direction. A pair of board conveying portions 130a and 130b. The second internal substrate conveying device 120 and the third internal substrate conveying device 130 have substantially the same structure. Hereinafter, only the second internal substrate conveying device 1 20 will be described as a representative. FIG. 9 is a detailed view showing the second internal substrate. A plan view of the substrate conveyance unit 2〇a of one of the conveyance devices 1-20. The other substrate transporting portion 120b and the pair of substrate transporting portions 130a and 130b of the third internal substrate transporting device have substantially the same structure as one of the substrate transporting portions 120a, and therefore description thereof will be omitted. The substrate transport unit 120a has a pair of left and right transport arm members 122a and 122b including two types of holding members 1 π a and 1 1 1 b for holding the periphery of the substrate -28-(26) 1265906, and transporting these The arm members 122a and 122b respectively move the arm interval adjusting mechanism 1 23 in the X direction and the arm slide mechanism 125 that slides the arm interval adjusting mechanism 123 in the X direction. The pair of right and left transfer arm members 122a and 122b are formed in a slightly L-shaped shape. The transport arm member 1 22a on the right side is a peripheral edge for holding the front side of the substrate G in the X direction, and the transport arm member 1 22b on the left side is a peripheral edge for holding the rear side of the substrate G in the X direction. The first holding member 111a and the second holding member 111b attached to the two transfer arm members 122a and 122b have substantially the same structure as that of the first internal substrate conveying device 110. The first holding members 1 1 1 a are respectively protruded inward from the slightly midpoint of the L-shaped wrists of the two arm members 122a, 122b, and have a total of four. The first holding member 1 1 1 a is provided with an absorbing seat 203. The second holding member 1 1 lb has two attachments near the ends of the L-shaped arms of the two arm members 122a, 122b, and four are mounted near the curved portion and at the center of the long axis of the arm spacing adjustment mechanism 123. There is one installation, a total of seven. The second holding member 1 1 1 b is only a structure for supporting the substrate G. The substrate conveying portion 120a on one of the sides is provided with four first holding members 1 1 1 a and seven second holding members n b. Thereby, the entirety of the second inner substrate conveying device 120 is provided with a total of eight first holding members Η 1 a and a total of fourteen second holding members 1 1 1 b. The arm interval adjusting mechanism 1 23 has a rod portion 221a extending in the X direction and a first rodless cylinder 126a fitted to the rod portion 22a to slide in the X direction, and having a slider (27) 1265906 222a The rod portion 221b extending in the X direction, the second rodless cylinder 126b fitted to the slider 222b slidable in the X direction by the rod portion 221b, and the guiding portion 223 extending in the X direction are fitted to the guiding portion 223 And two sliders 224a and 224b slidable in the X direction, a coupling member 225a for coupling the slider 222a and the slider 224a, a coupling member 225b for coupling the slider 222b and the slider 224b, and a retaining portion The first and second rodless cylinders 126a, 126b and the base 124 of the guiding portion 223. Only one second holding member 111b is mounted on the base 124. The second holding member 1 1 1 b is a midpoint supporting one of the sides of the peripheral portion of the substrate. The sliders 222a and 22 2b are slidable in the X direction by introducing air into the front side or the rear side of the substrate conveyance direction (X direction). On the other hand, the sliders 224a, 224b themselves do not have the function of walking by themselves. However, since the sliders 224a and 224b are coupled to the sliders 222a and 222b by the connecting members 225b and 225b, respectively, they slide together with the sliders 222a and 222b. The slider 224a is connected to the transport arm member 122a, and the transport arm member 122b is coupled to the slider 224b. The manner of adjusting the distance between the sliders 222a, 222b is the same as the manner of adjusting the interval between the carrier members 122a, 122b. By causing the sliders 224a and 22bb fitted to the guide portion 223 to travel with the sliders 222a and 222b, respectively, the operational stability of the transport arms 122a and 122b is improved. The base 124 is mounted with a position for preventing the transfer arms 122a, 12 2b from sliding in the X direction, and is used for positioning the transport arms 122a, -30-(28) 1265906 ^21) in the X-direction end. The outer stopper 228a and the inner stopper 228b for preventing the movement of the conveyance arm members 122a and 122b from each other for positioning the conveyance arms 122a and 122b on the inner side. The sliders 229a and 222b are respectively attached with the stopper seats 229a and 229b which are in contact with the outer and inner stoppers 22 8 a and 228b. The arm sliding mechanism 1 2 5 has a fitting portion to the guiding portion 2 17 . The connecting member 23 1 and the X-direction conveying mechanism 232 that slides the connecting member 23 1 in the X direction. The base 124 is coupled to the coupling member 231, whereby the arm spacing adjusting mechanism 1 2 3 is slid in the X direction, that is, the conveying arm members 122a and 122b are slid in the X direction. As the X-direction transport mechanism 23 2, an air cylinder, a belt transport device, a ball circulation type transport device, or the like can be used. It is preferable to use a good alloy having a large unit strength in each of the members of the first, second, third, and fourth internal substrate conveying apparatuses 1 10, 120, 130, and 140. In particular, the conveyance arm members 112a, 112b, 122a, and 122b need to have a reduced degree of curvature. Therefore, from the viewpoint of both the material and the structure, it is necessary to design a large rigidity and a light weight. The conveyance arm members 122a and 122b of the second and third internal substrate conveying apparatuses 120 and 130 of the present embodiment are aluminum alloy tubes having an outer diameter of 30 mm and a thickness of 1.5 mm, and the lengths of the L-shaped wrists in the X direction and the Y direction. The length is made to be about 500 to 600 mm. The transport arm members 1 12a and 112b of the first and fourth inner substrate transporting devices 1 1 and 14 are made of a nylon alloy tube having an outer diameter of 30 mm and a thickness of 1.5 mm, and the lengths of the L-shaped wrists in the Y direction are respectively made 400~ About 00mm. Preferably, the first and second holding members are attached to the carrying arm members 112a, 1 12b, 122a by bolt locking using a -31 - (29) 1265906 C-shaped member having a slit-like slit. 122b. When such a C-shaped component is used, the first and second holding members can be easily attached and detached to the transport arm members 1 1 2a, 112b, 122a, and 122b, and the mounting position can be freely changed. In the ninth diagram, the state in which the conveyance arm members 122a and 122b are conveyed by the substrate is shown in a solid line, that is, the state in which the two transfer arm members 122a and 122b are spaced apart from each other and the conveyance arm members 122a and 122b can hold the substrate G. (The substrate conveyance state) is a state in which the distance (width) between the two conveyance arm members 122a and 122b is reduced by a broken line, and the conveyance arm members 122a and 122b are retracted. As described above, when not transported, the transport arm members 122a and 122b are retracted between the resist application device (CT) 23a and the decompression drying device (VD) 23b. At this time, by transporting the arm member 12a, The mutual spacing (width) of 122b is kept narrower than when the substrate is conveyed', and the distance between the resist coating device (CT) 2 3 a and the reduced-pressure drying device (VD) 2 3 b can be reduced. Since the evacuation space of the second internal substrate conveying device 120 is reduced, the ground contact area of the resist coating processing unit 23 can be reduced, and the ground contact area of the uranium-improving agent coating/development processing system 100 can be reduced. This effect of reducing the ground contact area has a more significant effect when the substrate is large. Since the third internal substrate conveying device 130 has substantially the same structure as the second internal substrate conveying device 1 2, it is possible to reduce the retreat space, that is, the reduced-pressure drying device (VD) 23b and the peripheral resist removing device (ER). The distance between 2 3 c. -32- (30) 1265906 The equipment handling unit (PASS) 69 has a table portion 103 on which the substrate G is placed, and a lifting rod 104 that is set at a predetermined position by vertically penetrating the table portion 1〇3, and is resistant from the periphery. The region of the etchant removing device (ER) 23c to the equipment handling unit (PASS) 69 is provided with a fourth internal substrate conveying device 140 for transporting the substrate G. The fourth internal substrate conveying device 140 has the same structure as the first internal substrate conveying device 11 described above, and the conveying arm can be retracted toward the Y-direction end of the equipment conveying unit (PASS) 69. Thereby, the distance between the peripheral resist removing device (ER) 23c and the equipment handling unit (PASS) 69 can be reduced, and the ground contact area can be reduced. The order in which the substrate G is transported from the equipment handling unit (PASS) 65 through the resist coating processing unit 23 to the equipment handling unit (PASS) 69 is

I, for example, is performed as follows. That is, the transport arm 1 1 2 of the first internal substrate transporting device 1 10 is retracted to the end in the Y direction, and the first transport device 33 carries the substrate G into the equipment transport unit (PASS) 65. Then, the lifting rod 1〇2 rises, and during the ascent, the lifting rod 102 receives the substrate G from the first conveying device 33. Next, when the substrate G is not transported immediately, the lifter 102 is lowered, and the substrate G is placed on the stage 1 〇 1. The lifting rod 102 supports the substrate G, and after the substrate G is positioned higher than the transport arm 1 1 2, the arm position adjusting mechanism 1 13 is actuated to slide the transport arm 112 toward the substrate G side to maintain the structure. Member 111a,

The inner space 20 1 a of the cylindrical member 20 1 of 1 1 1 b is decompressed, and then the lift rod 102 is lowered. Thereby, during the descending of the lifting rod 102, the substrate G-33-(31) 1265906 is transferred to the holding members 1 1 1 a, 1 1 1 b provided on the carrying arm 1 1 2, and the substrate G is adsorbed and held at Adsorption seat 203. When the second internal substrate conveying device 120 is retracted to a state between the resist applying device (CT) 23a and the reduced-pressure drying device (VD) 23b, the arm of the first internal substrate conveying device 1 1 〇 is slid. The mechanism 1 15 is operated to transport the substrate G above the spinning chuck 51 of the uranium-resistant coating device (CT) 23a. On the other hand, if the spinning chuck 51 is raised, the substrate G is transferred from the conveying arm 1 12 to the spinning chuck 51 during the ascending direction. Before the substrate G is to be transferred to the spinning chuck 51, the decompressed state in the internal space 201a of the tubular member 201 constituting the holding members 1 1 la, 1 1 lb is released, so that the substrate G does not fall, so that The substrate G is easily separated from the adsorption seat 203. Once the substrate G is transferred to the spinning chuck 5 1, the arm position adjusting mechanism 1 1 3 is actuated to retract the carrier arm 1 1 2 to the Y-direction end, and the arm sliding mechanism 1 15 is actuated. The first internal substrate transporting device 110 is slid to the side of the equipment transport unit (PASS) 65, and the first transport device 33 carries the next substrate G to the equipment transport unit (PASS) 65 and the transport arm 1 1 2 stands by. The periphery of the substrate G is surrounded by the coating cup 50, and the spinning chuck 51 holding the substrate G is lowered to a predetermined position, for example, in a state where the substrate G is stationary, the center of the substrate G is coated. A predetermined amount of the anti-uranium agent liquid is then rotated by the spinning chuck 51 at a predetermined number of revolutions to expand the resist liquid to the entire substrate G to form a resist film. Raising the spin chuck 51 to hold the substrate G forming the resist film (32) 1265906 after the predetermined height, sliding the second inner substrate carrying device 120 to the resist coating device (CT) The location of 23a. The spinning chuck 51 is a structure in which the lower center portion of the board for holding the substrate G is supported by the support bar, and if the second inner substrate conveying device 120 is slid so that the carrying arms 122a, 122b carry the side of the supporting rod, The transport arms 122a, 122b do not hit the spin chuck 51. Next, the arm interval adjusting mechanism 123 is driven to expand the distance between the transfer arms 122a and 122b, and the pressure reducing line 205 is actuated to make the holding member 1 1 1 a, 1 1 1 b adsorb the substrate G. The spin chuck 51 is lowered. Thereby, the substrate G is transferred from the spinning chuck 51 to the holding members 1 1 1 a, 1 1 1 b of the second inner substrate conveying device 120 while the spinning chuck 51 is being lowered. When the upper cover of the decompression chamber 52 provided in the vacuum drying device (VD) 23b is raised, the second internal substrate conveying device 120 holding the substrate G is slid toward the decompression drying device (VD) 23b, and then When the table portion 5 5 ascends, the substrate G is transferred from the transfer arms 122a and 122b to the table portion 55 during the rise of the table portion 55. Next, the sliders 222a and 222b are slid to reduce the distance between the transfer arms 122a and 122b, and the second internal substrate conveying device 120 is moved to the resist coating device (CT) 23a and the vacuum drying device (VD). Between 23b, waiting until the next processing. In the vacuum drying device (VD) 23b, after the second internal substrate conveying device 1 20 is retracted, the decompression chamber 52 is kept in a sealed state, and The internal pressure is reduced, and a part of the solvent-35-(33) 1265906 contained in the resist film formed on the substrate is evaporated to dry the resist film. After the end of the treatment of the reduced-pressure drying device (VD) 23b, the decompression chamber 52 is opened, and the table portion 55 is raised to a predetermined height. The third internal substrate transporting device is used in the same order as the previous order in which the second internal substrate transporting device 120 is used to transport the substrate G from the resist coating device (CT) 23a to the reduced-pressure drying device (VD) 23b. 130, the substrate G is transported from the reduced-pressure drying device (VD) 23b to the peripheral resist removing device (ER) 23c. When the substrate G is held by the land portion 54 of the peripheral resist removing device (ER) 23c, the third internal substrate conveying device 130 is moved to the vacuum drying device (VD) 23b and the peripheral resist removing device (ER). The retreat space between 23 c. In the peripheral resist removal device (ER) 23c, the removal head 53 is moved along the edge of the substrate G to remove excess resist adhering to the periphery of the substrate G. After the peripheral resist removal device (ER) 23c completes the predetermined process, the stage portion 54 is raised to a predetermined height, and the fourth inner substrate carrying device 140 is slid to the peripheral resist removal device (ER) 23c. The transfer arm can receive the LCD substrate from the land portion 54 to reach the land portion 54. In this state, by lowering the table portion 54, the substrate G is transferred to the transfer arm of the fourth inner substrate conveying device 140. The fourth internal substrate conveying device 1 40 holding the substrate G is slid to the equipment handling unit (PASS) 69, and the substrate G is moved from the fourth interior by raising the lifting rod 104 provided on the equipment handling unit (PASS) 69. The transfer arm of the substrate transfer device 140 is transferred to the lift bar 1 〇4. The second conveying device 36 is connected to the lower side of the substrate G held by the lifting rod 1 〇 4, -36-(34) 1265906, by lowering the lifting rod 104, the substrate G is transferred to the second conveying device 36. For example, it will be transported to one of three pre-baking units (PRE BAKE) 70· 71· 72 for pre-baking treatment. The above is described with respect to the embodiments of the present invention, and the present invention is not limited to this. For example, in the arm position adjusting mechanism 1 of the first internal substrate conveying device 110, as a mechanism for driving the slider 208, a ball circulation type conveying mechanism or a rotating belt can be used. A rotating belt may be used for the arm interval adjusting mechanism 123 of the second inner substrate conveying device 120. Fig. 1A is a plan view showing a schematic configuration of an arm interval adjusting mechanism 1 2 3 a using a rotary belt, and Fig. 10B is a side view thereof. The arm interval adjusting mechanism 123a has pulleys 301a and 301b that are disposed apart at predetermined intervals, a belt 302 that surrounds the pulleys 301a and 301b, a motor 303 that rotates the pulley 301a, and an arm that is fixed to the belt 302. Holding members 3 04a, 3 04b. Transfer arm members 122a and 122b are attached to the arm holding members 3 04a and 304b, respectively. The pulley 30 1b rotates as the belt 322 rotates. Since the arm holding members 3 04a, 404b are respectively fixed to the upper side and the lower side of the belt 312, if the motor 3 0 3 is rotated, the arm holding member 304a is moved between the pulleys 3 0 1 a, 3 0 1 b By the center position, the mutual spacing of the transport arm members 122a, 122b can be reduced. Conversely, if the motor 303 is rotated to move the arm holding member 840a to the pulley 3 0 1 a side, the arm holding member 340b moves to the pulley 3 0 1 b side, so that the carrier arm members 122a, 122b can be enlarged. Interval. -37- (35) 1265906 In order to lift the stability when the transfer arm members 122a and 122b are slid, the transfer arm members 122a and 122b and the guide portion are similar to the arm interval adjustment mechanism 1 23 described above. (not shown) fitting is preferred. In the above description, the LCD substrate is used as the substrate. The substrate is not limited thereto. For example, the semiconductor wafer, the ceramic substrate, the various glass substrates, and the resin substrate may be used. The processing performed on the substrate is not limited to the above. The formation process of the resist film of the above embodiment. According to the present invention, the front and rear intervals of the pair of transport arm members (the X-direction interval: the interval in the substrate transport direction) can be reduced, so that the second inner substrate transporting device can be housed in the same retreat space as the conventional method. The same applies to the third internal substrate handling device. Thereby, the evacuation space is not increased, and a large-sized substrate can be handled more than the conventional method, and an increase in the area occupied by the device can be suppressed. According to the present invention, it is possible to change the left-right spacing (the γ-direction interval; the interval perpendicular to the substrate conveying direction) of the pair of opposite-transporting arms, and the size of the substrate (usually the substrate) even in the case where the substrate size is changed The short side length) adjusts the left and right spacing of the transport arm, and the first inner substrate transport device can be retracted to both sides of the transport path on the entrance side. The fourth internal substrate conveying device on the outlet side table is also the same. Thereby, the interval between the conveying paths can be narrowed, and an increase in the floor occupying area of the apparatus can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic plan view of a resist application and development processing system. -38- (36) 1265906 Fig. 2 is a schematic side view showing the first heat treatment unit portion of the resist application and development processing system. Fig. 3 is a schematic side view showing a second heat treatment unit portion of the uranium-improving agent application/development processing system. Fig. 4 is a schematic side view showing a third heat treatment unit portion of the resist application and development processing system. Fig. 5 is a perspective view showing the inside of the resist coating processing unit. Fig. 6 is a schematic side view showing the inlet side (receiving substrate portion) of the resist coating processing unit. Fig. 7 is a block diagram showing the substrate carrying portion of the first internal substrate conveying device. Figure 8 is an enlarged cross-sectional view of the holding member. Fig. 9 is a plan view showing the substrate carrying portion of the second internal substrate conveying device. Fig. 10A is a plan view of the arm interval adjusting mechanism, and Fig. 10B is a side view of the arm interval adjusting mechanism. [Main component comparison table] G : Substrate C : 匣 box 1 : 匣 box part 2 : Processing part 3 : Interfacial surface - 39 - (37) (37) 1265906 4 : Exposure device 9 : Mounting table 1 搬运: Handling path 1 1 : conveying device 1 6 : roller conveying mechanism 2 1 : gas washing and washing processing unit 22 : laser irradiation unit 23 : resist coating processing unit 24 : development processing unit 25 : i-line UV irradiation unit 26 : First heat treatment unit 27 : Second heat treatment unit 28 : Third heat treatment unit 3 2 : Heat treatment unit block 3 3 : First handling device 3 4, 3 5 : Heat treatment unit block 36 : Second handling device 3 9 : Third conveying device 40: space 41: shuttle 42: conveying device 43: buffer table 4 4: extension/cooling table 5 〇: coating cup-40- (38) (38) 1265906 5 1 : spinning chuck 5 2: Decompression chuck 5 3 : Removal head 5 5 : Table 61 : Equipment handling unit 62 , 63 : Dehydration baking unit 64 : Adhesion strengthening agent coating unit 65 : Equipment handling unit 66 , 67 : Cooling unit 68 : adhesion enhancer coating unit 69: equipment handling unit 70, 71, 72: prebaking unit 73: equipment handling unit 74: cooling unit 75, 76: prebaking Element 77: Equipment handling unit 7 8 , 7 9 , 80 0 : After-the-bake unit 8 1 : After-bake unit 82 : Equipment handling and cooling unit 83 , 84 : After-bake unit 91 : Guide rail 92 : Lifting member 93 : Base member 94: substrate holding arm - 41 - (39) (39) 1265906 9 5 : motor 9 6 : motor 9 7 : motor 1 抗蚀: resist coating and development processing system 1 〇 1 : table 102: lifting rod 110: first inner substrate conveying device 1 1 2 : conveying arm 1 1 3 : arm position adjusting mechanism 1 1 4 : base 1 1 5 : arm sliding mechanism 1 1 6 : rodless cylinder 120: second Internal substrate transfer device 130: Third internal substrate transfer device 140: Fourth internal substrate transfer device 201: Cylindrical member 202: Mounting member 2 0 3 : Adsorption seat 204: Seat fixing member 205: Decompression line 2 0 8 : Slip Block 210: guide portion 2 1 1 : slider 215 : stopper seat - 42 (40) 1265906 2 1 8 : joint member 2 1 9 : X-direction transport mechanism

-43-

Claims (1)

(1) 1265906 Pickup, Patent Application No. 92 1 1 3756 Patent Application Revision of Chinese Patent Application Revision of the Republic of China on March 8, 1995 1. A substrate handling device having a relatively symmetrical relative orientation across a horizontal transport path The substrate transporting device that transports the rectangular substrate in a horizontally horizontal manner along the horizontal transport path by the pair of substrate transporting portions, wherein the substrate transporting unit is The two transport arm members having a shape corresponding to the circumference of the rectangular substrate are attached to the transport arm member, abutting against the rear surface of the peripheral edge of the rectangular substrate, and holding the holding portion of the rectangular substrate, and movably supporting the two a carrier arm member for changing an arm spacing adjustment mechanism of the two transfer arm members, and an arm slide mechanism for movably supporting the arm interval adjustment mechanism to move the arm interval adjustment mechanism along the horizontal conveyance path The arm spacing adjustment mechanism described above, when transporting, the phases of the two transport arm members The mutual spacing is adjusted to be suitable for the size of the rectangular substrate, and the distance between the two transfer arm members is narrower than the interval during transportation when not being conveyed. 2. The substrate transfer device of claim 1, wherein the arm spacing adjustment mechanism has: one to one corresponding to the two (2) 1265906 transport arm members, and each of which is slidable in the substrate transport direction The pair of sliders supporting the two transfer arm members adjust the mutual spacing of the two transfer arm members by adjusting the mutual spacing of the pair of sliders. 3. The substrate transfer device according to claim 1 or 2, wherein the two transfer arm members are formed in a single horizontal projection shape having a slightly L-shaped shape, and are combined and connected by the arm spacing adjustment mechanism. The shape of the horizontal projection is slightly U-shaped. 4. The substrate transfer device according to claim 1, wherein the holding portion is detachably attached to the transfer arm member. 5. The substrate transfer device according to claim 1, wherein the holding portion holds the back surface of the periphery of the substrate within 15 m of the outer peripheral end of the rectangular substrate. 6. The substrate transfer device according to the first, fourth or fifth aspect of the invention, wherein the holding portion is provided with a first holding member that holds a plurality of the substrates by vacuum suction of a back surface of the adsorption substrate, and abutting A plurality of second holding members of the substrate are supported on the back surface of the substrate. 7. The substrate transfer device according to claim 6, wherein the first holding member is attached so as to protrude inward from a slight midpoint of the length of the arm of the transfer arm member. 8. The substrate transfer device according to claim 1, wherein the holding portion has a seat portion that contacts a periphery of the substrate to hold a base -2-(3) 1265906 plate at a predetermined position, and the seat portion corresponds to It is free to tilt when the substrate is bent while holding the substrate. A substrate processing apparatus comprising: a horizontal conveyance path for transporting a rectangular substrate; a first processing unit provided along the horizontal conveyance path and performing predetermined processing on the rectangular substrate; and a rectangular processing passage provided along the horizontal conveyance path a second processing unit that performs a predetermined process on the substrate, and a pair of substrate conveying units that are disposed substantially symmetrically with respect to each other across the horizontal conveyance path, and between the first processing unit and the second processing unit The substrate processing device of the substrate transfer device that holds the rectangular substrate in a horizontally horizontal manner and transports the rectangular substrate along the horizontal conveyance path, wherein the substrate conveyance unit is provided with: corresponding to a rectangular shape Two transfer arm members having a shape of a peripheral edge of the substrate are attached to the transfer arm member, abutting against a rear surface of the peripheral edge of the rectangular substrate, and holding the holding portion of the rectangular substrate, and movably supporting the two transfer arm members. Changing the arm spacing adjustment mechanism of the two transfer arm members at intervals An arm slide mechanism that movably supports the arm interval adjustment mechanism to move the arm interval adjustment mechanism along the horizontal conveyance path; and the arm interval adjustment mechanism transports the two wires -3-(4) 1265906 during transportation The distance between the arm members is adjusted to be suitable for the size of the rectangular substrate, and when the two members are not transported, the interval between the two transport arm members is narrower than the interval between the transporting, and the arm sliding mechanism is not transported. The two transfer arm members that are spaced apart from each other are retracted between the first processing unit and the second processing unit. The substrate processing apparatus according to claim 9, wherein the first processing unit is an anti-uranium coating treatment unit having a resist applied on a rectangular substrate by a spin coating method, and the second The processing unit includes a drying treatment unit for performing a vacuum drying treatment on the substrate on which the resist film is formed in the resist coating processing unit, and a peripheral resistance of removing the anti-uranium film from the periphery of the substrate. At least one of the worm removing units. 11. A substrate transfer device having a pair of substrate transporting portions that are disposed symmetrically with respect to each other across a horizontal transport path, wherein the rectangular substrate is held in a horizontal shape by the pair of substrate transporting portions and is carried along the horizontal In the substrate transporting device, the substrate transporting device includes a transport arm member having a shape corresponding to a peripheral edge of the rectangular substrate, and the transport arm member is attached to the peripheral edge of the rectangular substrate. a rear surface of the holding portion for holding the rectangular substrate, movably supporting the transport arm member, and moving the transport arm member in a direction perpendicular to the transport path, and adjusting an arm position of the transport arm member to advance and retreat with respect to the substrate a mechanism, -4- 1265906 (5) and an arm slide mechanism that movably supports the arm position adjustment mechanism to move the arm position adjustment mechanism along the horizontal conveyance path; and the arm position adjustment mechanism is configured to be conveyed Adjustment between the transfer arm member on one side and the transfer arm member on the other side The size of the rectangular substrate is adapted to be larger, and the distance between the transfer arm members is larger than the interval during transportation when not being conveyed. [1] The substrate transfer device of claim 1, wherein the holding portion has a seat portion that contacts a peripheral edge of the substrate to hold the substrate at a predetermined position, and the seat portion corresponds to the substrate when the substrate is held. The deflection is free to tilt. A substrate processing apparatus is provided with a first processing unit that is provided with a horizontal conveyance path for transporting a rectangular substrate and that is provided along the horizontal conveyance path and that performs predetermined processing on the rectangular substrate, and is provided along the horizontal conveyance path. a second processing unit that performs a predetermined process on the rectangular substrate, and a pair of substrate transporting portions that are disposed substantially symmetrically with respect to each other across the horizontal transport path, and are disposed in the first processing unit and the second processing unit The substrate processing apparatus of the board|substrate conveyance apparatus which hold|maintains the board|substrate conveyance part of the board|substrate with the board|substrate conveyance of the board|substrate conveyer and the board|substrate conveyer of the board|substrate conveyer. The transport arm member having the shape of the periphery of the rectangular substrate, -5-(6) 1265906, is attached to the transport arm member, and abuts against the rear surface of the periphery of the rectangular substrate to hold the holding portion of the rectangular substrate, and movably supports the above Transporting the arm member such that the transfer arm member intersects perpendicularly to the conveyance path An arm position adjusting mechanism that moves the transfer arm member forward and backward with respect to the substrate, and an arm slide mechanism that movably supports the arm position adjustment mechanism to move the arm position adjustment mechanism along the horizontal conveyance path; The adjustment mechanism adjusts the distance between the one of the transport arm members and the other transport arm member to be suitable for the size of the rectangular substrate during transport, and the transport arm members are spaced apart from each other when not being transported. The transfer arm member is retracted from the horizontal conveyance path by expanding more than the interval during transportation. A substrate processing apparatus is provided with a first processing unit that is provided with a horizontal conveyance path for transporting a rectangular substrate, and is provided along the horizontal conveyance path, and performs predetermined processing on the rectangular substrate, and is provided along the horizontal conveyance path. a second processing unit that performs a predetermined process on the rectangular substrate, and a third processing unit that is provided along the horizontal conveyance path and that performs another predetermined process on the rectangular substrate, and that is disposed substantially symmetrically with respect to each other across the horizontal conveyance path. a pair of first substrate transporting portions that hold the rectangular substrate slightly horizontally along the horizontal transport path by the pair of first substrate transporting portions between the first processing unit and the second processing unit a first base-6-(7) 1265906 plate conveying device that performs conveyance, and a pair of second substrate conveying portions that are disposed substantially symmetrically with respect to each other across the horizontal conveying path, and the second processing unit and the second processing unit The pair of second substrate carrying portions between the third processing portions hold the rectangular substrate slightly horizontally and along In the substrate processing apparatus of the second substrate transfer device that transports the horizontal transfer path, the first substrate transport unit includes a first transfer arm member having a shape corresponding to a peripheral edge of the rectangular substrate, and mounting. The first transfer arm member abuts against a rear surface of a peripheral edge of the rectangular substrate and holds the holding portion of the rectangular substrate, and movably supports the first transfer arm member to vertically intersect the first transfer arm member An arm position adjustment mechanism that moves the first conveyance arm member forward and backward with respect to the substrate, and an arm position adjustment mechanism that movably supports the arm position adjustment mechanism to slide the arm position adjustment mechanism along the horizontal conveyance path The second substrate transporting unit includes two second transport arm members having a shape corresponding to a peripheral edge of the rectangular substrate, and the second transport arm member is attached to the back surface of the peripheral edge of the rectangular substrate. a holding portion for holding the rectangular substrate, and movably supporting the second moving An arm member for changing an arm spacing adjustment mechanism of the second transfer arm member and movably supporting the arm interval adjustment mechanism to move the arm interval 1265906 (8) adjustment mechanism along the horizontal conveyance path a second arm slide mechanism; wherein the arm position adjustment mechanism adjusts a distance between the first transfer arm member on one side and the first transfer arm member on the other side to a size suitable for the rectangular substrate during transportation; When the vehicle is not transported, the distance between the first transfer arm members is increased more than the interval between the conveyance arms, and the first transfer arm member is retracted from the horizontal conveyance path, and the arm interval adjustment mechanism is conveyed. The distance between the two transfer arm members is adjusted to be suitable for the size of the rectangular substrate, and the distance between the two transfer arm members is narrower than when the conveyance is performed during non-transportation to make the second conveyance The arm member is retracted between the second processing unit and the third processing unit.