TWI264791B - Apparatus and method for dynamic diagnostic testing of integrated circuits - Google Patents

Apparatus and method for dynamic diagnostic testing of integrated circuits

Info

Publication number
TWI264791B
TWI264791B TW092101517A TW92101517A TWI264791B TW I264791 B TWI264791 B TW I264791B TW 092101517 A TW092101517 A TW 092101517A TW 92101517 A TW92101517 A TW 92101517A TW I264791 B TWI264791 B TW I264791B
Authority
TW
Taiwan
Prior art keywords
circuit
test
speed
electrical activity
test circuit
Prior art date
Application number
TW092101517A
Other languages
English (en)
Other versions
TW200408029A (en
Inventor
Nader Pakdaman
Steven Kasapi
Itzik Goldberger
Original Assignee
Optonics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optonics Inc filed Critical Optonics Inc
Publication of TW200408029A publication Critical patent/TW200408029A/zh
Application granted granted Critical
Publication of TWI264791B publication Critical patent/TWI264791B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/305—Contactless testing using electron beams
    • G01R31/307—Contactless testing using electron beams of integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
    • G01R31/318511—Wafer Test

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
TW092101517A 2002-02-01 2003-01-23 Apparatus and method for dynamic diagnostic testing of integrated circuits TWI264791B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35337402P 2002-02-01 2002-02-01
US10/229,181 US6859031B2 (en) 2002-02-01 2002-08-26 Apparatus and method for dynamic diagnostic testing of integrated circuits

Publications (2)

Publication Number Publication Date
TW200408029A TW200408029A (en) 2004-05-16
TWI264791B true TWI264791B (en) 2006-10-21

Family

ID=27668376

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092101517A TWI264791B (en) 2002-02-01 2003-01-23 Apparatus and method for dynamic diagnostic testing of integrated circuits

Country Status (7)

Country Link
US (1) US6859031B2 (zh)
EP (1) EP1470431A2 (zh)
JP (1) JP2005517188A (zh)
KR (1) KR100734186B1 (zh)
AU (1) AU2003217284A1 (zh)
TW (1) TWI264791B (zh)
WO (1) WO2003067271A2 (zh)

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US7339388B2 (en) * 2003-08-25 2008-03-04 Tau-Metrix, Inc. Intra-clip power and test signal generation for use with test structures on wafers
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US7005719B2 (en) * 2004-02-27 2006-02-28 Texas Instruments Incorporated Integrated circuit structure having a flip-chip mounted photoreceiver
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US8380478B2 (en) * 2004-06-07 2013-02-19 Texas Instruments Incorporated Statistical evaluation of circuit robustness separating local and global variation
US20060103378A1 (en) * 2004-11-12 2006-05-18 Nader Pakdaman Apparatus and method for dynamic diagnostic testing of integrated circuits
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JP2006349522A (ja) * 2005-06-16 2006-12-28 Fujifilm Holdings Corp 固体撮像素子の検査方法及びその装置
JP2007010384A (ja) * 2005-06-29 2007-01-18 Univ Of Tokyo 半導体デバイスの高周波特性測定方法及び装置
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US7679358B2 (en) * 2006-04-05 2010-03-16 Dcg Systems, Inc. System and method for voltage noise and jitter measurement using time-resolved emission
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JP2009008420A (ja) * 2007-06-26 2009-01-15 Oki Electric Ind Co Ltd 半導体デバイスの良否判定装置
US7888947B2 (en) * 2007-11-21 2011-02-15 Teradyne, Inc. Calibrating automatic test equipment
WO2010046997A1 (ja) * 2008-10-24 2010-04-29 株式会社アドバンテスト 電子デバイスおよび製造方法
US8378702B2 (en) 2009-05-08 2013-02-19 Corning Incorporated Non-contact testing of printed electronics
FR2947119B1 (fr) * 2009-06-18 2011-07-01 Amcad Engineering Procede et systeme d'adaptation optimale d'impedance de source en entree de composants electroniques, en particulier de transistors
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US9721854B2 (en) 2012-12-05 2017-08-01 International Business Machines Corporation Structure and method for in-line defect non-contact tests
KR20140095387A (ko) * 2013-01-24 2014-08-01 삼성전자주식회사 광 소자를 포함하는 웨이퍼의 테스트 시스템 및 웨이퍼 테스트 방법
US9599666B2 (en) 2014-10-28 2017-03-21 Qualcomm Incorporated Minimum voltage and maximum performance mapping using laser-assisted techniques
WO2017062735A1 (en) * 2015-10-08 2017-04-13 President And Fellows Of Harvard College Ultrahigh resolution dynamic ic chip activity detection for hardware security
US10180486B2 (en) * 2016-03-16 2019-01-15 Formfactor Beaverton, Inc. Test standards and methods for impedance calibration of a probe system, and probe systems that include the test standards or utilize the methods
US9791346B1 (en) * 2016-04-20 2017-10-17 Stmicroelectronics Sa Semiconductor device and wafer with reference circuit and related methods
US10665421B2 (en) * 2018-10-10 2020-05-26 Applied Materials, Inc. In-situ beam profile metrology
US11119148B2 (en) 2018-10-18 2021-09-14 International Business Machines Corporation Test probe assembly with fiber optic leads and photodetectors for testing semiconductor wafers
US11125780B2 (en) 2018-10-18 2021-09-21 International Business Machines Corporation Test probe assembly with fiber optic leads and photodetectors
US11243230B2 (en) * 2019-12-30 2022-02-08 Juniper Networks, Inc. Compact opto-electric probe
US11614584B2 (en) * 2020-04-28 2023-03-28 Poet Technologies, Inc. Loopback waveguide
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Also Published As

Publication number Publication date
US6859031B2 (en) 2005-02-22
TW200408029A (en) 2004-05-16
AU2003217284A8 (en) 2003-09-02
KR20050002819A (ko) 2005-01-10
JP2005517188A (ja) 2005-06-09
AU2003217284A1 (en) 2003-09-02
EP1470431A2 (en) 2004-10-27
WO2003067271A3 (en) 2004-01-15
KR100734186B1 (ko) 2007-07-02
WO2003067271A2 (en) 2003-08-14
US20030146761A1 (en) 2003-08-07

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees