玖、發明說明： I：發明所屬之技術領域】 技術領域 本發明係有關於散熱器、揚聲器等資訊處理裝置之功 能性元件。 背景技術 在資訊處理裝置之開發中，為了保持商品競爭力，通 常必須降低元件成本’特狀要求魏性元件(魏性構造 物)之成本降低。 過去在匕3〜功把性之構造物（元件）的資訊處理裝置 中’藉由以下所示之方法，㈣現將魏性構造物安裝於 多數不同的安裝位置或不同的承接側之構造。 ⑷根據安裝位置或切側之構造來變更功紐構造物 本身的構造。 (b)依照安裝位置來變争田”门〜 更用以固疋功能性構造物之承接 側之構造物的構造。 (C)除了功驗構糾與固定有該功雛構造物之承接 側的構造物以外，另使心調整安裝位置或構造之第3構造 物存在於其間。 在採用上述習知之任— 万法日守，當將功能性構造物安 裝於多數不同的安裴位置痞总 4文I於不同的承接側之構造物 時’必須具有多數構造不同的魏性構造物，且會增加功 能性構造物（功能性元件）之制、生 衣k成本，而有損商品競爭力。 1223739 【發明内容】 發明概要 因此，本發明之目的係提供一種可無損功能而安裝於 多數不同的安裝位置或承接側構造之資訊處理裝置之功能 5 性元件。 根據本發明，係提供一種資訊處理裝置之功能性元 件，該資訊處理裝置之功能性元件包含有在第1姿勢與從該 第1姿勢旋轉90度之第2姿勢下其投影為相同形狀之功能部 分、於前述第1姿勢時固定於資訊處理裝置之第1安裝部之 10 第1固定部及於前述第2姿勢時固定於與資訊處理裝置之前 述第1安裝部不同的第2安裝部之第2固定部。 由於本發明之功能性元件具有上述特徵，故欲將功能 性元件固定於不同的安裝部時，可藉由將功能性元件旋轉 90度，而無損其功能地固定功能性元件。更理想的是功能 15 性元件由散熱器、具風扇之散熱器或揚聲器等所構成。 根據本發明之另一項特徵，係提供一種資訊處理裝置 之功能性元件，該資訊處理裝置之功能性元件包含有在第1 姿勢與從該第1姿勢反面之第2姿勢下為相同形狀之功能部 分，以及設於距離前述功能性元件之表裡面不相等的位置。 20 圖式簡單說明 第1圖係本發明第1實施形態之散熱器的透視圖。 第2A圖係第1實施形態之散熱器的平面圖。 第2B圖係第1實施形態之散熱器的裡面圖。 第2C圖係第2A圖之正視圖。 6 1223739 第2D圖係第2A圖之右測視圖。 第3A圖係已搭載具有第1承接構造之半導體晶片之基 板的透視圖。 第3B圖係顯示將散熱器固定於第3A圖所示之基板的 5 情形之分解透視圖。 第4A圖係搭載有具有第2承接構造之半導體晶片之基 板的透視圖。 第4B圖係顯示將散熱器固定於第4A圖所示之基板的 情形之分解透視圖。 10 第5圖係本發明第2實施形態之具風扇之散熱器的透視 圖。 第6A圖係第2實施形態之具風扇之散熱器的平面圖。 第6B圖係第2實施形態之具風扇之散熱器的裡面圖。 第6C圖係第6A圖之正視圖。 15 第6D圖係第6A圖之右側視圖。 第7A圖係搭載有具有第3承接構造之半導體晶片之基 板的透視圖。 第7B圖係顯示將具風扇之散熱器搭載於第7A圖所示 之基板的情形之正視圖。 20 第8A圖係搭載有具有第3承接構造且不同的半導體晶 片之基板的透視圖。 第8B圖係將具風扇之散熱器搭載於第8A圖所示之基 板的情形之正視圖。 第9A圖係與本發明第3實施形態相關之揚聲器組的透 7 1223739 視圖。 第9B圖係從左方看第9八圖之透視圖。 第9C圖係揚聲器組之背面側透視圖。 第10A圖係具有第4承接構造之框體的透視圖。 5 帛獅圖係、顯示將揚聲器組搭載於第1QA圖所示之框 體的情形之透視圖。 第11A圖係具有第5承接構造之框體的透視圖。 第11B圖係顯示將揚聲器組搭載於第llA圖所示之框 體的情形之透視圖。 10 【實施方式】 實施發明之最佳形態 參照第1圖，第1圖顯示與本發明第i實施形態相關之散 熱器的透視圖。散熱器2係構成為多數放熱風扇6一體地形 成於基板4上。散熱器2由例如鋁或鋁合金所形成。如第2a 15圖及第2B圖清楚地顯示，從散熱器2的一邊一體地突出2個 分別具有安裝孔（固定孔）14之安裝支架（固定支架）12，且從 與該邊相對之邊亦一體地突出2個分別具有安裝孔14之安 裝支架12。該等安裝支架12係構成第丄固定部。 另一方面，從與前述兩邊垂直之一邊一體地突出2個分 20別具有安裝孔（固定孔之安裝支架（固定支架）16，且從與 該邊相對之邊一體地突出1個具有安裝孔（固定孔）18之安裝 支架（固定支架）16,又，以該等3個安裝支架16構成第2固定 部。 由散熱器2之功能部分之多數放熱風扇6所構成之放熱 8 48係構成為在第2A圖所示之第i姿勢與從該第丄姿勢旋轉 9〇度之第2文勢下其投影為相同形狀者。如第2B圖所示，散 熱器^之基板4的底面Μ受熱賴，且受熱面訓彡成為在 上述第1姿勢與從該第J姿勢旋轉9〇度之第2姿勢下其投影 為相同形狀者。 第3Α圖係顯示具有由4個安裝孔（固定孔）24所構成之 第1承接構造且搭載有半導體晶片22之基板2〇。當將散熱器 2固定於該基板2〇上時，則如第3Β圖所示，使用4個安裝支 茱12。即’通過各安裝支架12之孔14，將未圖示之螺絲螺 合於安裝孔24，藉此將散熱器2固定於基板20上。 第4Α圖係顯示具有由3個安裝孔（固定孔）26所構成之 第2承接構造且搭載有半導體晶片22之基板2〇，。當將散熱 器2固定於該基板2〇,上時，則如第4^圖所示，使散熱器2從 第3Β圖所示之第1姿勢向右或向左旋轉90度而變成第2姿 勢。然後，使用3個支架16將散熱器2固定於基板20,上。即， 將螺絲插入安裝支架16之孔18，且將該螺絲螺合於安裝孔 26 ’藉此將散熱器2固定於基板2〇,上。 如上所述，於本實施形態之散熱器2中，機能部分之放 熱部8與受熱面1〇係構成為在第丨姿勢與從該第1姿勢旋轉 90度之第2姿勢下其投影為同一形狀者。另一方面，安裝支 架12在散熱器2為第1姿勢時使用，而安裝支架16則在散熱 器2為第2姿勢時使用。該等安裝支架12、16則未構成為在 第1姿勢與從該第1姿勢旋轉90度之第2姿勢下其投影為相 同形狀者。 藉此，當散熱器2為第i姿勢時，係使用4個安裝支架12 來固定散熱器2’而當安裝部（固定部）之承接構造不同時’ 則將散熱器2從第1姿勢旋轉9〇度，藉此可一面保持其功能 一致，一面使用3個安裝支架來固定散熱器2。如此一來， 由於可一面保持功能一致一面固定於多數不同的承接構 造，故不必另外設計成使散熱器配合各種承接構造，而可 降低散熱器之元件成本。 參照第5圖，第5圖顯示與本發明第2實施形態相關之具 風扇之散熱器的透視圖。第6A圖係顯示具風扇之散熱器的 平面圖，第6B圖係顯示其裡面圖，第6(：圖係顯示第6A圖之 正視圖，第6D圖係顯示第6A圖之右側視圖。 散熱器30具有風扇32。34為放熱風扇，且由多數放熱 風扇34來構成放熱部36。如第6A圖及第6B圖所示，散熱器 30在其表面及裡面具有相同的受熱面弘、4〇。於本實施形 態之具風扇之散熱器30中，功能部分之風扇32、受熱面兕、 40及放熱部36從表面側（上面側）及裡面側（下面側）觀看時 為同一構造。 另方面，散熱器30具有4個分別具有安裝孔（固定 孔)44之安裝支架（固定支架）42，但該等安裝支架42設於離 上下面之距離不同的位置。即，如第6c圖所示，安裝支架 42設於離散熱器3〇上面之距離為H1且離下 面之距離為H2 之位置’且H1為例如7mm 而H2為例如4mm。 “、第7八圖’第7八圖顯示具有由*個分別具有螺絲孔 之銷所構成之第3承接構造且安裝有半導體日日日片48之基 1223739 板46。當將具風扇之散熱器30固定於該基板46上時，將散 熱器30從第6C圖所示之狀態反轉，而如第7圖所示，將安裝 支架42搭載於銷50上，且將安裝支架42螺合於銷50，藉此 將具風扇之散熱器30固定於基板46上。 5 第8A圖係顯示與第7A圖所示之基板46具有相同的第3 承接構造且安裝有高度不同的半導體晶片52之基板46,。當 將具風扇之散熱器30固定於該基板46,上時，係以第6C圖所 示之狀態將安裝支架42搭載於銷50上，且將安裝支架42螺 合固定於銷50。如此一來，如第8B圖所示，具風扇之散熱 10器30則以離基板46’有些微距離之狀態固定於基板46,。因 此’可防止高度較高之半導體晶片52與具風扇之散熱器3〇 互相干涉。 本實施形態之具風扇之散熱器3〇由於具有上下面為相 同形狀之功能部分，且離安裝支架之上下面的距離不同， 15故即使安裝於同一承接構造，亦可藉由改換上下面，來提 供不同的受熱面高度。 參照第9A圖，第9A圖顯示與本發明第3實施形態相關 之揚聲器組56的透視圖。第9B圖顯示從左斜後方看第9A圖 時之透視圖，第9C圖顯示從背面觀看時之透視圖。揚聲器 20 組56係構成為用框架60來支持揚聲器58。框架60具有一對 相向之分別具有安裝孔（固定孔）64之安裝支架（固定支 架）62及一對於與該等安裝支架62垂直之方向相向之分別 具有安裝孔（固定孔)68之安裝支架（固定支架）66。 第10A圖顯示具有由一對推壓板72、74及銷76所構成之 11 1223739 第4承接構造之框體7〇。當將揚聲器組％固定於該框體％ 時，以第9B圖所示之狀態將銷76插入安裝支架62之安裝孔 64中，而如第1()6圖所不，將揚聲器組允固定於框體7〇，以 用推壓板72、74來推壓揚聲器組56兩端。 5 第11A圖係顯示具有由高度較高之推壓板82、84及銷86 所構成之第5承接構造之框體8〇。當將揚聲器組兄固定於該 框體80時，將第9A圖所示之狀態之揚聲器組％朝左轉方向 方疋轉90度。然後，如第11B圖所示，將銷86插入安裝支架66 之女裝孔68中，而將揚聲器組56固定於框體8〇，以用推壓 10 板82、84來推壓揚聲器組56兩端。 於本實施形態中，雖然用以安裝揚聲器組56之承接側 的構造不同，但由於在揚聲器組預先具有2種不同的安裝構 造，故可以同一揚聲器組之構造安裝於兩種框體。 根據本發明，由於功能性元件包含有在第1姿勢與從該 b第1姿勢旋轉90度之第2姿勢下其投影為相同形狀之功能部 分、於前述第1姿勢時固定於資訊處理裝置之第1安裝部之 第1固定部及於前述第2姿勢時固定於與資訊處理裝置之前 述第1安裝部不同的第2安裝部之第2固定部，故在安裝於多 數不同的安I位置或安裝於不同的承接構造上，不會損宝 20其功能，而可安裝同一功能性元件。如此一來，可減少元 件之共通性及元件數量，並因降低製造成本而強化資訊處 理裝置之商品競爭力。 【圓式簡單說明】 第1圖係本發明第1實施形態之散熱器的透視圖。 12 1223739 弟2 A圖係弟1貫施形悲之散熱器的平面圖。 第2B圖係第1實施形態之散熱器的裡面圖。 第2C圖係第2A圖之正視圖。 弟2D圖係弟2 A圖之右測視圖。 5 第3A圖係已搭載具有第1承接構造之半導體晶片之基 板的透視圖。 第3B圖係顯示將散熱器固定於第3A圖所示之基板的 情形之分解透視圖。 第4A圖係搭載有具有第2承接構造之半導體晶片之基 10 板的透視圖。 第4B圖係顯示將散熱器固定於第4A圖所示之基板的 情形之分解透視圖。 第5圖係本發明第2實施形態之具風扇之散熱器的透視 圖。 15 第6A圖係第2實施形態之具風扇之散熱器的平面圖。 弟6B圖係弟2貫施形怨之具風扇之散熱益的裡面圖。 第6C圖係第6A圖之正視圖。 第6D圖係第6A圖之右側視圖。 第7A圖係搭載有具有第3承接構造之半導體晶片之基 20 板的透視圖。 第7B圖係顯示將具風扇之散熱器搭載於第7A圖所示 之基板的情形之正視圖。 第8A圖係搭載有具有第3承接構造且不同的半導體晶 片之基板的透視圖。 13 1223739 第8B圖係將具風扇之散熱器搭載於第8A圖所示之基 板的情形之正視圖。 第9A圖係與本發明第3實施形態相關之揚聲器組的透 視圖。 5 第9B圖係從左方看第9A圖之透視圖。 第9C圖係揚聲器組之背面側透視圖。 第10A圖係具有第4承接構造之框體的透視圖。2. Description of the invention: I: Technical field to which the invention belongs] Technical Field The present invention relates to functional elements of information processing devices such as radiators and speakers. Background Art In the development of information processing devices, in order to maintain the competitiveness of products, it is often necessary to reduce the cost of components. The special feature requires that the cost of a flexible component (structural structure) be reduced. In the past, in the information processing device of the structure (element) with a handle structure of 3 to 3 degrees, the structure of the Wei structure was installed at many different installation positions or different receiving sides by the method shown below.变更 Change the structure of the function structure itself according to the installation position or the structure on the cut side. (b) Change the contention gate according to the installation position ~ It is used to fix the structure of the structure on the receiving side of the functional structure. (C) In addition to the work verification structure and the receiving side on which the structure is fixed In addition to the structure, a third structure exists to adjust the installation position or structure. In the above-mentioned conventional method-Wanfa Rishou, when the functional structure is installed in many different positions Article 4 In the case of different structures on the receiving side, 'we must have a large number of Wei structure with different structures, and it will increase the cost of manufacturing the functional structure (functional element) and the cost of clothing, which will damage the competitiveness of the product. 1223739 [Summary of the invention] SUMMARY OF THE INVENTION Therefore, the object of the present invention is to provide a functional element of an information processing device that can be installed in most different installation positions or receiving side structures without loss of function. According to the present invention, an information is provided A functional element of a processing device. The functional element of the information processing device includes a function of projecting the same shape in a first posture and a second posture rotated 90 degrees from the first posture. 10, the first fixing portion fixed to the first mounting portion of the information processing device in the first posture, and the second fixing portion fixed to the second mounting portion, which is different from the first mounting portion of the information processing device, in the second posture. Second fixing part. Since the functional element of the present invention has the above-mentioned characteristics, when the functional element is to be fixed to different mounting parts, the functional element can be fixed by rotating the functional element 90 degrees without impairing its function. .It is more desirable that the functional component is composed of a radiator, a radiator with a fan, or a speaker, etc. According to another feature of the present invention, a functional component of an information processing device is provided. The sexual element includes a functional part having the same shape in the first posture and the second posture from the reverse side of the first posture, and is located at an unequal position from the surface of the aforementioned functional element. 20 Schematic illustration of the first The figure is a perspective view of the heat sink of the first embodiment of the present invention. FIG. 2A is a plan view of the heat sink of the first embodiment. FIG. 2B is the inside of the heat sink of the first embodiment. Figure 2C is a front view of Figure 2A. 6 1223739 Figure 2D is a right view of Figure 2A. Figure 3A is a perspective view of a substrate on which a semiconductor wafer having a first receiving structure is mounted. Figure 3B The figure is an exploded perspective view showing a case where the heat sink is fixed to the substrate shown in FIG. 3A. FIG. 4A is a perspective view of a substrate on which a semiconductor wafer having a second receiving structure is mounted. An exploded perspective view of the case where the device is fixed to the substrate shown in FIG. 4A. 10 FIG. 5 is a perspective view of a heat sink with a fan according to a second embodiment of the present invention. FIG. 6A is a fan with a fan according to the second embodiment. A plan view of the radiator. Fig. 6B is a rear view of the radiator with a fan according to the second embodiment. Fig. 6C is a front view of Fig. 6A. 15 Figure 6D is a right side view of Figure 6A. Fig. 7A is a perspective view of a substrate on which a semiconductor wafer having a third receiving structure is mounted. Fig. 7B is a front view showing a case where a fan-equipped heat sink is mounted on the substrate shown in Fig. 7A. 20 FIG. 8A is a perspective view of a substrate on which a different semiconductor wafer having a third receiving structure is mounted. Fig. 8B is a front view of a case where a radiator with a fan is mounted on the substrate shown in Fig. 8A. Fig. 9A is a transparent view of a speaker unit related to the third embodiment of the present invention. Figure 9B is a perspective view of Figure 98 from the left. Figure 9C is a perspective view of the rear side of the speaker unit. Fig. 10A is a perspective view of a frame having a fourth receiving structure. 5 The Griffon figure is a perspective view showing the case where the speaker unit is mounted on the frame shown in Figure 1QA. Fig. 11A is a perspective view of a frame having a fifth receiving structure. Fig. 11B is a perspective view showing a case where the speaker unit is mounted on the frame shown in Fig. 11A. [Embodiment] Best Mode for Carrying Out the Invention With reference to Fig. 1, Fig. 1 shows a perspective view of a radiator related to an i-th embodiment of the present invention. The heat sink 2 is configured such that a large number of heat radiation fans 6 are integrally formed on the substrate 4. The heat sink 2 is formed of, for example, aluminum or an aluminum alloy. As clearly shown in Figs. 2a to 15 and 2B, two mounting brackets (fixing brackets) 12 each having a mounting hole (fixing hole) 14 are integrally protruded from one side of the heat sink 2, and from the side opposite to the side Two mounting brackets 12 each having a mounting hole 14 are also integrally projected. The mounting brackets 12 constitute a first fixed portion. On the other hand, two points 20 are integrally projected from one side perpendicular to the two sides, and each has a mounting hole (a mounting bracket (fixation bracket) 16 for a fixing hole) 16, and one side has a mounting hole integrally protruding from an opposite side. (Fixing hole) 18 is a mounting bracket (fixing bracket) 16, and the second fixing portion is constituted by the three mounting brackets 16. The heat radiation 8 formed by most of the heat radiation fans 6 of the functional part of the radiator 2 is composed of 48 It is the same shape when the i-th pose shown in FIG. 2A is the same shape as that of the second aspect rotated 90 degrees from the 丄 th pose. As shown in FIG. 2B, the bottom surface M of the substrate 4 of the heat sink ^ Heated, and the heated surface is instructed to become the same shape in the first position and the second position rotated 90 degrees from the Jth position. Figure 3A shows that there are four mounting holes (fixing holes). ) 24 is a first receiving structure and a substrate 20 on which a semiconductor wafer 22 is mounted. When the heat sink 2 is fixed to the substrate 20, as shown in FIG. 3B, four mounting brackets 12 are used. That is, 'through the holes 14 of each mounting bracket 12, screw the unillustrated screws to The mounting hole 24 is used to fix the heat sink 2 to the substrate 20. Fig. 4A shows a substrate 20 having a second receiving structure composed of three mounting holes (fixing holes) 26 and a semiconductor wafer 22 mounted thereon, When the radiator 2 is fixed on the substrate 20, as shown in FIG. 4 ^, the radiator 2 is rotated 90 degrees to the right or left from the first posture shown in FIG. 3B to become the first 2 posture. Then, use three brackets 16 to fix the radiator 2 on the substrate 20, that is, insert the screws into the holes 18 of the mounting bracket 16 and screw the screws into the mounting holes 26 'to thereby fix the radiator 2 It is fixed on the substrate 20, as described above. In the heat sink 2 according to this embodiment, the heat radiation portion 8 and the heat receiving surface 10 of the functional part are configured to be rotated in the first posture and rotated 90 degrees from the first posture. In the second posture, the projection is the same shape. On the other hand, the mounting bracket 12 is used when the radiator 2 is in the first posture, and the mounting bracket 16 is used when the radiator 2 is in the second posture. These mounting brackets 12 And 16 are not configured to have the same projection in the first posture and the second posture rotated 90 degrees from the first posture In this way, when the radiator 2 is in the i-th posture, four mounting brackets 12 are used to fix the radiator 2 ', and when the receiving structure of the mounting portion (fixing portion) is different', the radiator 2 is removed from the first 1 posture rotates 90 degrees, which can maintain the same function while using 3 mounting brackets to fix the radiator 2. In this way, because it can be fixed to most different receiving structures while maintaining the same function, it is not necessary to It is designed to match the radiator with various receiving structures, which can reduce the component cost of the radiator. Referring to FIG. 5, FIG. 5 shows a perspective view of a radiator with a fan related to the second embodiment of the present invention. Figure 6B shows the plan view of the radiator with fan. Figure 6B shows the inside view, Figure 6 (: shows the front view of Figure 6A, and Figure 6D shows the right view of Figure 6A. The heat sink 30 includes a fan 32. 34 is a heat radiation fan, and a plurality of heat radiation fans 34 constitute a heat radiation portion 36. As shown in Figs. 6A and 6B, the heat sink 30 has the same heat-receiving surface 40 and 40 on its surface and inside. In the fan-equipped heat sink 30 of this embodiment, the fan 32, the heating surface 兕, 40, and the heat radiation portion 36 of the functional portion have the same structure when viewed from the front side (upper side) and the back side (lower side). On the other hand, the heat sink 30 has four mounting brackets (fixing brackets) 42 each having a mounting hole (fixing hole) 44, but these mounting brackets 42 are provided at different positions from the top and bottom. That is, as shown in Fig. 6c, the mounting bracket 42 is provided at a position where the distance from the upper surface of the heat sink 30 is H1 and the distance from the lower surface is H2 ', and H1 is, for example, 7 mm, and H2 is, for example, 4 mm. ", Figure 7-8 'Figure 7-8 shows a base 1223739 board 46 having a third receiving structure composed of * pins with screw holes, respectively, and mounted with semiconductor day-to-day films 48. When the fan is used to dissipate heat When the device 30 is fixed on the substrate 46, the heat sink 30 is reversed from the state shown in FIG. 6C, and as shown in FIG. 7, the mounting bracket 42 is mounted on the pin 50, and the mounting bracket 42 is screwed At the pin 50, the heat sink 30 with a fan is fixed on the substrate 46. 5 FIG. 8A shows that the substrate 46 has the same third receiving structure as the substrate 46 shown in FIG. When the heat sink 30 with a fan is fixed on the base plate 46, the mounting bracket 42 is mounted on the pin 50 in the state shown in FIG. 6C, and the mounting bracket 42 is screwed and fixed on the base plate 46. Pin 50. In this way, as shown in FIG. 8B, the heat sink 10 with a fan is fixed to the substrate 46 with a slight distance from the substrate 46. Therefore, the semiconductor wafer 52 with a higher height can be prevented The radiator 30 with a fan interferes with each other. The radiator 30 with a fan of this embodiment Functional parts with the same shape on the top and bottom, and the distance from the top and bottom of the mounting bracket are different, so even if installed on the same receiving structure, you can provide different heating surface heights by changing the top and bottom. Refer to Section 9A Fig. 9A shows a perspective view of the speaker unit 56 related to the third embodiment of the present invention. Fig. 9B shows a perspective view when Fig. 9A is viewed obliquely from the left and rear, and Fig. 9C shows a perspective view when viewed from the back. The speaker 20 group 56 is configured to support the speaker 58 with a frame 60. The frame 60 has a pair of opposite mounting brackets (fixing brackets) 62 each having a mounting hole (fixing hole) 64, and a pair of mounting brackets (fixing brackets) 62 perpendicular to the mounting brackets 62. The mounting brackets (fixing brackets) 66 each have mounting holes (fixing holes) 68 facing each other. Figure 10A shows a frame having an 11 1223739 fourth receiving structure composed of a pair of push plates 72, 74 and pins 76. 70. When the speaker group% is fixed to the frame%, the pin 76 is inserted into the mounting hole 64 of the mounting bracket 62 in the state shown in FIG. 9B, and as shown in FIG. 1 (6), the speaker is Group allowance At the frame 70, the two ends of the speaker group 56 are pressed by the pressing plates 72 and 74. 5 FIG. 11A shows the fifth receiving structure composed of the pressing plates 82, 84 and pins 86 having a high height. Frame 80. When the speaker group is fixed to the frame 80, the speaker group% in the state shown in FIG. 9A is turned 90 degrees to the left, and then, as shown in FIG. 11B, The pin 86 is inserted into the women's hole 68 of the mounting bracket 66, and the speaker group 56 is fixed to the frame 80, so that both ends of the speaker group 56 are pressed by pressing the 10 plates 82 and 84. In this embodiment, although The structure of the receiving side for mounting the speaker group 56 is different, but since the speaker group has two different mounting structures in advance, the same speaker group structure can be installed in two types of frames. According to the present invention, since the functional element includes a functional portion whose projection is the same shape in the first posture and the second posture rotated 90 degrees from the first posture of b, the functional element is fixed to the information processing device in the first posture. The first fixing portion of the first mounting portion and the second fixing portion of the second mounting portion that is different from the first mounting portion of the information processing device during the second posture are mounted at most different positions. Or it can be installed on different supporting structures, which will not damage the function of Bao 20, but can install the same functional components. In this way, the commonality of components and the number of components can be reduced, and the product competitiveness of information processing devices can be strengthened by reducing manufacturing costs. [Circular Description] FIG. 1 is a perspective view of a heat sink according to a first embodiment of the present invention. 12 1223739 Brother 2 A is a plan view of Brother 1's radiator of shape sadness. Fig. 2B is a rear view of the heat sink of the first embodiment. Figure 2C is a front view of Figure 2A. Brother 2D is the right side view of Brother 2A. 5 Figure 3A is a perspective view of a substrate on which a semiconductor wafer having a first receiving structure is mounted. Fig. 3B is an exploded perspective view showing a state where the heat sink is fixed to the substrate shown in Fig. 3A. Fig. 4A is a perspective view of a substrate 10 on which a semiconductor wafer having a second receiving structure is mounted. Fig. 4B is an exploded perspective view showing a state where the heat sink is fixed to the substrate shown in Fig. 4A. Fig. 5 is a perspective view of a radiator with a fan according to a second embodiment of the present invention. 15 FIG. 6A is a plan view of a radiator with a fan according to the second embodiment. Brother 6B is the inside picture of the fan's heat dissipation benefit. Figure 6C is a front view of Figure 6A. Figure 6D is a right side view of Figure 6A. Fig. 7A is a perspective view of a base plate 20 on which a semiconductor wafer having a third receiving structure is mounted. Fig. 7B is a front view showing a case where a fan-equipped heat sink is mounted on the substrate shown in Fig. 7A. Fig. 8A is a perspective view of a substrate on which a different semiconductor wafer having a third receiving structure is mounted. 13 1223739 Figure 8B is a front view of the case where a fan-mounted radiator is mounted on the substrate shown in Figure 8A. Fig. 9A is a perspective view of a speaker unit according to a third embodiment of the present invention. 5 Figure 9B is a perspective view of Figure 9A from the left. Figure 9C is a perspective view of the rear side of the speaker unit. Fig. 10A is a perspective view of a frame having a fourth receiving structure.
第10 B圖係顯示將揚聲器組搭載於第10 A圖所示之框 體的情形之透視圖。 10 第11A圖係具有第5承接構造之框體的透視圖。 第11B圖係顯示將揚聲器組搭載於第11A圖所示之框 體的情形之透視圖。 【圖式之主要元件代表符號表】 2、30…散熱器 4、20、20’、46、46’…基板 6、34...放熱風扇 8、36...放熱部 10、38、40.··受熱面 12、16、42、62、66···安裝支 架 14、18、24、26、44、64、68··. 安裝孔 22、48、52…半導體晶片 32···風扇 50、76、86···銷 56…揚聲器組 60…框架 70、80...框體 72、74、82、84...推壓板Fig. 10B is a perspective view showing a state in which the speaker unit is mounted on the frame shown in Fig. 10A. 10 FIG. 11A is a perspective view of a frame having a fifth receiving structure. Fig. 11B is a perspective view showing a case where the speaker unit is mounted on the frame shown in Fig. 11A. [Representative symbols for the main components of the figure] 2, 30 ... radiators 4, 20, 20 ', 46, 46' ... substrates 6, 34 ... heat-radiating fans 8, 36 ... heat-radiating sections 10, 38, 40 ........ Heating surface 12, 16, 42, 62, 66 ... Mounting brackets 14, 18, 24, 26, 44, 64, 68 ... Mounting holes 22, 48, 52 ... Semiconductor wafer 32 ... Fan 50, 76, 86 ... Pin 56 ... Speaker set 60 ... Frame 70, 80 ... Frame 72, 74, 82, 84 ... Push plate
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