TWI264781B - Method for sticking adhesive tape for die bonding and method for mounting electronic component - Google Patents

Method for sticking adhesive tape for die bonding and method for mounting electronic component Download PDF

Info

Publication number
TWI264781B
TWI264781B TW094105797A TW94105797A TWI264781B TW I264781 B TWI264781 B TW I264781B TW 094105797 A TW094105797 A TW 094105797A TW 94105797 A TW94105797 A TW 94105797A TW I264781 B TWI264781 B TW I264781B
Authority
TW
Taiwan
Prior art keywords
substrate
adhesive tape
attaching
predetermined position
adhesive
Prior art date
Application number
TW094105797A
Other languages
English (en)
Chinese (zh)
Other versions
TW200532816A (en
Inventor
Tadashi Morisawa
Kazunori Nitta
Hideo Kageyama
Hidekazu Azuma
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW200532816A publication Critical patent/TW200532816A/zh
Application granted granted Critical
Publication of TWI264781B publication Critical patent/TWI264781B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW094105797A 2004-03-05 2005-02-25 Method for sticking adhesive tape for die bonding and method for mounting electronic component TWI264781B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004063267A JP4538843B2 (ja) 2004-03-05 2004-03-05 ダイボンド用粘着テープの貼付方法

Publications (2)

Publication Number Publication Date
TW200532816A TW200532816A (en) 2005-10-01
TWI264781B true TWI264781B (en) 2006-10-21

Family

ID=34918152

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094105797A TWI264781B (en) 2004-03-05 2005-02-25 Method for sticking adhesive tape for die bonding and method for mounting electronic component

Country Status (6)

Country Link
JP (1) JP4538843B2 (ja)
KR (1) KR100728442B1 (ja)
CN (1) CN100466211C (ja)
SG (1) SG125246A1 (ja)
TW (1) TWI264781B (ja)
WO (1) WO2005086219A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI609766B (zh) * 2012-11-13 2018-01-01 Yamaha Fine Technologies Co Ltd 構件之貼附裝置及貼附方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006041315A (ja) * 2004-07-29 2006-02-09 Towa Corp ダイボンド装置
JP4975564B2 (ja) * 2007-08-31 2012-07-11 日東電工株式会社 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法
JP5435861B2 (ja) * 2007-12-13 2014-03-05 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5234755B2 (ja) * 2008-07-09 2013-07-10 リンテック株式会社 シート貼付装置及び貼付方法
CN102473665B (zh) * 2009-07-17 2014-11-19 上野精机株式会社 重新粘贴装置以及分类重新粘贴方法
JP6598811B2 (ja) * 2017-03-23 2019-10-30 Ｔｏｗａ株式会社 半導体パッケージ配置装置、製造装置、半導体パッケージの配置方法および電子部品の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0547470Y2 (ja) * 1987-02-24 1993-12-14
JPH0697215A (ja) * 1992-09-11 1994-04-08 Hitachi Ltd 小物品群付貼着シートおよびそれが使用される小物品のピックアップ方法
JP3885358B2 (ja) * 1998-04-28 2007-02-21 住友電気工業株式会社 酸化物高温超電導線材およびその製造方法
JP2001135653A (ja) * 1999-11-02 2001-05-18 Mitsubishi Electric Corp ダイボンディング装置及び半導体装置
DE10133885A1 (de) * 2000-07-21 2002-03-21 Esec Trading Sa Vorrichtung zur Herstellung von Drahtverbindungen
JP4120138B2 (ja) * 2000-07-25 2008-07-16 三井化学株式会社 複層ガラス用シーリング材
JP3861710B2 (ja) * 2002-02-15 2006-12-20 松下電器産業株式会社 電子部品供給装置および電子部品実装装置
JP2004269197A (ja) * 2003-03-11 2004-09-30 Lintec Corp テープ貼付装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI609766B (zh) * 2012-11-13 2018-01-01 Yamaha Fine Technologies Co Ltd 構件之貼附裝置及貼附方法

Also Published As

Publication number Publication date
KR20060057616A (ko) 2006-05-26
JP4538843B2 (ja) 2010-09-08
SG125246A1 (en) 2006-09-29
KR100728442B1 (ko) 2007-06-13
CN1842908A (zh) 2006-10-04
CN100466211C (zh) 2009-03-04
JP2005252114A (ja) 2005-09-15
WO2005086219A1 (ja) 2005-09-15
TW200532816A (en) 2005-10-01

Similar Documents

Publication Publication Date Title
TWI264781B (en) Method for sticking adhesive tape for die bonding and method for mounting electronic component
TWI317253B (ja)
JP4698519B2 (ja) 半導体ウエハマウント装置
JP4326519B2 (ja) 保護テープ剥離方法およびこれを用いた装置
JP4964070B2 (ja) 保護テープ剥離方法および保護テープ剥離装置
JP4255433B2 (ja) 枚葉体の貼合せ方法およびこれを用いた装置
JP4097679B2 (ja) カバーレイフィルム貼り合わせ装置
JP4311522B2 (ja) 接着シート貼付方法およびその装置並びに半導体ウエハ処理方法
TW477022B (en) Semiconductor chip removing and conveying method and device
WO2015029123A1 (ja) 部品実装装置
KR101570043B1 (ko) 마운트 장치 및 마운트 방법
TW591728B (en) Assembly apparatus and assembly method of display devices
TWI261365B (en) Die bonding apparatus
JP4407933B2 (ja) 粘着テープ貼付方法およびこれを用いた装置
TW201203408A (en) FPD module assembling apparatus
JP2004149293A (ja) 剥離方法、剥離装置、剥離・貼付方法および剥離・貼付装置
JP4918539B2 (ja) 保護テープ剥離装置
JP6216750B2 (ja) シート剥離装置および剥離方法
JP4748901B2 (ja) 半導体ウエハのマウント方法およびこれに用いるカセット
JP3637350B2 (ja) 粘着性テ−プ片の貼着装置
TW200931542A (en) Apparatus and method for mounting electronic component
JP2006159488A (ja) フィルム貼着装置およびフィルム貼着方法
KR20130084111A (ko) 디에프에스알용 필름제거방법
KR102033795B1 (ko) 시트 부착 장치 및 시트 부착 방법
JPH1111446A (ja) バーコードラベルの供給，装着方法および装置