CN1461726A - Fragile sheel transporting device and fragile sheet processing - Google Patents

Fragile sheel transporting device and fragile sheet processing Download PDF

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Publication number
CN1461726A
CN1461726A CN03147208A CN03147208A CN1461726A CN 1461726 A CN1461726 A CN 1461726A CN 03147208 A CN03147208 A CN 03147208A CN 03147208 A CN03147208 A CN 03147208A CN 1461726 A CN1461726 A CN 1461726A
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China
Prior art keywords
carrying
substrate
arm
space
arm member
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Granted
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CN03147208A
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Chinese (zh)
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CN1260801C (en
Inventor
岸间泰一郎
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

The second an third internal substrate conveying device 120, 130 has substrate conveying parts 120a, 120b, 130a, 130b arranged in approximately symmetrical clamping a substrate G. The substrate conveying parts are provided with conveying arms 122a, 122b having retaining members 111a, 111b for retaining a periphery edge of the substrate G; an arm gap adjusting mechanism 123 for adjusting a gap between the conveying arms; and an arm slide mechanism 125 for sliding the arm gap adjusting mechanism 123 in a substrate conveying direction respectively. The footprint is made small by narrowing the gap between the conveying arms 122a, 122b at the time of non-conveying of the substrate and retreating the internal substrate conveying device 120 between a resist coating device (CT) 23a and a pressure reduction drying device (VD) 23b.

Description

Substrate transfer apparatus and substrate board treatment
Technical field
The invention relates to a kind of in the manufacturing of liquid crystal indicator (LCD), the substrate transfer apparatus of carrying large glass substrate and possess the substrate board treatment of this substrate transfer apparatus.
Background technology
In the photoetching process of LCD, go up with glass substrate (below, be called " LCD substrate " or " substrate ") at LCD and to form resist film, make the resist film exposure, develop, form the circuitous pattern of regulation.
Resist film is to adopt so-called spin-coating method to be coated with on substrate to form.Use spin-coating method, substrate absorption is remained on the capstan of resist-coating unit and supplies with resist liquid to substrate center,, resist liquid is expanded to above the whole base plate by means of the capstan rotational substrate with the cardinal principle flat-hand position.Then, substrate is transported to resist removes unit (edge remover) from the resist-coating unit, remove in the unit, remove no resist film from the peripheral part of substrate at resist.And then, board carrying to heating unit, is heated the temperature of regulation, the solvent in the volatilization resist film makes resist film stable.
Remove the board carrying of unit from the resist-coating unit to resist, carry out with special-purpose substrate transfer apparatus.Substrate transfer apparatus possesses a pair of carrying arm that is used to keep the substrate periphery.The interval that resist-coating unit and resist are removed the unit is set in the carrying arm distance that the carrying arm can not kept out of the way during the non-board carrying of carrying substrate.
Recently, be purpose to make large-screen lc TV etc., occurred surpassing on one side 1m such the processing object of large LCD substrate.Specifically, substrate size expands 1000 * 1200mm to from 850 * 1000mm.Like this, in order to carry superhuge like this substrate, just need the width and the interval of the carrying arm of expansion substrate transfer apparatus.
If enlarge the width and the interval of carrying arm, make the carrying arm not with transportation route in parts interfere, just need to enlarge the distance of removing from the resist-coating unit to resist the unit (forming the middle standby space of resist-coating or the resist-coating substrate transfer apparatus handling), but, as enlarge resist-coating/resist and remove the unit mutual spacing from, the problem that can generation device maximize, device has further increase at the indoor area occupied of clean (coverage).On the other hand, so because the decontamination chamber that LCD makes usefulness gigantism do not allow the bottom surface area occupied of device also bigger near the strong request of the party in request of limit point than conventional device.
And,, on the picture of final products, exist the what is called that becomes image deflects " to duplicate vestige " as the problem in the LCD manufacturing.What is called " is duplicated vestige, when being exactly the holding componentss such as substrate back contact vacuum suction packing ring behind the painting erosion resistant agent, because the heat affecting that contact produces makes resist thickness local variation, is being changed the image deflects that cooresponding zone, position takes place with this thickness.Duplicate the problem of vestige, at for example U.S. Pat P6,306, describe in detail in the 455B1 communique.In order to prevent such vestige that duplicates, the middle body (part that is equivalent to liquid crystal display picture) at carrying arm (vacuum suction packing ring etc.) the contact substrate back side that mustn't substrate transfer apparatus must make the carrying arm only contact from substrate outer peripheral edges 15mm with interior narrow range., in the substrate peripheral part with the substrate maximization tendency of carrying arm rigidity deficiency is arranged owing to will contact support sector's locator qualification, during transmission and in the carrying, substrate rocks on the carrying arm, easy deviation position.Therefore, carrying large substrate is safely and reliably expected by party in request.
Summary of the invention
The object of the present invention is to provide a kind of bottom surface occupied area (coverage) of not aggrandizement apparatus, and, can not duplicate vestige, safely and reliably the substrate transfer apparatus of carrying large LCD substrate and substrate board treatment equipped therewith.
As the 1st viewpoint of the present invention, the feature of board carrying portion is to possess: the cooresponding 2 carrying arm members of peripheral shape with shape and rectangular substrate; Be installed on the described carrying arm member, dock and keep the maintaining part of this rectangular substrate with the periphery back side of rectangular substrate; Movably support described 2 carrying arm members, change the arm space regulating mechanism of described 2 carrying arm member spaces; Movably support described arm space regulating mechanism, along the arm slide mechanism of the described arm space regulating mechanism of described level carrying path movement,
Described arm space regulating mechanism is regulated, so that when carrying, make the space of described 2 carrying arm members be suitable for the size of described rectangular substrate, when non-carrying, also narrow the space that described 2 spaces of carrying arm members narrow down to when carrying.
As the 2nd viewpoint of the present invention, substrate board treatment possesses: the level carrying path of carrying rectangular substrate; Be provided with along described level carrying path, rectangular substrate applied the 1st handling part of predetermined processing; Be provided with along described level carrying path, rectangular substrate applied the 2nd handling part of other predetermined processing; Has a pair of described level carrying path cardinal principle board carrying portion of subtend configuration symmetrically that clips, between described the 1st handling part and the 2nd handling part, by means of described a pair of board carrying portion substantially level keep rectangular substrate, along described level carrying path carrying, it is characterized in that
Described board carrying portion possesses: the cooresponding 2 carrying arm members of peripheral shape with shape and rectangular substrate; Be installed on the described carrying arm member, with the periphery back side of rectangular substrate to contacting and keep the maintaining part of this rectangular substrate; Movably support described 2 carrying arm members, change the arm space regulating mechanism of described 2 carrying arm member spaces; Movably support described arm space regulating mechanism, along the arm slide mechanism of the described arm space regulating mechanism of described level carrying path movement,
Described arm space regulating mechanism is regulated, so that when carrying, the space of described 2 carrying arm members is suitable for the size of described rectangular substrate, when non-carrying, space when narrowing down to the space of described 2 carrying arm members than carrying is also narrow
Described arm slide mechanism is kept out of the way between described the 1st handling part and described the 2nd handling part described 2 the carrying arm members after the space dwindles when non-carrying.
If adopt substrate transfer apparatus of the present invention and substrate board treatment, owing to can adjust the space of 2 carrying arm members, just can when non-board carrying, dwindle it at interval in the board carrying direction, make 2 carrying arm members keep out of the way assigned position.Therefore the space that the carrying arm member is kept out of the way needs can be dwindled, all bottom surface occupied areas of device can be reduced.And, use the occasion of this substrate transfer apparatus, when changing the size of substrate of carrying, can cooperate size of substrate, easily adjust the space of carrying arm member.Therefore, need not as existing, when each size of substrate changes,, carry out the operator and change the so miscellaneous processing in installation site in order to make the interval of space for stipulating of carrying arm member.
As the 3rd viewpoint of the present invention, the feature of substrate transfer apparatus is to possess: the cooresponding carrying arm member of peripheral shape with shape and rectangular substrate; Be installed on the described carrying arm member, dock and keep the maintaining part of this rectangular substrate with the periphery back side of rectangular substrate; Movably support described carrying arm member, move described carrying arm member, make the arm position adjusting mechanism of the relative substrate advance and retreat of described carrying arm member in the direction vertical with described carrying path; Movably support described arm position adjusting mechanism, along the arm slide mechanism of the described arm position adjusting mechanism of described level carrying path movement,
Described arm position adjusting mechanism is regulated, so that when carrying, make the space of the carrying arm member of the carrying arm member of a side and opposite side be suitable for the size of described rectangular substrate, when non-carrying, the space when narrowing down to the space of described carrying arm member than carrying is also narrow.
As the 4th viewpoint of the present invention, substrate board treatment possesses: the level carrying path of carrying rectangular substrate is provided with along described level carrying path, rectangular substrate is applied the 1st handling part of predetermined processing; Be provided with along described level carrying path, rectangular substrate applied the 2nd handling part of other predetermined processing; Has a pair of described level carrying path cardinal principle board carrying portion of subtend configuration symmetrically that clips, between described the 1st handling part and the 2nd handling part, by means of described a pair of board carrying portion substantially level keep rectangular substrate, and the substrate transfer apparatus of carrying along described level carrying path, it is characterized in that
Described board carrying portion possesses: the cooresponding carrying arm member of peripheral shape with shape and rectangular substrate; Be installed on the described carrying arm member, dock and keep the maintaining part of this rectangular substrate with the periphery back side of rectangular substrate; Movably support described carrying arm member, move described carrying arm member, make the arm position adjusting mechanism of the relative substrate advance and retreat of described carrying arm member in the direction vertical with described carrying path; Movably support described arm position adjusting mechanism, and along the arm slide mechanism of the described arm position adjusting mechanism of described level carrying path movement,
Described arm position adjusting mechanism is regulated, so that when carrying, make the space of the carrying arm member of the described carrying arm member of a side and opposite side be suitable for the size of described rectangular substrate, when non-carrying, space when expanding to the space of described carrying arm member than carrying is also big, keeps out of the way described carrying arm member from described level carrying path.
If adopt the substrate transfer apparatus and the substrate board treatment of the 3rd and the 4th viewpoint, because can make the carrying arm member in the direction vertical with the board carrying direction keeps out of the way, can shorten the interval of the 1st handling part and the 2nd handling part, thus can reduction means bottom surface area occupied.Such substrate transfer apparatus is applicable to that for example, the wide occasion of the 2nd handling part is compared in the space of the direction vertical with the board carrying direction in the 1st handling part.
As the 5th viewpoint of the present invention, substrate board treatment possesses: the level carrying path of carrying rectangular substrate is provided with along described level carrying path, rectangular substrate is applied the 1st handling part of predetermined processing; Be provided with along described level carrying path, rectangular substrate applied the 2nd handling part of other predetermined processing; Be provided with along described level carrying path, rectangular substrate is applied the 3rd handling part of other predetermined processing in addition; Have a pair of described level carrying path and the board carrying portion of subtend configuration symmetrically substantially of clipping, between described the 1st handling part and the 2nd handling part, keep rectangular substrate by means of described a pair of the 1st board carrying portion cardinal principle on even keel, and the 1st substrate transfer apparatus of carrying along described level carrying path; And have a pair of clip described level carrying path and substantially symmetrical subtend dispose the 2nd board carrying portion, between described the 2nd handling part and the 3rd handling part, keep rectangular substrate by means of described a pair of the 2nd board carrying portion cardinal principle on even keel, and the 2nd substrate transfer apparatus of carrying along described level carrying path, it is characterized in that
Described the 1st board carrying portion possesses: cooresponding the 1st carrying arm member of peripheral shape with shape and rectangular substrate; Be installed on described the 1st carrying arm member, dock and keep the maintaining part of this rectangular substrate with the periphery back side of rectangular substrate; Movably support described the 1st carrying arm member, move described the 1st carrying arm member, make the arm position adjusting mechanism of the relative substrate advance and retreat of described the 1st carrying arm member in the direction vertical with described carrying path; Movably support described arm position adjusting mechanism, along the arm slide mechanism of the described arm position adjusting mechanism of described level carrying path movement,
Described the 2nd board carrying portion possesses: cooresponding 2 the 2nd carrying arm members of peripheral shape with shape and rectangular substrate; Be installed on described the 2nd carrying arm member, dock and keep the maintaining part of this rectangular substrate with the periphery back side of rectangular substrate; Movably support described the 2nd carrying arm member, change the arm space regulating mechanism of the space of described the 2nd carrying arm member; Movably support described arm space regulating mechanism, along the 2nd arm slide mechanism of the described arm space regulating mechanism of described level carrying path movement,
Described arm position adjusting mechanism is regulated, so that when carrying, the space that makes the 1st of a side carry the 1st carrying arm member of arm member and opposite side is suitable for the size of described rectangular substrate, when non-carrying, space when expanding to the space of described the 1st carrying arm member than carrying is also big, described the 1st carrying arm member is kept out of the way from described level carrying path
Described arm space regulating mechanism is regulated, so that when carrying, make the space of described 2 carrying arm members be suitable for the size of described rectangular substrate, when non-carrying, space when narrowing down to the space of described 2 carrying arm members than carrying is also narrow, and the 2nd carrying arm member is kept out of the way between described the 2nd handling part and the 3rd handling part.
Description of drawings
Fig. 1 is the general view of resist-coating and developing system.
Fig. 2 is the summary side elevation of the 1st thermal treatment unit portion of expression resist-coating and developing system.
Fig. 3 is the summary side elevation of the 2nd thermal treatment unit portion of expression resist-coating and developing system.
Fig. 4 is the summary side elevation of the 3rd thermal treatment unit portion of expression resist-coating and developing system.
Fig. 5 is the inside perspective view of expression resist-coating processing unit.
Fig. 6 is the summary side elevation of the inlet side (substrate transfer part) of expression resist-coating processing unit.
Fig. 7 is the square planar view of the board carrying portion of expression the 1st internal base plate Handling device.
Fig. 8 is the amplification profile of holding member.
Fig. 9 is the square planar view of the board carrying portion of expression the 2nd internal base plate Handling device.
Figure 10 A is the planar view of arm space regulating mechanism, and Figure 10 B is the lateral plan of arm space regulating mechanism.
The specific embodiment
Below, embodiments of the present invention will be described in detail with reference to the accompanying drawings.Here, with the occasion that the present invention is applicable to the resist-coating processing unit that carries out following a succession of processing is example, promptly liquid crystal indicator (LCD) with substrate (below, be called " LCD substrate " or " substrate ") last painting erosion resistant agent liquid, coating forms resist film, under reduced pressure keeping resist film to carry out drying then handles, then, remove the formed resist film of LCD substrate periphery need not the part a succession of processing, to possessing this resist-coating processing unit, always carry out from cleaning the LCD substrate, and then resist-coating is handled, resist-coating and development processing apparatus up to development treatment describe.Fig. 1 is the planar view that the summary of expression resist-coating and developing system constitutes.
Resist-coating and developing system 100 possess: mounting is accommodated the cassette arrangement (moving into the portion of taking out of) 1 of the wafer case C of a plurality of substrate G; Possesses the processing equipment (handling part) 2 that a plurality of processing units are used for substrate G is implemented a succession of processing that comprises resist-coating and development; And be used for and exposure device 4 between carry out the interface arrangement (interface portion) 3 that substrate G transmits, and dispose cassette arrangement 1 and interface arrangement 3 respectively at the two ends of processing equipment 2.In addition, among Fig. 1, the length direction of resist-coating and developing system 100 is made as directions X, vertical with directions X in the plane direction is made as the Y direction.
Cassette arrangement 1 possesses: can be in the mounting table 9 of Y direction mounting wafer case arranged side by side C, and and processing equipment 2 between be used to carry out substrate G and move into the Handling device 11 of taking out of, between this mounting table 9 and outside, carry out wafer case C carrying.And, Handling device 11 has board carrying pickup 11a, can on the carrying path 10 that is provided with along Y direction, move,, between wafer case C and processing equipment 2, carry out moving into of substrate G and take out of by means of board carrying pickup 11a as wafer case C orientation.
Processing equipment 2 has the substrate G that extends at directions X basically and carries with parallel 2 transportation route A, B, the 1 one side direction interface arrangements 3 along transportation route A from cassette arrangement are being arranged scouring clean unit (SCR) the 21, the 1st thermal treatment unit portion 26, resist-coating processing unit 23 and the 2nd thermal treatment unit portion 27.And 3 are arranging the 2nd thermal treatment unit portion 27, development treatment unit (DEV) 24, i line UV illumination unit (i-UV) 25 and the 3rd thermal treatment unit portion 28 towards cassette arrangement 1 along transportation route B from interface arrangement.
On a upstream part of cleaning clean unit (SCR) 21, be provided with excimers UV illumination unit (e-UV) 22.Excimers UV illumination unit (e-UV) 22 is set, is used for removing the organic matter of substrate G before cleaning cleaning, i line UV illumination unit (i-UV) 25 is set, the decolouring that is used to develop is handled.
Just clean clean unit (SCR) 21, on one side one side cardinal principle horizontal attitude carrying substrate G carries out clean and dry the processing therein.Equally, for development treatment unit (DEV) 24, on one side horizontal attitude carrying substrate G carries out development treatment substantially on one side therein, flushing is handled and dry the processing.Clean clean unit (SCR) 21 and development treatment unit (DEV) 24 with regard to these, the carrying of substrate G is for example carried by roller carrying or belt conveyor and is carried out, and at opposed minor face moving into mouth and taking out of mouth of substrate G is set.And, to i line UV illumination unit (i-UV) 25 carrying substrate G, by carrying out continuously with the same mechanism of the carrying mechanism of development treatment unit (DEV) 24.
In resist-coating unit 23, dispose in the following order: by the substrate G that keeps to the about level resist liquid that drips, way with regulation rotational speed substrate G makes resist liquid expand to resist-coating device (CT) 23a that whole base plate G went up and formed resist film; Make substrate G go up decompression dry device (VD) 23b of the resist film drying under reduced pressure that forms; Remove the periphery resist of the unnecessary resist that adheres to substrate G periphery and remove device (ER) 3c by searching for solvent ejecting head around the substrate G.
The inside of resist-coating unit 23 is being communicated with the transfer unit (PASS) 65 of being located at thermal treatment unit parts described later (TB) 32 and the transfer unit (PASS) 69 of being located at thermal treatment unit parts (TB) 34.Board carrying from transfer unit (PASS) 65 toward resist-coating device (CT) 23a carries out with the 1st internal base plate Handling device 110 (with reference to Fig. 5), board carrying from resist-coating device (CT) 23a toward decompression dry device (VD) 23b carries out with the 2nd internal base plate Handling device 120, the board carrying of removing device (ER) 23c from decompression dry device (VD) 23b toward the periphery resist carries out with the 3rd internal base plate Handling device 130, and the board carrying of removing the past transfer unit (PASS) 69 of device (ER) 23c from the periphery resist carries out with the 4th internal base plate Handling device 140.
The 1st thermal treatment unit portion 26 has 2 the thermal treatment unit parts (TB) 31,32 that apply the stacked formation of hot-cured thermal treatment unit to substrate G, thermal treatment unit parts (TB) 31 are located at and are cleaned clean unit (SCR) 21 1 sides, and thermal treatment unit parts (TB) 32 are located at resist-coating unit 23 1 sides.Be provided with the 1st Handling device 33 between these 2 thermal treatment unit parts (TB) 31,32.
As shown in Figure 2, the thermal treatment unit parts (TB) 31 of the 1st thermal treatment unit portion 26 have from following order and will carry out transfer unit (PASS) 61 that substrate G transmits, substrate G be dewatered unit (DHP) 62 and 63 is cured in 2 dehydrations of curing processing, the processing unit (AD) 64 that adheres to that substrate G is implemented that hydrophobization handles is laminated into four-pole and constitutes.And, thermal treatment unit parts (TB) 32 have from following order will carry out 2 cooling units (COL) 66 and 67 of path unit (PASS) 65 that substrate G transmits, cooling base G, the processing unit (AD) 68 that adheres to that substrate G is implemented that hydrophobization handles is laminated into four-pole and constitutes.
The 1st Handling device 33, carry out the reception of the substrate G of clean unit (SCR) 21 by transfer unit (PASS) 6, between above-mentioned thermal treatment unit, carry out moving into/taking out of of substrate G, and pass through transfer unit (PASS) 65 to resist-coating unit 23 transferring substrates G.
The 1st Handling device 33 has: but the guide rail 91 that extends up and down, along the Lift Part 92 of guide rail 91 liftings, at the supporting member 93 that rotatably is provided with on the Lift Part 92, forward-reverse ground is provided with and the substrate keeping arm 94 of maintenance substrate G on supporting member 93.And the lifting of Lift Part 92 is carried out by motor 95, and the rotation of supporting member 93 is carried out by motor 96, and moving forward and backward by motor 97 of substrate keeping arm 94 carried out.Such the 1st Handling device 33 can move up and down, moves forward and backward, rotatablely move, and can both conduct interviews to arbitrary unit of thermal treatment unit parts (TB) 31,32.
The 2nd thermal treatment unit portion 27 has and will substrate G be applied 2 thermal treatment unit parts (TB) 34 and 35 of the stacked formation of hot-cured thermal treatment unit, thermal treatment unit parts (TB) 34 are located at resist-coating unit 23 1 sides, and thermal treatment unit parts (TB) 35 are located at development treatment unit (DEV) 24 1 sides.And, between these 2 thermal treatment unit parts (TB) 34 and 35, be provided with the 2nd Handling device 36.
As shown in Figure 3, the thermal treatment unit parts (TB) 34 of the 2nd thermal treatment unit portion 27 form from following order will carry out substrate G transmission transfer unit (PASS) 69 and to substrate G carry out pre-bake treatment 3 prebake unit (PREBAKE) 70,71, reach 72 and be laminated into 4 grades formation.And thermal treatment unit parts (TB) 35 form from the cooling unit (COL) 74 of the following transfer unit (PASS) 73 that will carry out substrate G transmission in proper order, cooling base G, 2 prebake unit (PREBAKE) 75 and 76 that substrate G is carried out pre-bake treatment and are laminated into 4 grades formation.
The 2nd Handling device 36, receive the substrate G of resist-coating unit 23 by transfer unit (PASS) 69, between above-mentioned thermal treatment unit, move into/take out of substrate G, to development treatment unit (DEV) 24 transferring substrates G, and the expansion cooling bench (EXTCOL) as the substrate transfer part of aftermentioned interface arrangement 3 transmitted and receives substrate G by transfer unit (PASS) 73.In addition, the 2nd Handling device 36 has and the 1st Handling device 33 same configuration, can both conduct interviews to arbitrary unit of thermal treatment unit parts (B) 34 and 35.
The 3rd thermal treatment unit portion 28 has 2 the thermal treatment unit parts (TB) 37 and 38 that substrate G applied the stacked formation of hot-cured thermal treatment unit, thermal treatment unit parts (TB) 37 are located at development treatment unit (DEV) 24 1 sides, and thermal treatment unit parts (TB) 38 are located at cassette arrangement 1 one sides.Between these 2 thermal treatment unit parts (TB) 37 and 38, be provided with the 3rd Handling device 39.
As shown in Figure 4, the thermal treatment unit parts (TB) 37 of the 3rd thermal treatment unit portion 28 have from following order and will carry out transfer unit (PASS) 77 that substrate G transmits, cure after substrate G is carried out and cure unit (POBAKE) 78,79,80 behind 3 of processing and be laminated into four-pole and constitute.And, thermal treatment unit parts (TB) 38, have from following order with after cure unit (POBAKE) 81, carry out the transmission cooling unit (PASSCOL) 82 of the transmission of substrate G and cooling, cure after substrate G is carried out and cure unit (POBAKE) 83 and 84 behind 2 of processing and be laminated into four-pole and constitute.
The 3rd Handling device 39 is received the substrate G by the i line UV illumination unit (i-UV) 25 of transfer unit (PASS) 77, moves into/take out of substrate G between above-mentioned thermal treatment unit, by transmitting cooling unit (PASSCOL) 82 to cassette arrangement 1 transferring substrates G.In addition, the 3rd Handling device 39 also has with the 1st Handling device 33 same configuration and can both visit arbitrary unit of thermal treatment unit parts (TB) 37 and 38.
In processing equipment 2, in order to constitute 2 row transportation route A, B as above, and be essentially processing sequence configuration each processing unit and Handling device, between these transportation routes A-B, space 40 is set.And, shuttle (substrate-placing parts) 41 can reciprocatingly be set in this space 40.This shuttle 41 constituted to keep substrate G,, between transportation route A-B, carry out the transmission of substrate G by shuttle 41.By means of above-mentioned the 1st to the 3rd Handling device 33,36,39, carry out the transmission of substrate G with respect to shuttle 41.
Interface arrangement 3 has: carry out the Handling device 42 that substrate G moves into/takes out of between processing equipment 2 and exposure device 4; The buffer table (BUF) 43 of configuration buffer pocket; Expansion cooling bench (EXTCOL) 42 as the substrate transfer part that possesses refrigerating function is adjacent to the external device (ED) parts 45 that Handling device 42 is provided with stacked on top of one another captions video camera (TITLER) and peripheral exposure device (EE).Handling device 42 possesses board carrying arm 42a, with this board carrying arm 42a, carries out moving into/taking out of of substrate G between processing equipment 2 and exposure device 4.
Like this in resist-coating of Gou Chenging and the developing system 100, at first, with the substrate G in the wafer case C of configuration on the mounting table 9 of cassette arrangement 1, directly move into the excimers UV illumination unit (e-UV) 22 of processing equipment 2 with Handling device 11, clean pre-processing.Secondly,, substrate G is moved into scouring clean unit (SCR) 21, clean clean with the roller carrying of for example a plurality of rollers 16.After cleaning clean, substrate G takes out of the transfer unit (PASS) 61 of the thermal treatment unit parts (TB) 31 that belong to the 1st thermal treatment unit portion 26 for example with the roller carrying.
At first, will be disposed at the substrate G of transfer unit (PASS) 61, the dehydration that is transported to thermal treatment unit parts (TB) 31 is cured in any of unit (DHP) 62 and 63 and is carried out furnace run.Secondly substrate G is transported to thermal treatment unit parts (TB) 32 cooling unit (COL) 66 and 67 any in cool off after, in order to improve the anchorage of resist, be transported to thermal treatment unit parts (TB) 31 adhere to processing unit (AD) 64 or thermal treatment unit parts (TB) 32 adhere to processing unit (AD) 68, handle (hydrophobization processing) so carry out tack by HMDS.Then, substrate G is transported in any of cooling unit (COL) 66 and 67 and is cooled off, and then be transported to the transfer unit (PASS) 65 of thermal treatment unit parts (TB) 32.Carry out the transportation processing of the substrate G when so a succession of processing, all carry out by the 1st Handling device 33.
To be disposed at the substrate G of transfer unit (PASS) 65, move in the resist-coating unit 23 by the 1st internal base plate Handling device 110 (with reference to Fig. 5).At first substrate G is moved among resist-coating device (CT) 23a, give substrate G spin-coating erosion resistant agent liquid there.Secondly, with the 2nd internal base plate Handling device 120 (with reference to Fig. 5) substrate G is transported among decompression dry device (VD) 23b, there drying under reduced pressure.
Then with the 3rd internal base plate Handling device 130 (with reference to Fig. 5) substrate G being transported to the periphery resist removes device (ER) 23c, removes unnecessary resist from substrate G periphery there.And, after removing the end of periphery resist, with the 4th internal base plate Handling device 140 (with reference to Fig. 5) substrate G is taken out of from resist-coating unit 23, pass to the transfer unit (PASS) 69 of the thermal treatment unit parts (TB) 34 that belong to the 2nd thermal treatment unit portion 27.
Be disposed at the substrate G of transfer unit (PASS) 69, by means of the 2nd Handling device 36, be transported in any of prebake unit (PREBAKE) 75,76 of the prebake unit (PREBAKE) 70,71,72 of thermal treatment unit parts (TB) 34 and thermal treatment unit parts (TB) 35 and carry out pre-bake treatment, be transported to the cooling unit (COL) 74 of thermal treatment unit parts (TB) 35 then, be cooled to set point of temperature.And, and then, be transported to the transfer unit (PASS) 73 of thermal treatment unit parts (TB) 35 by means of the 2nd Handling device 36.
Then, substrate G is sent to the expansion cooling bench (EXTCOL) 44 of interface arrangement 3 with the 2nd Handling device 36, be transported to the peripheral exposure device (EE) of external device (ED) parts 45 by the Handling device 42 of interface arrangement 3, expose and be used to remove peripheral resist, then be transported to exposure device 4 with Handling device 42, make the resist film exposure on the substrate G there, form the figure of regulation.After according to circumstances accommodating in the buffer pocket on the buffer table (BUF) 43 sometimes, be transported to exposure device 4 to substrate G.
Behind the end exposure, the captions video camera (TITLER) of substrate G being moved into the upper strata of external device (ED) parts 45 with the Handling device 42 of interface arrangement 3 also is after the substrate G recording prescribed information, to be positioned on the expansion cooling bench (EXTCOL) 44.Substrate G is relocated to the transfer unit (PASS) 73 of the thermal treatment unit parts (TB) 35 that belong to the 2nd thermal treatment unit portion 27 with the 2nd Handling device 36 from expansion cooling bench (EXTCOL) 44.
Employing makes the carrying mechanism that extends to development treatment unit (DEV) 24 from transfer unit (PASS) 73, the way of roller carrying mechanism work for example, substrate G is moved into development treatment unit (DEV) 24 from transfer unit (PASS) 73, implement development treatment there.In the development treatment, at first give substrate G coating developer solution, form the hole of developer solution, during with specified speed specified time carrying substrate G, carry out developing reaction.Then, stop the carrying of substrate G,, the developer solution on the LCD substrate is fallen, and then pure water is sprayed onto on the substrate G, developing reaction is stopped by substrate G is become inclination attitude.And then, with cardinal principle flat-hand position one side carrying substrate G, to substrate G supply pure water wash on one side, so that do not stay the developer solution residue, then, substrate G is blown out dry air make substrate G drying.
Such development treatment is used the bonded assembly carrying mechanism after finishing, and substrate G is transported to i line UV illumination unit (i-UV) 25 from development treatment unit (DEV) 24, there substrate G is implemented decolouring and handles.Then, by means of the roller carrying mechanism 16 (roller transfer station) in the i line UV illumination unit (i-UV) 25, substrate G is taken out of the transfer unit (PASS) 77 of the thermal treatment unit parts (TB) 37 that belong to the 3rd thermal treatment unit portion 28.
The substrate G that will be disposed at transfer unit (PASS) 77 with the 3rd Handling device 39 be transported to thermal treatment unit parts (TB) 37 after cure unit (POBAKE) 78,79,80 and thermal treatment unit parts (TB) 38 after cure unit (POBAKE) 81,82,83 any unit cure after the processing after carrying out, be transported to the transmission cooling unit (PASSCOL) 82 of thermal treatment unit parts (B) 38 and be cooled to after the set point of temperature, by the Handling device 11 of cassette arrangement 1, be housed in the regulation wafer case C of cassette arrangement 1.
Then, describe structure and the substrate G carrying form between in-to-in substrate G carrying form, transfer unit (PASS) 65 and the resist-coating unit 23 and the LCD board carrying form between resist-coating unit 23 and the transfer unit (PASS) 65 of relevant resist-coating unit 23 in detail.
Fig. 5 is the schematic plan view of the general structure of expression resist-coating unit 23 and transfer unit (PASS) 65 and transfer unit (PASS) 69.
Transfer unit (PASS) 65 has the bench board 101 of mounting substrate G and runs through the lift pin 102 of the mode of bench board 101 in the assigned position setting up and down, and, the 1st internal base plate Handling device 110 of carrying substrate G is set from the zone of transfer unit (PASS) 65 up to resist-coating device (CT) 23a.The 1st internal base plate Handling device 110 possesses a pair of board carrying 110a of portion and 110b.A pair of board carrying 110a of portion and 110b clip the substrate G on the bench board 101, and cardinal principle is arranged opposite symmetrically.
Resist-coating device (CT) 23a has and keeps substrate G and rotation freely and lifting capstan 51 and the substrate G that keeps on the capstan 51 and the coating cup 50 that disposes freely.With regard to capstan 51, for example, be fit to use vacuum suction to keep the mode of substrate G.
Decompression dry device (VD) 23b has mounting substrate G lifting bench board 55 and inner decompression chamber 52 of accommodating mounting substrate G on the bench board 55 freely.On the surface of bench board 55, be provided with anchor (scheming not shown), form with a support LCD substrate at assigned position.Decompression chamber 52 is made of bottom container and loam cake, rises at loam cake and opens the state of decompression chamber 52, substrate G is moved into bench board 55, or take out of substrate G from bench board.
Device (ER) removed by the periphery resist but 23c has the bench board 54 of mounting substrate G and decaptitates 53 along removing of moving of each the limit rectilinearity of substrate G of mounting on the bench board 54.Remove and to decaptitate 53, on one side unidirectional walking spray certain amount of solvent on one side, dissolving is attached to the resist of substrate G periphery, thereby attracts to reclaim the resist that dissolves like this and the solvent of ejection.Like this, the resist of dissolving just can not be to substrate G internal extended.
In resist-coating processing unit 23 inside, be provided with from resist-coating device (CT) 23a to the 2nd internal base plate Handling device 120 of decompression dry device (VD) 23b carrying substrate G with remove the 3rd internal base plate Handling device 130 of device (ER) 23c carrying substrate G to the periphery resist from decompression dry device (VD) 23b.The 2nd internal base plate Handling device 120 is kept out of the way when non-board carrying between resist-coating device (CT) 23a and decompression dry device (VD) 23b, and the 3rd internal base plate Handling device 130 then keeps out of the way decompression dry device (VD) 23b when non-board carrying and the periphery resist is removed between device (ER) 23c.
As shown in Figure 6, substrate G is transported on the roller platform 16 in pass box 65, changes to and rest on the entrance side bench board 101.Then, with lift cylinder 103 a plurality of pins 102 are risen, the hole 101a by bench board 101 makes pole 102 outstanding from bench board 101.With pin 102 substrate G is lifted to specified altitude position, bench board 101 top.
Then, the 1st internal base plate Handling device 110 from about a pair of board carrying 110a of portion, 110b are reached under the substrate G, pin 102 is descended.Like this, substrate G is transferred on a pair of board carrying 110a of portion, the 110b from pole 102.By means of the 1st internal base plate Handling device 110 along directions X carrying substrate G.
In addition, same with entrance side pass box 65, a side also can be provided with roller platform 16 in bench board 103 downstreams of outlet side pass box 69.After substrate G passed to bench board 103 from the 4th internal base plate Handling device 140, take out of by roller platform 16.
Fig. 7 is a planar view of representing side's board carrying 110a of portion of the 1st internal base plate Handling device 110 in detail.In addition, a pair of board carrying 140a of portion, the 140b of the opposing party's board carrying 110b of portion and the 4th internal base plate Handling device 140, the 110a of the board carrying portion structure with a side is identical in fact, thereby omits its explanation.
The 110a of board carrying portion has: be equipped with the holding member 111a of maintenance LCD substrate periphery and the carrying arm 112 of 111b; Make the arm position adjusting mechanism 113 that moves of carrying arm 112 in the Y direction; In the arm travel mechanism 115 that directions X (board carrying direction) moves arm position adjusting mechanism 113.
Carrying arm 112 possesses: the place ahead arm member 112a that keeps board carrying direction (directions X) the place ahead one side group plate circumference; The rear arm member 112b that keeps board carrying direction (directions X) rear one side group plate circumference; The binding parts 112c that can link these front and back arm member 112a, 112b slidably; Make arm member 112a before and after these in the Y direction, 112b advances or the arm position adjusting mechanism 113 that retreats.
Front and back arm member 112a, 112b, the shape of projection is respectively L font substantially on horizontal surface, and L word bar one end links parts 112c with arm and interlinks.That is, will carry arm 112 and be assembled into, and make its all horizontal surface projection of shape be cardinal principle U font, keep being equivalent to directions X circumference and the Y direction circumference of half substrate G.
Front and back a pair of carrying arm 112a, 112b last a plurality of local install 2 kinds of holding member 111a, 111b.The 1st holding member 111a from outstanding to the inside installation of the about mid point of L word shape bar of two carrying arm 112a, 112b, adds up to 4 respectively.These the 1st holding members 111a possesses the absorption packing ring 203 (with reference to Fig. 8) that is adsorbed in the substrate G back side as described later.The 2nd holding member 111b is near the L word shape boom end of two carrying arm 112a, 112b and install 4 near curve respectively, and then installs 1 in arm position adjusting mechanism 113 length directions central authorities, adds up to 9.These the 2nd holding members 111b is support substrate G simply just.
Like this, the 110a of board carrying portion of a side possesses 4 the 1st holding member 111a and 9 the 2nd holding member 111b.Therefore, with regard to whole the 1st internal base plate Handling devices 110, should possess 8 the 1st holding member 111a of total and add up to 18 the 2nd holding member 111b.
Arm position adjusting mechanism 113 has: have the pole 207 of Y direction extension and be incorporated in the slidably rod-free cylinder 116 of slide block 208 of Y direction with these pole 207 embeddings; Has the guide rail 210 that extends in the Y direction; Be incorporated in slidably slide block 211 of Y direction with this 210 embedding; The base station 114 that keeps rod-free cylinder 116 and guide rail 210.
Slide block 208 is to adopt from substrate G side or its opposition side of Y direction air is imported its in-to-in way, in the Y direction slidably.Employing links the way that parts 112C links and slide block 208 is slided in the Y direction with the top of slide block 208 with arm, can make carrying arm 112 advance and retreat with respect to the substrate G of mounting on the bench board 101.The end of pole 207 is fixed on terminal component 209a, 209b, and this terminal component 209a, 209b are fixed on the base station 114.
And the top of slide block 211 also links with binding parts 112c.The function that slide block 211 self does not have voluntarily, but when slide block 208 is slided, because the slide block 211 that is embedded in guide rail 210 can improve the action stability of carrying arm 112 like this with slide block 208 parallel moving.At the Y of guide rail 210 direction end, be fixed with terminal component 212a and 212b.
On the base station 114, a pair of drg 214a, 214b are installed, are used to prevent to make the slip of carrying arm 112 when the Y direction is slided excessive, and carry the location of arm 112 at Y direction end.And, link the braking receiver 215 that is provided with on the parts 112c with drg 214a, 214b butt at arm.When sliding carrying arm 112,, locate carrying arm 112 respectively at Y direction end by braking receiver 215 butt drg 214a or drg 214b with slide block 208.
Between transfer unit (PASS) 65 and transfer unit (PASS) 69, be provided with the guide rail 217 that extends at directions X.Arm travel mechanism 115 has to make with the chimeric binding parts 218 of this guide rail 217 with at directions X and links the directions X carrying mechanism 219 that parts 218 slide.Base station 114 is attached to and links parts 218, therefore can arm position adjusting mechanism 113 be slided at directions X, can the carrying arm 112 that slide be slided at directions X.As directions X carrying mechanism 219, can adopt cylinder, belt conveyor Handling device, ball-screw Handling device etc.
Among Fig. 7, represent substrate G to be moved into the retreating position of the carrying arm 112 when entering a side bench board 101 from the 1st Handling device 33 with solid line, and, represent to make carrying arm 112 to entering the position that a side bench board 101 advances with long and two-short dash line.Like this with regard to the 1st internal base plate Handling device 110, keep out of the way Y direction end in the transfer unit (PASS) 65 owing to can make carrying arm 112, so can dwindle the interval of transfer unit (PASS) 65 and resist-coating device (CT) 23a, reduce the coverage (foot-print) of resist-coating processing unit 23.Particularly, substrate G is large-scale occasion, significantly presents the effect that reduces coverage.The 1st internal base plate Handling device 110 is because that the needed area of this G of treatment substrate in fact of transfer unit (PASS) 65 is compared with resist-coating device (CT) 23a etc. is narrow, so be applicable to the occasion of guaranteeing the Y director space easily.In addition, the weight of 1000mm * 1200mm size substrate G is about 3kg, and the transporting velocity of the 1st internal base plate Handling device 110 is that 1000～1500mm/ is about second.
Fig. 8 is the more detailed construction section-drawing of expression the 1st holding member 111a.
The 1st holding member 111a has: the cartridge 201 that inner space 201a is arranged; Be used for installing the installing component 202 of cartridge 201 to carrying arm 112; Be installed on the absorption packing ring 203 of cartridge 201 upper ends; The packing ring fixed parts 204 of fixing absorption packing ring 203 on cartridge 201.Be provided with the relief line 205 that is communicated with vacuum pump (scheming not shown) in the lower end of cartridge 201, can make the inner space 201a decompression of simple shape parts 201.The top formation hole 203a of portion of absorption packing ring 203, when reducing pressure in the inner space 201a that makes cartridge 201, the 203a of this hole portion absorption substrate G, absorption and maintenance substrate G on absorption packing ring 203.
In case substrate G is adsorbed in above the absorption packing ring 203,, deflects into spill on the whole because substrate G is only kept by peripheral part (in substrate outer circumference end 15mm).Absorption packing ring 203 is by the soft material of abrasion performance and excellent corrosion resistance, and for example the such flexible material of viton (trade name of Viton) constitutes.Therefore, according to the bending direction of substrate G, make absorption packing ring 203 fascinate/in addition,, when then substrate G is crooked, often on the absorption packing ring, can not keep substrate G with the interval occurring between the substrate G if use the absorption packing ring that can not fascinate., use the 1st holding member 111a, the advantage that can keep deflecting into the spill substrate is conscientiously then arranged.
The 2nd internal base plate Handling device 120 has a pair of board carrying 120a of portion, the 120b in the symmetrical arranged opposite of Y direction cardinal principle, the 3rd internal base plate Handling device 130 has a pair of board carrying 130a of portion, the 130b in the symmetrical arranged opposite of Y direction cardinal principle, the 2nd internal base plate Handling device 120 constitutes identical in fact with the 3rd internal base plate Handling device 130, thereby below, represent both that the 2nd internal base plate Handling device 120 only is described.
Fig. 9 is a planar view of representing side's board carrying 120a of portion of the 2nd internal base plate Handling device 120 in detail.In addition, a pair of board carrying 130a of portion, the 130b of the opposing party's board carrying 120b of portion and the 3rd internal base plate Handling device 130, the 120a of the board carrying portion formation with a side is identical in fact, thereby omits its explanation.
The 120a of board carrying portion has: there are a pair of carrying arm member 122a, 122b in a left side that possesses 2 kinds of holding member 111a, 111b being used to keep the substrate periphery; The arm space regulating mechanism 123 that these carrying arm members 122a, 122b are slided at directions X; The arm slide mechanism 125 that arm space regulating mechanism 123 is slided at directions X.
Pair of right and left carrying arm member 122a, 122b make the shape of about L font respectively.Make directions X the place ahead one side periphery of the carrying arm member 122a maintenance substrate G on right side, make the directions X rear one side periphery of the carrying arm member 122b maintenance substrate G in left side.Be installed on the 1st holding member 111a and the 2nd holding member 111b of two carrying arm member 122a, 122b, identical with the holding member that is installed on above-mentioned the 1st internal base plate Handling device 110 in fact.The 1st holding member 111a gives prominence to the inside and installs respectively from the about mid point of L word shape bar of two carrying arm member 122a, 122b, adds up to 4.These the 1st holding members 111a possesses absorption packing ring 203.The 2nd holding member 111b installs 4 and then install 1 in the length direction central authorities of arm space regulating mechanism 123 near 2 and the curve installing near the L word shape boom end of two carrying arm member 122a, 122b, adds up to 7.These the 2nd holding members 111b is support substrate G merely only.
Like this, the 120a of board carrying portion of a side possesses 4 the 1st holding member 111a and 7 the 2nd holding member 111b.Therefore, during the 2nd internal base plate Handling device 120 is whole, possesses the 1st holding member 111a that adds up to 8 and add up to 14 the 2nd holding member 111b.
Arm space regulating mechanism 123 has: have the bar 221a that extends at directions X and be fitted to bar 221a and at directions X the 1st rod-free cylinder 126a of slide block 222a slidably; Have the bar 221b that extends at directions X and be fitted to bar 221b and at directions X the 2nd rod-free cylinder 126b of slide block 222b slidably; Guide rail 223 in the directions X extension; Be incorporated in directions X slidably 2 slide block 224a, 224b with these guide rail 223 embeddings; The binding parts 225a that links slide block 222a and slide block 224a; The binding parts 225b that links slide block 222b and slide block 224b; The base station 124 that keeps the 1st rod-free cylinder 126a and the 2nd rod-free cylinder 126b and guide rail 223.1 the 2nd holding member 111b only is installed on the base station 124.The 2nd holding member 111b, support substrate peripheral part mid point on one side.
Slide block 222a, 222b are by the place ahead one side or rear one side from board carrying direction (directions X) air to be imported its inside, at directions X slidably.On the other hand, slide block 224a, 224b self do not have the function that moves voluntarily., because these slide blocks 224a, 224b link up by linking parts 225a, 225b and slide block 222a, 222b respectively, can slide with slide block 222a, 222b respectively.
To carry arm member 122a and link with slide block 224a, and, will carry arm member 122b and link up with slide block 224b.Distance between adjusting slider 222a and slide block 222b is promptly identical with the distance of regulating between carrying arm member 122a, 122b.By making slide block 224a, the 224b that is embedded in guide rail 223, respectively with the parallel action stability that can improve carrying arm member 122a, 122b that moves of slide block 222a, 222b.
Be equipped with on the base station 124: be used to prevent when directions X disturbance carrying arm member 122a, 122b, overwalk, and carry arm member 122a, 122b outside hung brake device 228a in directions X end location; Be used to avoid the conflict between carrying arm member 122a, the 122b, and carry arm member 122a, 122b interior side brake 228b in the location, inboard.And, on slide block 222a, 222b, braking receiver 229a, 229b with these outsides and interior side brake 228a, 228b butt are housed respectively.
The directions X carrying mechanism 232 that arm slide mechanism 125 has the binding parts 231 that are embedded on the guide rail 217 and binding parts 231 are slided along directions X.Base station 124 is attached to binding parts 231, arm space regulating mechanism 123 is slided along directions X, carrying arm member 122a, 122b are slided along directions X.With regard to directions X carrying mechanism 232, can use cylinder, belt Handling device, ball-screw apparatus etc.
In addition, the internal base plate Handling device 110,120,130 for the 1st, the 2nd, the 3rd and the 4th and each parts of 140, adopting intensity is desirable with proportion than big aluminum alloy.Particularly, carrying arm 112a, 112b, 122a, 122b are necessary to reduce flexible, thereby need increase rigidity from material and two aspects of structure, and need be designed to light weight.By the way, carrying arm member 122a, the 122b of the 2nd and the 3rd internal base plate Handling device 120,130 of present embodiment use the aluminium-alloy pipe of external diameter 30mm * wall thickness 1.5mm, and the directions X length of L word bar and Y direction length are respectively about 500～600mm.And, carrying arm member 112a, the 112b of the 1st and the 4th internal base plate Handling device 110,140, the aluminium-alloy pipe of use external diameter 30mm * wall thickness 1.5mm, the Y direction length of L word bar is about 400～500mm.
And, the 1st and the 2nd holding member, the C word shape part that adopts the slot type otch to embed, it is desirable being installed on carrying arm member 112a, 112b, 122a, the 122b by means of bolted connection.Adopt this C word shape part, just can on carrying arm 112a, 112b, 122a, 122b, easily load and unload the 1st and the 2nd holding member, can freely change its installation site simultaneously.
Among Fig. 9, represent to carry arm member 122a, the 122b state when the board carrying with solid line, promptly, enlarge the space of two carrying arm member 122a, 122b, carrying arm member 122a, 122b can keep the state (board carrying state) of substrate G, and, dot space (width) that dwindles two carrying arm member 122a, 122b and the state (non-carrying state) that carrying arm member 122a, 122b are kept out of the way.
As previously mentioned, during non-carrying, because carrying arm member 122a, 122b keep out of the way between resist-coating device (CT) 23a and decompression dry device (VD) 23b, narrow when at this moment keeping than board carrying owing to the space (width) that will carry arm member 122a, 122b, just can dwindle the distance between resist-coating device (CT) 23a and decompression dry device (VD) 23b.Like this, because can dwindle the space of keeping out of the way of the 2nd internal base plate Handling device 120, just can reduce the coverage of resist-coating unit 23, and then can dwindle the coverage of resist-coating and developing system 100.This effect of dwindling coverage, in the occasion of large substrate G, will more remarkable presenting.
The 3rd internal base plate Handling device 130 has with the 2nd internal base plate Handling device 120 identical construction in fact, thereby can dwindle and keep out of the way decompression dry device (VD) 23b in space and periphery resist as it and remove distance between device (ER) 23c.
Transfer unit (PASS) 69 has the bench board 103 of mounting substrate G and is located at assigned position so that the lift pin 104 of up/down perforation bench board 103, removing the zone of device (ER) 23c from the periphery resist, the 4th internal base plate Handling device 140 of carrying substrate G is being set to transfer unit (PASS) 69.The 1st internal base plate Handling device 110 identical construction of face explanation in front of the 4th internal base plate Handling device 140 has, its carrying arm can be kept out of the way Y direction one end of transfer unit (PASS) 69.Can dwindle the periphery resist like this and remove distance between device (ER) 23c and the transfer unit (PASS) 69, reduce coverage.
Through the program of resist-coating unit 23, for example, carry out as follows from transfer unit (PASS) 65 toward transfer unit (PASS) 69 carrying substrate G.That is, keep out of the way the state of Y direction one end at the carrying arm 112 of the 1st internal base plate Handling device 110, the 1st Handling device 33 is moved into substrate G in the transfer unit (PASS) 65.Then, lift pin 102 rises, and in its way of rising, lift pin 102 receives substrate G from the 1st Handling device 33.In the occasion of carrying substrate G at once not, decline lift pin 102 is placed on substrate G on the bench board 101 then.
Lift pin 102 support substrate G, and, substrate G is positioned at than after the high position of carrying arm 112,113 actions of arm position adjusting mechanism, to substrate G one side slip carrying arm 112, make the inner space 201a decompression of the cartridge 201 that constitutes holding member 111a, 111b, lift pin 102 is descended.In the decline way of lift pin 102 substrate G is passed to not in holding member 111a, the 111b of carrying arm 112 like this, substrate G is adsorbed and remains on the absorption packing ring 203.
Keep out of the way state between resist-coating device (CT) 23a and decompression dry device (VD) 23b making the 2nd internal base plate Handling device 120, allow the arm travel mechanism 115 of the 1st internal base plate Handling device 110 move, substrate G is transported to capstan 51 tops of resist-coating device (CT) 23a.And, when capstan 51 rises, rise thereon in the way, substrate G is passed to capstan 51 from carrying arm 112.In addition, before soon substrate G being passed to capstan, remove the decompression state in the cartridge 201 inner space 201a that constitute holding member 111a, 111b, do not allow substrate G fall, and make substrate G leave absorption packing ring 203 easily.
If substrate G has been passed to capstan 51, make 113 actions of arm position adjusting mechanism, carrying arm 112 is kept out of the way toward Y direction end, and then arm travel mechanism 115 is moved, the 1st internal base plate Handling device 110 is slided toward transfer unit (PASS) 65 1 sides, by means of the 1st Handling device 33, next substrate G moved into transfer unit (PASS) 65 before, make 112 standbies of carrying arm.
Make and keep the capstan 51 of substrate G to drop to assigned position, so that the applied on every side cup 50 of substrate G centers on, for example, at the static state of substrate G, about center coating specified amount resist liquid to substrate G, rotational speed capstan 51 with regulation expands on the whole base plate G resist liquid then, forms resist film.
Rising capstan 51 slides into the 2nd internal base plate Handling device 120 position of resist-coating device (CT) 23a after specified height keeps forming the substrate G of resist film.Because capstan 51 forms the structure that its dull and stereotyped following central part that keeps substrate G is supported by supporting rod, if the 2nd internal base plate Handling device 120 is slided, make carrying arm 122a, 122b by this supporting rod next door, then carry arm 122a, 122b and just can not conflict with capstan 51.
Secondly, actuating arm space regulating mechanism 123 enlarges the distance between carrying arm 122a, 122b, and allows relief line 205 work, and makes holding member 111a, 111b become the state that can adsorb substrate G, allows capstan 51 descend.In capstan 51 descended the way, substrate G was delivered to holding member 111a, the 111b of the 2nd internal base plate Handling device 120 from capstan 51 like this.
Under the state that the loam cake that makes the decompression chamber 52 of being located at decompression dry device (VD) 23b rises, make the 2nd internal base plate Handling device 120 that keeps substrate G after decompression dry device (VD) 23b slides during rising bench board 55, bench board 55 rises, and substrate G is delivered to bench board 55 from carrying arm 122a, 122b in the way.Then, sliding slider 222a, 222b dwindle the distance between carrying arm 122a, 122b, and the 2nd internal base plate Handling device 120 is moved between resist-coating device (CT) 23a and decompression dry device (VD) 23b, wait for next time and handling.
In decompression dry device (VD) 23b, after allowing the 2nd internal base plate Handling device 120 keep out of the way, decompression chamber 52 keeps sealing state, and then by its inside of decompression, evaporation is included in substrate G and goes up the interior a part of solvent of resist film that forms, and makes the resist film drying.Processing among decompression dry device (VD) 23b allows decompression chamber 52 become open state after finishing, and rising bench board 55 is up to specified height.
With substrate G being transported to the same program of program of decompression dry device (VD) 23b from resist-coating device (CT) 3a with utilizing the 2nd internal base plate Handling device 120 just now, utilize the 3rd internal base plate Handling device 130, substrate G is removed device (ER) 23c carrying from decompression dry device (VD) 23b to the periphery resist.If substrate G remains on the periphery resist and removes on the bench board 54 of device (ER) 23c, the spatial movement of keeping out of the way that the 3rd internal base plate Handling device 130 is removed between device (ER) 23c to decompression dry device (VD) 23b and periphery resist is removed among device (ER) 23c at the periphery resist, move remover 53 along the limit of substrate G, remove the unnecessary resist that is attached to substrate G periphery.
Remove after predetermined processing among device (ER) 23c finishes at the periphery resist, make bench board 54 rise to specified altitude, and, making the 4th internal base plate Handling device 140 remove device (ER) 23c to the periphery resist slides, visit bench board 54 is so that its carrying arm can receive the LCD substrate from bench board 54.Under this state,, substrate G is passed to the carrying arm of the 4th internal base plate Handling device 140 by reducing bench board 54.
Employing makes the 4th internal base plate Handling device 140 that keeps substrate G slide to transfer unit (PASS) 69, the way of the lift pin 104 of transfer unit (PASS) 69 is located in rising, and substrate G is passed to lift pin 104 from the carrying arm of the 4th internal base plate Handling device 140.The substrate G downside that employing is kept the 2nd Handling device 36 visit lift pins 104, the way of decline lift pin 104, substrate G is passed to the 2nd Handling device 36, for example carry to arbitrary unit of 3 the prebake unit (PREBAKE) 70,71,72 that carry out pre-bake treatment.
More than, finished embodiments of the invention, but the present invention is not limited to these embodiment.For example, the arm position adjusting mechanism 113 in the 1st internal base plate Handling device 110 as the mechanism of driving sliding block 208, can use ball-screw or rotate belt conveyor.
And the arm space regulating mechanism 123 in the 2nd internal base plate Handling device 120 also can use the rotation belt conveyor.
Figure 10 A is the planar view that the arm space regulating mechanism 123A summary formation of rotating belt conveyor is used in expression, and Figure 10 B is its lateral plan.Arm space regulating mechanism 123A has: the power wheel 301a, the 301b that leave the predetermined distance configuration; Be suspended on the belt conveyor 302 between these two power wheel 301a, 301b; Rotate the motor 303 of power wheel 301a; And be fixed on arm holding member 304a, 304b on the belt conveyor 302.Carrying arm member 122a, 122b are housed respectively on arm holding member 304a, the 304b.
Power wheel 301b rotates power wheel along with the rotation of belt conveyor 302.Because arm holding member 304a, 304b are separately fixed at the upside and the downside of belt conveyor 302, if rotary electric machine 303 makes the center of arm holding member 304a between power wheel 301a 301b move, then arm holding member 304b also moves the center between power wheel 301a 301b, like this, can dwindle the space of carrying arm member 122a, 122b.In contrast, if rotary electric machine 303 makes arm holding member 304a to power wheel 301a one side shifting, because of arm holding member 304b to power wheel 301b one side shifting, then can enlarge the space of carrying arm member 122a, 122b.
In addition, the stability when carrying arm member 122a, 122b slip in order to improve, the arm space regulating mechanism 123 shown in the face of front is same, and it is chimeric with guide rail (scheming not shown) to it is desirable to also will carry arm member 122a, 122b.
In the above-mentioned explanation, though proposing the LCD substrate is illustrated as substrate, but substrate is not limited thereto, for example, also can be semiconductor wafer, ceramic substrate, various glass substrate, resin substrate, and to the processing that substrate is implemented, also as above-mentioned embodiment, the formation that is not limited to resist film is handled.
According to the present invention, can dwindle (the directions X interval, interval, front and back of a pair of carrying arm member; The interval of board carrying direction), thus the 2nd internal base plate Handling device can be received and kept in existing same keeping out of the way in the space.For the 3rd internal base plate Handling device too.Like this, do not increase and keep out of the way the space, can carry, and can increase by restraining device bottom surface occupied area than existing also large-scale substrate.
According to the present invention, since can change opposed a pair of carrying arm between left and right every (Y direction at interval: with the interval of board carrying direction vertical direction), so that be the occasion that changes substrate size, also can according to the size of substrate (occasion is the bond length of substrate usually) adjust the carrying arm between left and right every, can make the 1st internal base plate Handling device keep out of the way the both sides of carrying the path at the inlet side bench board.The outlet one side bench board the 4th internal base plate Handling device in too.Thus, also can dwindle port of shipment and the interval of carrying the destination, thereby can restraining device base occupied area.

Claims (14)

1. substrate transfer apparatus has the level of clipping carrying path a pair of board carrying portion of subtend configuration symmetrically substantially, by means of this a pair of board carrying portion substantially on even keel keep rectangular substrate and, it is characterized in that along described level carrying path carrying,
Described board carrying portion possesses:
The cooresponding 2 carrying arm members of peripheral shape with shape and rectangular substrate;
Be installed on described carrying arm member, dock and keep the maintaining part of this rectangular substrate with the periphery back side of rectangular substrate;
Movably support described 2 carrying arm members, change the arm space regulating mechanism of described 2 carrying arm member spaces; And
Movably support described arm space regulating mechanism, along the arm slide mechanism of the described arm space regulating mechanism of described level carrying path movement,
Described arm space regulating mechanism will be regulated like this, so that when carrying, make the space of described 2 carrying arm members be fit to the sizes of described rectangular substrate, when non-carrying, the space that the space of described 2 carrying arm members is narrowed down to when carrying is also narrow.
2. according to the described device of claim 1, it is characterized in that,
Described arm space regulating mechanism has and the corresponding one to one setting of described 2 carrying arm members, supports described 2 a pair of slide blocks of carrying arm members slidably respectively in the board carrying direction,
By regulating the space of described a pair of slide block, regulate the space of described 2 carrying arm members
3. according to claim 1 or 2 described devices, it is characterized in that,
Described 2 carrying arm members are that separately horizontal surface projection of shape is L word shape substantially, and the horizontal surface projection of shape that links combination by described arm space regulating mechanism is a U word shape substantially.
4. according to the described device of claim 1, it is characterized in that,
Described maintaining part releasably is installed on the described carrying arm member.
5. according to the described device of claim 1, it is characterized in that,
Described maintaining part with contact with the interior substrate periphery back side apart from rectangular substrate outer circumference end 15mm, support this substrate.
6. according to each described device among the claim 1,4 or 5, it is characterized in that,
Described maintaining part possesses; By means of vacuum attraction, be adsorbed in substrate back, keep a plurality of the 1st holding members of this substrate, and be docked on the substrate back, keep a plurality of the 2nd holding members of this substrate.
7. according to the described device of claim 6, it is characterized in that,
Described the 1st holding member is installed to the inside highlightedly from the about mid point of the pole length of described carrying arm member.
8. according to the described device of claim 1, it is characterized in that,
Described maintaining part has at assigned position contact substrate periphery and keeps the packing ring of substrate,
Described packing ring when keeping substrate the substrate deflection and tilt freely.
9. substrate board treatment possesses:
The level carrying path of carrying rectangular substrate;
Be provided with along described level carrying path, rectangular substrate applied the 1st handling part of predetermined processing;
Be provided with along described level carrying path, rectangular substrate applied the 2nd handling part of other predetermined processing; And
Has the described level carrying path a pair of board carrying portion of subtend configuration symmetrically substantially that clips, between described the 1st handling part and the 2nd handling part, by means of described a pair of board carrying portion substantially on even keel keep rectangular substrate, and the substrate transfer apparatus of carrying along described level carrying path, it is characterized in that
Described board carrying portion possesses:
The cooresponding 2 carrying arm members of peripheral shape with shape and rectangular substrate;
Be installed on described carrying arm member, dock, keep the maintaining part of this rectangular substrate with the periphery back side of rectangular substrate;
Movably support described 2 carrying arm members, change the arm space regulating mechanism of described 2 carrying arm member spaces; And
Movably support described arm space regulating mechanism, along the arm slide mechanism of the described arm space regulating mechanism of described level carrying path movement,
Described arm space regulating mechanism will be regulated like this, so that when carrying, the space of described 2 carrying arm members is fit to the size of described rectangular substrate, when non-carrying, space when narrowing down to the space of described 2 carrying arm members than carrying is also narrow
Described arm slide mechanism makes and the time has dwindled described 2 the carrying arm members behind the space in non-carrying and keep out of the way between described the 1st handling part and described the 2nd handling part.
10. according to the described device of claim 9, it is characterized in that,
Described the 1st handling part has the resist-coating unit with spin-coating method painting erosion resistant agent on rectangular substrate,
Described the 2nd handling part has one of following unit at least, carries out dry processing unit that drying under reduced pressure handles and removes the unit from the periphery resist that described substrate periphery is removed resist film form substrate behind the resist film in described resist-coating processing unit.
11. a substrate transfer apparatus has the level of the clipping carrying path a pair of board carrying portion of subtend configuration symmetrically substantially, by means of this a pair of board carrying portion substantially on even keel keep rectangular substrate, and, it is characterized in that along described level carrying path carrying,
Described board carrying portion possesses:
The cooresponding carrying arm member of peripheral shape with shape and rectangular substrate;
Be installed on described carrying arm member, dock, keep the maintaining part of this rectangular substrate with the periphery back side of rectangular substrate;
Movably support described carrying arm member, move described carrying arm member, make the arm position adjusting mechanism of the relative substrate advance and retreat of described carrying arm member in the direction vertical with described carrying path;
Movably support described arm position adjusting mechanism, along the arm slide mechanism of the described arm position adjusting mechanism of described level carrying path movement,
Described arm position adjusting mechanism will be regulated, so that when carrying, make the space of the carrying arm member of the carrying arm member of a side and opposite side be fit to the size of described rectangular substrate, when non-carrying, the space when expanding to the space of described carrying arm member than carrying is also big.
12. according to the described device of claim 11, it is characterized in that,
Described maintaining part has at assigned position contact substrate periphery and keeps the packing ring of substrate,
Described packing ring when keeping substrate the substrate deflection and tilt freely.
13. a substrate board treatment possesses:
The level carrying path of carrying rectangular substrate;
Be provided with along described level carrying path, rectangular substrate applied the 1st handling part of predetermined processing;
Be provided with along described level carrying path, rectangular substrate applied the 2nd handling part of other predetermined processing;
Has the described level carrying path a pair of board carrying portion of subtend configuration symmetrically substantially that clips, between described the 1st handling part and the 2nd handling part, by means of described a pair of board carrying portion substantially on even keel keep rectangular substrate, and the substrate transfer apparatus of carrying along described level carrying path, it is characterized in that
Described board carrying portion possesses:
The cooresponding carrying arm member of peripheral shape with shape and rectangular substrate;
Be installed on the described carrying arm member, dock and keep the maintaining part of this rectangular substrate with the periphery back side of rectangular substrate;
Movably support described carrying arm member, move described carrying arm member, make the arm position adjusting mechanism of the relative substrate advance and retreat of described carrying arm member in the direction vertical with described carrying path; And
Movably support described arm position adjusting mechanism, along the arm slide mechanism of the described arm position adjusting mechanism of described level carrying path movement,
Described arm position adjusting mechanism will be regulated, so that when carrying, make the space of the carrying arm member of the described carrying arm member of a side and opposite side be fit to the size of described rectangular substrate, when non-carrying, space when expanding to the space of described carrying arm member than carrying is also big, and described carrying arm member is kept out of the way from described level carrying path
14. a substrate board treatment possesses:
The level carrying path of carrying rectangular substrate;
Be provided with along described level carrying path, rectangular substrate applied the 1st handling part of predetermined processing;
Be provided with along described level carrying path, rectangular substrate applied the 2nd handling part of other predetermined processing;
Be provided with along described level carrying path, rectangular substrate applied the 3rd handling part of other predetermined processing;
Has described level carrying path cardinal principle a pair of the 1st board carrying portion of subtend configuration symmetrically that clips, between described the 1st handling part and described the 2nd handling part, keep rectangular substrate by means of described a pair of the 1st board carrying portion cardinal principle on even keel, and the 1st substrate transfer apparatus of carrying along described level carrying path; And
Has described level carrying path cardinal principle a pair of the 2nd board carrying portion of subtend configuration symmetrically that clips, between described the 2nd handling part and described the 3rd handling part, keep rectangular substrate by means of described a pair of the 2nd board carrying portion cardinal principle on even keel, and the 2nd substrate transfer apparatus of carrying along described level carrying path, it is characterized in that
Described the 1st board carrying portion possesses:
Cooresponding the 1st carrying arm member of peripheral shape with shape and rectangular substrate;
Be installed on described the 1st carrying arm member, dock and keep the maintaining part of this rectangular substrate with the periphery back side of rectangular substrate;
Movably support described the 1st carrying arm member, move described the 1st carrying arm member, make the arm position adjusting mechanism of the relative substrate advance and retreat of described the 1st carrying arm member in the direction vertical with described carrying path;
Movably support described arm position adjusting mechanism, along the arm slide mechanism of the described arm position adjusting mechanism of described level carrying path movement,
Described the 2nd board carrying portion possesses;
Cooresponding 2 the 2nd carrying arm members of peripheral shape with shape and rectangular substrate;
Be installed on described the 2nd carrying arm member, dock and keep the maintaining part of this rectangular substrate with the periphery back side of rectangular substrate;
Movably support described the 2nd carrying arm member, change the arm space regulating mechanism of the space of described the 2nd carrying arm member;
Movably support described arm space regulating mechanism, along the 2nd arm slide mechanism of the described arm space regulating mechanism of described level carrying path movement,
Described arm position adjusting mechanism will be regulated, so that when carrying, the space that makes the 1st of a side carry the 1st carrying arm member of arm member and opposite side is fit to the size of described rectangular substrate, when non-carrying, space when expanding to the space of described the 1st carrying arm member than carrying is also big, described the 1st carrying arm member is kept out of the way from described level carrying path
Described arm space regulating mechanism will be regulated, so that when carrying, make the size of the suitable described rectangular substrate in space of described 2 carrying arm members, when non-carrying, space when narrowing down to the space of described 2 carrying arm members than carrying is also narrow, and the 2nd carrying arm member is kept out of the way between described the 2nd handling part and the 3rd handling part.
CNB031472087A 2002-05-30 2003-05-30 Fragile sheel transporting device and fragile sheet processing Expired - Fee Related CN1260801C (en)

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JP2002156664A JP3933524B2 (en) 2002-05-30 2002-05-30 Substrate processing equipment
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KR20030093999A (en) 2003-12-11
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CN1260801C (en) 2006-06-21
KR100951964B1 (en) 2010-04-08

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