TWI264155B - Apparatus and method for interfacing electronic packages with a circuit board - Google Patents

Apparatus and method for interfacing electronic packages with a circuit board

Info

Publication number
TWI264155B
TWI264155B TW091137394A TW91137394A TWI264155B TW I264155 B TWI264155 B TW I264155B TW 091137394 A TW091137394 A TW 091137394A TW 91137394 A TW91137394 A TW 91137394A TW I264155 B TWI264155 B TW I264155B
Authority
TW
Taiwan
Prior art keywords
socket
contact
removable
circuit board
electronic packages
Prior art date
Application number
TW091137394A
Other languages
English (en)
Other versions
TW200301592A (en
Inventor
Larre H Nelson
John M Winter
John C Bergeron
Original Assignee
Rika Denshi America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rika Denshi America Inc filed Critical Rika Denshi America Inc
Publication of TW200301592A publication Critical patent/TW200301592A/zh
Application granted granted Critical
Publication of TWI264155B publication Critical patent/TWI264155B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
TW091137394A 2001-12-27 2002-12-26 Apparatus and method for interfacing electronic packages with a circuit board TWI264155B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34222801P 2001-12-27 2001-12-27
US10/151,060 US6685492B2 (en) 2001-12-27 2002-05-17 Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition

Publications (2)

Publication Number Publication Date
TW200301592A TW200301592A (en) 2003-07-01
TWI264155B true TWI264155B (en) 2006-10-11

Family

ID=26848289

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091137394A TWI264155B (en) 2001-12-27 2002-12-26 Apparatus and method for interfacing electronic packages with a circuit board

Country Status (6)

Country Link
US (1) US6685492B2 (zh)
JP (1) JP2006504226A (zh)
KR (1) KR20040068988A (zh)
AU (1) AU2002324585A1 (zh)
TW (1) TWI264155B (zh)
WO (1) WO2003058769A1 (zh)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3899075B2 (ja) * 2002-03-05 2007-03-28 リカ デンシ アメリカ， インコーポレイテッド 電子パッケージと試験機器をインターフェースするための装置
US6844749B2 (en) * 2002-07-18 2005-01-18 Aries Electronics, Inc. Integrated circuit test probe
JP3768183B2 (ja) * 2002-10-28 2006-04-19 山一電機株式会社 狭ピッチｉｃパッケージ用ｉｃソケット
TW563929U (en) * 2002-12-24 2003-11-21 Molex Inc Press connection terminal
KR100546361B1 (ko) * 2003-08-08 2006-01-26 삼성전자주식회사 반도체 소자 검사장치의 포고 핀 및 그 운용방법
TWI239695B (en) * 2003-08-11 2005-09-11 Speed Tech Corp Matrix connector
CN2682638Y (zh) * 2003-11-20 2005-03-02 上海莫仕连接器有限公司 压接式导电端子
CN2682639Y (zh) * 2003-11-20 2005-03-02 上海莫仕连接器有限公司 压接式导电端子
KR20050059417A (ko) * 2003-12-12 2005-06-20 스미토모덴키고교가부시키가이샤 소용돌이 단자와 그 제조방법
DE102004033864A1 (de) * 2004-07-13 2006-02-16 Era-Contact Gmbh Elektrischer Druckkontakt
US7411405B2 (en) * 2004-11-03 2008-08-12 Panduit Corp. Method and apparatus for reliable network cable connectivity
US7790987B2 (en) * 2005-04-27 2010-09-07 Sony Computer Entertainment Inc. Methods and apparatus for interconnecting a ball grid array to a printed circuit board
US7298153B2 (en) * 2005-05-25 2007-11-20 Interconnect Devices, Inc. Eccentric offset Kelvin probe
US7402051B1 (en) * 2005-11-10 2008-07-22 Antares Advanced Test Technologies, Inc. Interconnect assembly for testing integrated circuit packages
US7545159B2 (en) * 2006-06-01 2009-06-09 Rika Denshi America, Inc. Electrical test probes with a contact element, methods of making and using the same
CN100517874C (zh) * 2006-06-28 2009-07-22 鸿富锦精密工业（深圳）有限公司 导电端子
US20080009148A1 (en) * 2006-07-07 2008-01-10 Glenn Goodman Guided pin and plunger
US20080143367A1 (en) * 2006-12-14 2008-06-19 Scott Chabineau-Lovgren Compliant electrical contact having maximized the internal spring volume
US7479794B2 (en) * 2007-02-28 2009-01-20 Sv Probe Pte Ltd Spring loaded probe pin assembly
WO2008133209A1 (ja) * 2007-04-19 2008-11-06 Nhk Spring Co., Ltd. 導電性接触子および導電性接触子ユニット
US7847191B2 (en) * 2007-11-06 2010-12-07 Xerox Corporation Electrical component, manufacturing system and method
TWM337870U (en) * 2007-12-03 2008-08-01 Hon Hai Prec Ind Co Ltd Electrical connector
WO2009102029A1 (ja) * 2008-02-14 2009-08-20 Nhk Spring Co., Ltd. コンタクトプローブおよびプローブユニット
US7597588B1 (en) * 2008-05-21 2009-10-06 Itt Manufacturing Enterprises, Inc. Coax connector with spring contacts
TWI367330B (en) * 2008-05-22 2012-07-01 King Yuan Electronics Co Ltd Probe socket, and probe card
US20100194419A1 (en) * 2009-02-05 2010-08-05 Chan Edward K Multi-contact probe assembly
JP5782261B2 (ja) * 2011-01-17 2015-09-24 株式会社ヨコオ ソケット
DE202011005270U1 (de) * 2011-04-14 2011-09-01 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Steckverbinder
JP5280511B2 (ja) 2011-09-05 2013-09-04 株式会社島野製作所 接触端子
JP5523416B2 (ja) * 2011-09-07 2014-06-18 茂治郎 清水 通電用コネクター
CN103018625A (zh) * 2011-09-21 2013-04-03 鸿富锦精密工业（深圳）有限公司 连接器检测装置
US8905795B2 (en) * 2011-10-12 2014-12-09 Apple Inc. Spring-loaded contacts
US20130330983A1 (en) 2012-06-10 2013-12-12 Apple Inc. Spring-loaded contacts having sloped backside with retention guide
US9379465B2 (en) * 2012-09-14 2016-06-28 Nhk Spring Co., Ltd. Connection terminal having a press-fitting part inserted into a hollow part of a holding member
US9674943B2 (en) * 2012-12-06 2017-06-06 Intel Corporation Actuation mechanisms for electrical interconnections
KR101331525B1 (ko) * 2012-12-10 2013-11-20 리노공업주식회사 프로브 장치
TWI514686B (zh) 2013-01-28 2015-12-21 Hon Hai Prec Ind Co Ltd 電連接器及電連接器端子
EP2962365A1 (en) * 2013-02-27 2016-01-06 ABB Technology AG Programming connector
US11067601B2 (en) * 2013-03-08 2021-07-20 Donald DeMille High accuracy electrical test interconnection device and method for electrical circuit board testing
JP6029511B2 (ja) * 2013-03-28 2016-11-24 株式会社エンプラス 電気接触子、電気接触子の製造方法および電気部品用ソケット
JP5985447B2 (ja) * 2013-08-21 2016-09-06 オムロン株式会社 プローブピン、および、これを用いた電子デバイス
JP6553472B2 (ja) * 2015-09-30 2019-07-31 株式会社ヨコオ コンタクタ
US20170146568A1 (en) * 2015-11-19 2017-05-25 WinWay Tech. Co., Ltd. Electronic test equipment
JP6556612B2 (ja) * 2015-12-04 2019-08-07 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US10608354B2 (en) * 2017-03-23 2020-03-31 Verily Life Sciences Llc Implantable connector with two electrical components
JP2019074483A (ja) * 2017-10-19 2019-05-16 株式会社日本マイクロニクス 電気的接続装置
US10367279B2 (en) * 2017-10-26 2019-07-30 Xilinx, Inc. Pusher pin having a non-electrically conductive portion
KR102013176B1 (ko) * 2019-06-13 2019-08-22 주식회사 제네드 교체 가능한 싱글타입 프로브 핀
CN112510434A (zh) * 2019-09-16 2021-03-16 康普技术有限责任公司 具有轴向浮动的内接触部的同轴连接器
KR102214091B1 (ko) * 2020-03-20 2021-02-09 주식회사 메가터치 포고핀의 플런저 및 그 플런저를 구비한 포고핀
US11437747B2 (en) * 2020-09-25 2022-09-06 Apple Inc. Spring-loaded contacts having capsule intermediate object
US11942722B2 (en) 2020-09-25 2024-03-26 Apple Inc. Magnetic circuit for magnetic connector
JP2022079959A (ja) * 2020-11-17 2022-05-27 山一電機株式会社 検査用ソケット
US11569601B2 (en) * 2021-03-11 2023-01-31 Enplas Corporation Socket and inspection socket

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3435168A (en) 1968-03-28 1969-03-25 Pylon Co Inc Electrical contact
US4321532A (en) * 1978-03-16 1982-03-23 Luna L Jack Repairable spring probe assembly
US4397519A (en) * 1981-05-12 1983-08-09 Pylon Company, Inc. Electrical contact construction
US5084673A (en) * 1989-06-15 1992-01-28 Nhk Spring Co., Ltd. Electric contact probe
JPH0782028B2 (ja) 1990-07-30 1995-09-06 日本発条株式会社 導電性接触子
US5521519A (en) * 1992-07-30 1996-05-28 International Business Machines Corporation Spring probe with piloted and headed contact and method of tip formation
US6046597A (en) * 1995-10-04 2000-04-04 Oz Technologies, Inc. Test socket for an IC device
JP3634074B2 (ja) * 1996-06-28 2005-03-30 日本発条株式会社 導電性接触子
US6084421A (en) * 1997-04-15 2000-07-04 Delaware Capital Formation, Inc. Test socket
US6204680B1 (en) 1997-04-15 2001-03-20 Delaware Capital Formation, Inc. Test socket
US6053777A (en) * 1998-01-05 2000-04-25 Rika Electronics International, Inc. Coaxial contact assembly apparatus
AU1820900A (en) 1998-11-25 2000-06-13 Rika Electronics International, Inc. Electrical contact system
US6377059B2 (en) * 1999-02-19 2002-04-23 Delaware Capital Formation, Inc. Crown shaped contact barrel configuration for spring probe
KR100373152B1 (ko) * 1999-11-17 2003-02-25 가부시키가이샤 아드반테스트 Ｉｃ 소켓 및 ｉｃ 시험 장치
US6424166B1 (en) * 2000-07-14 2002-07-23 David W. Henry Probe and test socket assembly
JP3443687B2 (ja) * 2001-02-19 2003-09-08 株式会社エンプラス 電気部品用ソケット

Also Published As

Publication number Publication date
US6685492B2 (en) 2004-02-03
JP2006504226A (ja) 2006-02-02
US20030124895A1 (en) 2003-07-03
KR20040068988A (ko) 2004-08-02
TW200301592A (en) 2003-07-01
AU2002324585A1 (en) 2003-07-24
WO2003058769A1 (en) 2003-07-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees