TWI247632B - Apparatus and method for cleaning parts - Google Patents

Apparatus and method for cleaning parts Download PDF

Info

Publication number
TWI247632B
TWI247632B TW092128411A TW92128411A TWI247632B TW I247632 B TWI247632 B TW I247632B TW 092128411 A TW092128411 A TW 092128411A TW 92128411 A TW92128411 A TW 92128411A TW I247632 B TWI247632 B TW I247632B
Authority
TW
Taiwan
Prior art keywords
cleaning
washing
liquid
washed
hole
Prior art date
Application number
TW092128411A
Other languages
English (en)
Chinese (zh)
Other versions
TW200416075A (en
Inventor
Junichi Maeno
Kaichi Masunari
Kazutaka Zenfuku
Original Assignee
Arakawa Chem Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arakawa Chem Ind filed Critical Arakawa Chem Ind
Publication of TW200416075A publication Critical patent/TW200416075A/zh
Application granted granted Critical
Publication of TWI247632B publication Critical patent/TWI247632B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
TW092128411A 2002-10-24 2003-10-14 Apparatus and method for cleaning parts TWI247632B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002310179A JP3846584B2 (ja) 2002-10-24 2002-10-24 部品類の洗浄装置及び洗浄方法

Publications (2)

Publication Number Publication Date
TW200416075A TW200416075A (en) 2004-09-01
TWI247632B true TWI247632B (en) 2006-01-21

Family

ID=32171042

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092128411A TWI247632B (en) 2002-10-24 2003-10-14 Apparatus and method for cleaning parts

Country Status (6)

Country Link
JP (1) JP3846584B2 (ja)
KR (1) KR100988294B1 (ja)
CN (1) CN100336611C (ja)
HK (1) HK1082930A1 (ja)
TW (1) TWI247632B (ja)
WO (1) WO2004037452A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI393595B (zh) * 2006-03-17 2013-04-21 Michale Goodson J 具有頻率掃描的厚度模式轉換器之超高頻音波處理設備
JP2009071201A (ja) * 2007-09-18 2009-04-02 Nec Electronics Corp 洗浄装置
JP2009160483A (ja) * 2007-12-28 2009-07-23 Nec Electronics Corp 循環型洗浄装置
CN101912853B (zh) * 2010-09-03 2011-11-02 任保林 超声波脉冲水射流管壁除锈清洗装置
CN102274838A (zh) * 2011-05-06 2011-12-14 湘潭大众整流器制造有限公司 超声波清洗机
CN102522322A (zh) * 2011-12-15 2012-06-27 华东光电集成器件研究所 一种半导体芯粒的清洗装置
US10441980B2 (en) 2014-04-22 2019-10-15 Fuji Corporation Nozzle cleaning device and nozzle drying method
CN106540917B (zh) * 2015-09-16 2020-03-31 泰科电子(上海)有限公司 超声波清洗系统
CN106541329B (zh) * 2015-09-16 2019-01-01 泰科电子(上海)有限公司 集成设备
JP6861427B2 (ja) * 2015-10-16 2021-04-21 株式会社Ｆｕｊｉ ノズル洗浄装置およびノズル乾燥方法
CN107185870A (zh) * 2017-07-25 2017-09-22 安徽瑞泰汽车零部件有限责任公司 一种铝合金零件清洗装置及清洗方法
CN108580424B (zh) * 2018-03-22 2024-01-09 温州医科大学附属口腔医院 一种电动牙洁治器手柄清洗装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0478978U (ja) * 1990-11-19 1992-07-09
JP3988320B2 (ja) * 1999-06-18 2007-10-10 荒川化学工業株式会社 物品の洗浄方法および洗浄装置
JP2001162237A (ja) * 1999-12-09 2001-06-19 Totoku Electric Co Ltd エナメル線用塗料塗布ダイスの洗浄装置
JP3494293B2 (ja) 2000-10-25 2004-02-09 株式会社カイジョー 密閉型容器の洗浄方法及び洗浄装置
CN2514947Y (zh) * 2001-11-23 2002-10-09 亚智科技股份有限公司 盲导孔及小孔清洗装置

Also Published As

Publication number Publication date
JP2004141778A (ja) 2004-05-20
KR100988294B1 (ko) 2010-10-18
CN1708365A (zh) 2005-12-14
HK1082930A1 (en) 2006-06-23
TW200416075A (en) 2004-09-01
KR20050055031A (ko) 2005-06-10
CN100336611C (zh) 2007-09-12
JP3846584B2 (ja) 2006-11-15
WO2004037452A1 (ja) 2004-05-06

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Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees