TWI264155B - Apparatus and method for interfacing electronic packages with a circuit board - Google Patents
Apparatus and method for interfacing electronic packages with a circuit boardInfo
- Publication number
- TWI264155B TWI264155B TW091137394A TW91137394A TWI264155B TW I264155 B TWI264155 B TW I264155B TW 091137394 A TW091137394 A TW 091137394A TW 91137394 A TW91137394 A TW 91137394A TW I264155 B TWI264155 B TW I264155B
- Authority
- TW
- Taiwan
- Prior art keywords
- socket
- contact
- removable
- circuit board
- electronic packages
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US34222801P | 2001-12-27 | 2001-12-27 | |
US10/151,060 US6685492B2 (en) | 2001-12-27 | 2002-05-17 | Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200301592A TW200301592A (en) | 2003-07-01 |
TWI264155B true TWI264155B (en) | 2006-10-11 |
Family
ID=26848289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW091137394A TWI264155B (en) | 2001-12-27 | 2002-12-26 | Apparatus and method for interfacing electronic packages with a circuit board |
Country Status (6)
Country | Link |
---|---|
US (1) | US6685492B2 (zh) |
JP (1) | JP2006504226A (zh) |
KR (1) | KR20040068988A (zh) |
AU (1) | AU2002324585A1 (zh) |
TW (1) | TWI264155B (zh) |
WO (1) | WO2003058769A1 (zh) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3899075B2 (ja) * | 2002-03-05 | 2007-03-28 | リカ デンシ アメリカ, インコーポレイテッド | 電子パッケージと試験機器をインターフェースするための装置 |
US6844749B2 (en) * | 2002-07-18 | 2005-01-18 | Aries Electronics, Inc. | Integrated circuit test probe |
JP3768183B2 (ja) * | 2002-10-28 | 2006-04-19 | 山一電機株式会社 | 狭ピッチicパッケージ用icソケット |
TW563929U (en) * | 2002-12-24 | 2003-11-21 | Molex Inc | Press connection terminal |
KR100546361B1 (ko) * | 2003-08-08 | 2006-01-26 | 삼성전자주식회사 | 반도체 소자 검사장치의 포고 핀 및 그 운용방법 |
TWI239695B (en) * | 2003-08-11 | 2005-09-11 | Speed Tech Corp | Matrix connector |
CN2682638Y (zh) * | 2003-11-20 | 2005-03-02 | 上海莫仕连接器有限公司 | 压接式导电端子 |
CN2682639Y (zh) * | 2003-11-20 | 2005-03-02 | 上海莫仕连接器有限公司 | 压接式导电端子 |
KR20050059417A (ko) * | 2003-12-12 | 2005-06-20 | 스미토모덴키고교가부시키가이샤 | 소용돌이 단자와 그 제조방법 |
DE102004033864A1 (de) * | 2004-07-13 | 2006-02-16 | Era-Contact Gmbh | Elektrischer Druckkontakt |
US7411405B2 (en) * | 2004-11-03 | 2008-08-12 | Panduit Corp. | Method and apparatus for reliable network cable connectivity |
US7790987B2 (en) * | 2005-04-27 | 2010-09-07 | Sony Computer Entertainment Inc. | Methods and apparatus for interconnecting a ball grid array to a printed circuit board |
US7298153B2 (en) * | 2005-05-25 | 2007-11-20 | Interconnect Devices, Inc. | Eccentric offset Kelvin probe |
US7402051B1 (en) * | 2005-11-10 | 2008-07-22 | Antares Advanced Test Technologies, Inc. | Interconnect assembly for testing integrated circuit packages |
US7545159B2 (en) * | 2006-06-01 | 2009-06-09 | Rika Denshi America, Inc. | Electrical test probes with a contact element, methods of making and using the same |
CN100517874C (zh) * | 2006-06-28 | 2009-07-22 | 鸿富锦精密工业(深圳)有限公司 | 导电端子 |
US20080009148A1 (en) * | 2006-07-07 | 2008-01-10 | Glenn Goodman | Guided pin and plunger |
US20080143367A1 (en) * | 2006-12-14 | 2008-06-19 | Scott Chabineau-Lovgren | Compliant electrical contact having maximized the internal spring volume |
US7479794B2 (en) * | 2007-02-28 | 2009-01-20 | Sv Probe Pte Ltd | Spring loaded probe pin assembly |
WO2008133209A1 (ja) * | 2007-04-19 | 2008-11-06 | Nhk Spring Co., Ltd. | 導電性接触子および導電性接触子ユニット |
US7847191B2 (en) * | 2007-11-06 | 2010-12-07 | Xerox Corporation | Electrical component, manufacturing system and method |
TWM337870U (en) * | 2007-12-03 | 2008-08-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
WO2009102029A1 (ja) * | 2008-02-14 | 2009-08-20 | Nhk Spring Co., Ltd. | コンタクトプローブおよびプローブユニット |
US7597588B1 (en) * | 2008-05-21 | 2009-10-06 | Itt Manufacturing Enterprises, Inc. | Coax connector with spring contacts |
TWI367330B (en) * | 2008-05-22 | 2012-07-01 | King Yuan Electronics Co Ltd | Probe socket, and probe card |
US20100194419A1 (en) * | 2009-02-05 | 2010-08-05 | Chan Edward K | Multi-contact probe assembly |
JP5782261B2 (ja) * | 2011-01-17 | 2015-09-24 | 株式会社ヨコオ | ソケット |
DE202011005270U1 (de) * | 2011-04-14 | 2011-09-01 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Steckverbinder |
JP5280511B2 (ja) | 2011-09-05 | 2013-09-04 | 株式会社島野製作所 | 接触端子 |
JP5523416B2 (ja) * | 2011-09-07 | 2014-06-18 | 茂治郎 清水 | 通電用コネクター |
CN103018625A (zh) * | 2011-09-21 | 2013-04-03 | 鸿富锦精密工业(深圳)有限公司 | 连接器检测装置 |
US8905795B2 (en) * | 2011-10-12 | 2014-12-09 | Apple Inc. | Spring-loaded contacts |
US20130330983A1 (en) | 2012-06-10 | 2013-12-12 | Apple Inc. | Spring-loaded contacts having sloped backside with retention guide |
US9379465B2 (en) * | 2012-09-14 | 2016-06-28 | Nhk Spring Co., Ltd. | Connection terminal having a press-fitting part inserted into a hollow part of a holding member |
US9674943B2 (en) * | 2012-12-06 | 2017-06-06 | Intel Corporation | Actuation mechanisms for electrical interconnections |
KR101331525B1 (ko) * | 2012-12-10 | 2013-11-20 | 리노공업주식회사 | 프로브 장치 |
TWI514686B (zh) | 2013-01-28 | 2015-12-21 | Hon Hai Prec Ind Co Ltd | 電連接器及電連接器端子 |
EP2962365A1 (en) * | 2013-02-27 | 2016-01-06 | ABB Technology AG | Programming connector |
US11067601B2 (en) * | 2013-03-08 | 2021-07-20 | Donald DeMille | High accuracy electrical test interconnection device and method for electrical circuit board testing |
JP6029511B2 (ja) * | 2013-03-28 | 2016-11-24 | 株式会社エンプラス | 電気接触子、電気接触子の製造方法および電気部品用ソケット |
JP5985447B2 (ja) * | 2013-08-21 | 2016-09-06 | オムロン株式会社 | プローブピン、および、これを用いた電子デバイス |
JP6553472B2 (ja) * | 2015-09-30 | 2019-07-31 | 株式会社ヨコオ | コンタクタ |
US20170146568A1 (en) * | 2015-11-19 | 2017-05-25 | WinWay Tech. Co., Ltd. | Electronic test equipment |
JP6556612B2 (ja) * | 2015-12-04 | 2019-08-07 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US10608354B2 (en) * | 2017-03-23 | 2020-03-31 | Verily Life Sciences Llc | Implantable connector with two electrical components |
JP2019074483A (ja) * | 2017-10-19 | 2019-05-16 | 株式会社日本マイクロニクス | 電気的接続装置 |
US10367279B2 (en) * | 2017-10-26 | 2019-07-30 | Xilinx, Inc. | Pusher pin having a non-electrically conductive portion |
KR102013176B1 (ko) * | 2019-06-13 | 2019-08-22 | 주식회사 제네드 | 교체 가능한 싱글타입 프로브 핀 |
CN112510434A (zh) * | 2019-09-16 | 2021-03-16 | 康普技术有限责任公司 | 具有轴向浮动的内接触部的同轴连接器 |
KR102214091B1 (ko) * | 2020-03-20 | 2021-02-09 | 주식회사 메가터치 | 포고핀의 플런저 및 그 플런저를 구비한 포고핀 |
US11437747B2 (en) * | 2020-09-25 | 2022-09-06 | Apple Inc. | Spring-loaded contacts having capsule intermediate object |
US11942722B2 (en) | 2020-09-25 | 2024-03-26 | Apple Inc. | Magnetic circuit for magnetic connector |
JP2022079959A (ja) * | 2020-11-17 | 2022-05-27 | 山一電機株式会社 | 検査用ソケット |
US11569601B2 (en) * | 2021-03-11 | 2023-01-31 | Enplas Corporation | Socket and inspection socket |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3435168A (en) | 1968-03-28 | 1969-03-25 | Pylon Co Inc | Electrical contact |
US4321532A (en) * | 1978-03-16 | 1982-03-23 | Luna L Jack | Repairable spring probe assembly |
US4397519A (en) * | 1981-05-12 | 1983-08-09 | Pylon Company, Inc. | Electrical contact construction |
US5084673A (en) * | 1989-06-15 | 1992-01-28 | Nhk Spring Co., Ltd. | Electric contact probe |
JPH0782028B2 (ja) | 1990-07-30 | 1995-09-06 | 日本発条株式会社 | 導電性接触子 |
US5521519A (en) * | 1992-07-30 | 1996-05-28 | International Business Machines Corporation | Spring probe with piloted and headed contact and method of tip formation |
US6046597A (en) * | 1995-10-04 | 2000-04-04 | Oz Technologies, Inc. | Test socket for an IC device |
JP3634074B2 (ja) * | 1996-06-28 | 2005-03-30 | 日本発条株式会社 | 導電性接触子 |
US6084421A (en) * | 1997-04-15 | 2000-07-04 | Delaware Capital Formation, Inc. | Test socket |
US6204680B1 (en) | 1997-04-15 | 2001-03-20 | Delaware Capital Formation, Inc. | Test socket |
US6053777A (en) * | 1998-01-05 | 2000-04-25 | Rika Electronics International, Inc. | Coaxial contact assembly apparatus |
AU1820900A (en) | 1998-11-25 | 2000-06-13 | Rika Electronics International, Inc. | Electrical contact system |
US6377059B2 (en) * | 1999-02-19 | 2002-04-23 | Delaware Capital Formation, Inc. | Crown shaped contact barrel configuration for spring probe |
KR100373152B1 (ko) * | 1999-11-17 | 2003-02-25 | 가부시키가이샤 아드반테스트 | Ic 소켓 및 ic 시험 장치 |
US6424166B1 (en) * | 2000-07-14 | 2002-07-23 | David W. Henry | Probe and test socket assembly |
JP3443687B2 (ja) * | 2001-02-19 | 2003-09-08 | 株式会社エンプラス | 電気部品用ソケット |
-
2002
- 2002-05-17 US US10/151,060 patent/US6685492B2/en not_active Expired - Fee Related
- 2002-07-31 KR KR10-2004-7010130A patent/KR20040068988A/ko not_active Application Discontinuation
- 2002-07-31 AU AU2002324585A patent/AU2002324585A1/en not_active Abandoned
- 2002-07-31 JP JP2003558974A patent/JP2006504226A/ja active Pending
- 2002-07-31 WO PCT/US2002/024443 patent/WO2003058769A1/en active Search and Examination
- 2002-12-26 TW TW091137394A patent/TWI264155B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6685492B2 (en) | 2004-02-03 |
JP2006504226A (ja) | 2006-02-02 |
US20030124895A1 (en) | 2003-07-03 |
KR20040068988A (ko) | 2004-08-02 |
TW200301592A (en) | 2003-07-01 |
AU2002324585A1 (en) | 2003-07-24 |
WO2003058769A1 (en) | 2003-07-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |