TWI263782B - Nondestructive and noncontact analysis system - Google Patents

Nondestructive and noncontact analysis system

Info

Publication number
TWI263782B
TWI263782B TW093131976A TW93131976A TWI263782B TW I263782 B TWI263782 B TW I263782B TW 093131976 A TW093131976 A TW 093131976A TW 93131976 A TW93131976 A TW 93131976A TW I263782 B TWI263782 B TW I263782B
Authority
TW
Taiwan
Prior art keywords
signal
light beam
modulated
magnetic field
phase difference
Prior art date
Application number
TW093131976A
Other languages
English (en)
Other versions
TW200523539A (en
Inventor
Kiyoshi Nikawa
Original Assignee
Nec Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Electronics Corp filed Critical Nec Electronics Corp
Publication of TW200523539A publication Critical patent/TW200523539A/zh
Application granted granted Critical
Publication of TWI263782B publication Critical patent/TWI263782B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/314—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry with comparison of measurements at specific and non-specific wavelengths
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/20—Arrangements or instruments for measuring magnetic variables involving magnetic resonance
    • G01R33/28—Details of apparatus provided for in groups G01R33/44 - G01R33/64
    • G01R33/32—Excitation or detection systems, e.g. using radio frequency signals
    • G01R33/36—Electrical details, e.g. matching or coupling of the coil to the receiver
    • G01R33/3621—NMR receivers or demodulators, e.g. preamplifiers, means for frequency modulation of the MR signal using a digital down converter, means for analog to digital conversion [ADC] or for filtering or processing of the MR signal such as bandpass filtering, resampling, decimation or interpolation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
  • Measuring Magnetic Variables (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW093131976A 2003-10-29 2004-10-21 Nondestructive and noncontact analysis system TWI263782B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003369087A JP2005134196A (ja) 2003-10-29 2003-10-29 非破壊解析方法及び非破壊解析装置

Publications (2)

Publication Number Publication Date
TW200523539A TW200523539A (en) 2005-07-16
TWI263782B true TWI263782B (en) 2006-10-11

Family

ID=34420169

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093131976A TWI263782B (en) 2003-10-29 2004-10-21 Nondestructive and noncontact analysis system

Country Status (8)

Country Link
US (1) US20050140367A1 (zh)
EP (1) EP1528400B1 (zh)
JP (1) JP2005134196A (zh)
KR (1) KR100697864B1 (zh)
CN (1) CN100417940C (zh)
DE (1) DE602004008186T2 (zh)
SG (1) SG111281A1 (zh)
TW (1) TWI263782B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4684690B2 (ja) * 2005-03-15 2011-05-18 ルネサスエレクトロニクス株式会社 走査レーザｓｑｕｉｄ顕微鏡を用いた検査方法および装置
JP2006337203A (ja) * 2005-06-02 2006-12-14 Nec Electronics Corp 位置出し方法と装置
JP2007127499A (ja) * 2005-11-02 2007-05-24 Nec Electronics Corp 非破壊検査装置および非破壊検査方法
JP2007127590A (ja) * 2005-11-07 2007-05-24 Nec Electronics Corp 半導体装置の検査方法および装置
JP2009008626A (ja) * 2007-06-29 2009-01-15 Nec Electronics Corp 故障解析方法及び故障解析装置
KR101012763B1 (ko) * 2008-06-11 2011-02-08 한국표준과학연구원 원자자력계를 이용한 초고감도 투자율 검출장치 및 그이용방법
US8754633B2 (en) 2009-05-01 2014-06-17 Dcg Systems, Inc. Systems and method for laser voltage imaging state mapping
JP4883424B2 (ja) * 2009-12-17 2012-02-22 学校法人金沢工業大学 微小磁気二次元分布検出装置
JP5745707B2 (ja) 2013-02-01 2015-07-08 浜松ホトニクス株式会社 半導体デバイス検査装置及び半導体デバイス検査方法
CN103698644B (zh) * 2013-12-18 2016-06-01 马震远 基于霍尔传感器列阵的pcb短路检测方法及检测装置
JP6632327B2 (ja) 2015-10-30 2020-01-22 浜松ホトニクス株式会社 画像生成方法、画像生成装置、画像生成プログラム及び記録媒体
CN107807142A (zh) * 2017-10-26 2018-03-16 北京航空航天大学 一种固体所含杂质浓度的测量系统及测量方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5940157A (ja) * 1982-08-30 1984-03-05 Shimadzu Corp 走査磁気顕微鏡
JPH0783884A (ja) * 1993-09-14 1995-03-31 Kenzo Miya 探傷検査方法、探傷検査装置、及び探傷検査用センサ
US5525907A (en) * 1995-03-17 1996-06-11 Hughes Missile Systems Company Active impulse magnetometer with bipolar magnetic impulse generator and fast fourier transform receiver to detect sub-surface metallic materials
US5610517A (en) * 1995-06-07 1997-03-11 Vanderbilt University Method and apparatus for detecting flaws below the surface of an electrically conductive object
JP3116856B2 (ja) * 1997-03-31 2000-12-11 日本電気株式会社 半導体集積回路の断線故障検出方法
US6444895B1 (en) * 1998-09-28 2002-09-03 Nec Corporation Device and method for nondestructive inspection on semiconductor device
DE19859725C2 (de) * 1998-12-23 2001-02-22 Stefan Dengler Vorrichtung zur Ermittlung von Verformungen an einer Objektoberfläche, insbesondere einer diffus streuenden Objektoberfläche und Verwendung der Vorichtung
JP2000241510A (ja) * 1999-02-24 2000-09-08 Ando Electric Co Ltd 集積回路テスタ
JP3302344B2 (ja) * 1999-08-05 2002-07-15 岩手県 走査型スクイド顕微鏡
US6396261B1 (en) * 2000-03-20 2002-05-28 Nec Research Institute, Inc. Scanning AC hall microscope
US6924641B1 (en) * 2000-05-19 2005-08-02 Applied Materials, Inc. Method and apparatus for monitoring a metal layer during chemical mechanical polishing
US6602724B2 (en) * 2000-07-27 2003-08-05 Applied Materials, Inc. Chemical mechanical polishing of a metal layer with polishing rate monitoring
JP2002313859A (ja) * 2001-02-09 2002-10-25 Nec Corp 非破壊検査方法および装置ならびに半導体チップ
TW528874B (en) * 2000-10-26 2003-04-21 Nec Electronics Corp Non-destructive inspection method
JP3491017B2 (ja) * 2001-03-30 2004-01-26 岩手県 スクイド磁気画像化装置
JP2003035738A (ja) * 2001-07-19 2003-02-07 Omron Corp 部品実装基板の検査方法および部品実装基板用の検査装置
JP2003197700A (ja) * 2001-12-27 2003-07-11 Iwate Prefecture 半導体の検査方法及び半導体の検査装置
JP3647818B2 (ja) * 2002-03-27 2005-05-18 岩手県 近接場光励起スクイド顕微鏡装置

Also Published As

Publication number Publication date
DE602004008186D1 (de) 2007-09-27
JP2005134196A (ja) 2005-05-26
CN100417940C (zh) 2008-09-10
EP1528400A3 (en) 2005-06-01
US20050140367A1 (en) 2005-06-30
SG111281A1 (en) 2005-05-30
EP1528400B1 (en) 2007-08-15
KR100697864B1 (ko) 2007-03-22
KR20050040809A (ko) 2005-05-03
DE602004008186T2 (de) 2008-04-30
EP1528400A2 (en) 2005-05-04
TW200523539A (en) 2005-07-16
CN1611935A (zh) 2005-05-04

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