WO2005006434A1

WO2005006434A1 - Information processing device functional part

Info

Publication number: WO2005006434A1
Application number: PCT/JP2003/008986
Authority: WO
Inventors: Kaito Tanaka
Original assignee: Fujitsu Limited
Priority date: 2003-07-15
Filing date: 2003-07-15
Publication date: 2005-01-20
Also published as: TW200502735A; TWI223739B

Abstract

An information processing device functional part includes a functional section whose projection shape is identical in a first posture and in a second posture rotated by 90 degrees from the first posture. The functional part further includes a first fixing section fixed to a first mounting section of an information processing device when in the first posture and a second fixing section fixed to a second mounting section which is different from the first mounting section of the information processing device when in the second posture.

Description

Description Functional parts of information processing equipment Technology field

The present invention relates to a functional component of an information processing device such as a heat sink and a speaker. Background technology

In the development of information processing equipment, it is always necessary to reduce the cost of parts in order to maintain product competitiveness. In particular, the cost of functional components (functional structures) is required.

Conventionally, in an information processing device having a functional structure (parts), the functional structure can be mounted to a plurality of different mounting positions or different receiving-side structures by the following method. Was.

(a) The structure of the functional structure itself is changed depending on the mounting position or the structure on the receiving side.

(b) Change the structure of the receiving-side structure that fixes the functional structure according to the mounting position.

(c) In addition to the functional structure and the receiving-side structure to which it is fixed, a third structure for adjusting the mounting position or the structure is interposed.

In any of the above-mentioned conventional methods, when a functional structure is mounted at a plurality of different mounting positions, or when the functional structure is mounted on a different receiving structure, a plurality of functional structures having different structures are combined. They have to be prepared, which increases the production cost of functional structures (functional components) and degrades product competitiveness. Disclosure of the invention

Therefore, an object of the present invention is to provide a functional component of an information processing apparatus that can be attached to a plurality of different attachment positions or receiving-side structures without impairing the function.

According to the present invention, there is provided a functional component of an information processing apparatus, wherein the first attitude and the first attitude A mechanical part having the same shape as the projection in the second posture rotated 9.0 degrees from the posture, and a first fixing unit fixed to the first mounting unit of the information processing device in the first posture. A second fixing portion that is fixed to a second mounting portion different from the first mounting portion of the information processing device in the second posture. Parts are provided.

Since the functional component of the present invention has the above-described features, when the functional component is fixed to a different mounting portion, the functional component is rotated by 90 degrees, and the functional component is rotated. The functional component can be fixed without impairing the function. Preferably, the functional component comprises a heat sink, a heat sink with a fan, a speaker, or the like. According to another aspect of the present invention, there is provided a functional component of the information processing apparatus, wherein the functional component has the same shape in a first posture and a second posture inverted from the first posture. And a plurality of fixing portions provided at unequal positions from the front and back of the functional component. Brief Description of Drawings

FIG. 1 is a perspective view of a heat sink according to a first embodiment of the present invention;

FIG. 2A is a plan view of the heat sink according to the first embodiment;

FIG. 2B is a rear view of the heat sink according to the first embodiment;

Figure 2C is a front view of Figure 2A;

Figure 2D is a right side view of Figure 2A;

FIG. 3A is a perspective view of a substrate on which a semiconductor chip having a first receiving structure is mounted; FIG. 3B is an exploded perspective view showing a state in which a heat sink is fixed to the substrate shown in FIG. 3A;

FIG. 4A is a perspective view of a substrate on which a semiconductor chip having a second receiving structure is mounted; FIG. 4B is an exploded perspective view showing how a heat sink is fixed to the substrate shown in FIG. 4A;

FIG. 5 is a perspective view of a heat sink with a fan according to a second embodiment of the present invention;

FIG. 6A is a plan view of a heat sink with a fan according to the second embodiment;

FIG. 6B is a rear view of the heat sink with terminal according to the second embodiment; Figure 6C is a front view of Figure 6A;

Figure 6D is a right side view of Figure 6A;

7A is a perspective view of a substrate on which a semiconductor chip having a third receiving structure is mounted; FIG. 7B is a front view showing a state in which a heat sink with a fan is mounted on the substrate shown in FIG. 7A;

FIG. 8A is a perspective view of a substrate having a third receiving structure and having a different semiconductor chip mounted thereon; FIG. 8B is a front view showing a state in which a heat sink with a fan is mounted on the substrate shown in FIG. 8A;

9A is a perspective view of a speaker assembly according to a third embodiment of the present invention; FIG. 9B is a perspective view of FIG. 9A as viewed from the left direction;

Figure 9C is a rear perspective view of the speaker assembly;

FIG. 10A is a perspective view of a housing having a fourth receiving structure;

FIG. 10B is a perspective view showing a state where the speaker assembly is mounted on the housing shown in FIG. A;

FIG. 11A is a perspective view of a housing having a fifth receiving structure;

FIG. 11B is a perspective view showing a state where the speaker assembly is mounted on the housing shown in FIG. 11A. BEST MODE FOR CARRYING OUT THE INVENTION

Referring to FIG. 1, a perspective view of a heat sink according to a first embodiment of the present invention is shown. The heat sink 2 is composed of a base 4 and a large number of heat dissipating fins 6 formed integrally. The heat sink 2 is formed of, for example, aluminum or an aluminum alloy. As best shown in FIGS. 2A and 2B, two mounting brackets (fixing brackets) 1 2 each having a mounting hole (fixing hole) 14 are formed from one side of the heat sink 2. Two mounting brackets 12 each having a mounting hole 14 respectively protrude from the side opposite to this side. These mounting brackets 12 constitute a first fixing portion.

On the other hand, from one side orthogonal to these sides, two mounting brackets (fixing brackets) 16 each having a mounting hole (fixing hole) 18 protrude physically. One mounting bracket (fixing bracket) 16 having a mounting hole (fixing hole) 18 protrudes from the side opposite to the side. These three brackets 16 constitute the second fixed part.

The heat dissipating part 8 composed of a large number of heat dissipating fins 6 which is a functional part of the heat sink 2 has a first posture shown in FIG. 2A and a second posture rotated 90 degrees from the first posture. The projections are configured to have the same shape. As shown in FIG. 2B, the bottom surface of the base 4 of the heat sink 2 has one heat receiving surface, and the first posture described above and the second posture rotated 90 degrees from the first posture. The heat receiving surface 10 is formed so that the projections have the same shape.

FIG. 3A shows a substrate 20 having a first receiving structure including four mounting holes (fixing holes) 24 and having a semiconductor chip 22 mounted thereon. In order to fix the heat sink 2 on the substrate 20, four mounting brackets 12 are used as shown in FIG. 3B. That is, the heat sink 2 is fixed on the substrate 20 by screwing a screw (not shown) into the mounting hole 24 through the hole 14 of each mounting bracket 12.

FIG. 4A shows a substrate 20 ′ having a second receiving structure including three mounting holes (fixing holes) 26 and having the semiconductor chip 22 mounted thereon. To fix the heat sink 2 on the substrate 20 ′, as shown in FIG. 4B, the heat sink 2 is rotated 90 degrees right or left from the first position shown in FIG. 3B. Assume the second posture. Then, the heat sink 2 is fixed on the substrate 20 ′ using the three brackets 16. That is, a screw is inserted into the hole 18 of the mounting bracket 16, and the screw is screwed into the mounting hole 26, thereby fixing the heat sink 2 to the substrate 20.

As described above, in the heat sink 2 of the present embodiment, the heat radiating portion 8 and the heat receiving surface 10 which are functional portions are in the first posture and the second posture rotated 90 degrees from the first posture. The projections are configured to have the same shape. On the other hand, the mounting bracket 12 is used when the heat sink 2 is in the first position, and the mounting bracket 16 is used when the heat sink 2 is in the second position. These mounting brackets 12 and 16 are not configured such that their projections have the same shape in the first posture and in the second posture rotated 90 degrees from the first posture.

Thus, when the heat sink 2 is in the first position, the four mounting brackets 1 2 If the heat sink 2 is fixed by using the heat sink and the receiving structure of the mounting part (fixed part) is different, the function is the same by rotating the heat sink 2 90 degrees from the first position. The heat sink 2 can be fixed using the three mounting brackets 16 while keeping it. In this way, it is possible to fix to a plurality of different receiving structures while maintaining the same function, so there is no need to separately design the heat sink to fit each receiving structure, reducing the cost of the heat sink parts be able to.

Referring to FIG. 5, there is shown a perspective view of a heat sink with a fan according to a second embodiment of the present invention. Fig. 6A is a plan view of a heat sink with a fan, Fig. 6B is a rear view, Fig. 6C is a front view of Fig. 6A, and Fig. 6D is a right side view of Fig. 6A.

The heat sink 30 has a fan 32. Reference numeral 34 denotes a heat radiating fin. As shown in FIGS. 6A and 6B, the heat sink 30 has similar heat receiving surfaces 38, 40 on the front and back surfaces. In the heat sink 30 with a fan of the present embodiment, the fans 32, heat receiving surfaces 38, 40 and the heat radiating portion 36, which are functional portions, are viewed from the front side (upper side) and the back side (lower side). In that case, they have the same structure.

On the other hand, the heat sink 30 has four mounting brackets (fixing brackets) 42 each having a mounting hole (fixing hole) 44, and these mounting brackets 42 are viewed from above and below. They are provided at different distances. That is, as shown in FIG. 6C, the mounting bracket 42 is provided at a position where the distance from the upper surface of the heat sink 30 is H1 and the distance from the lower surface is H2. H 1 is, for example, 7 mm, and H 2 is, for example, 4 mm.

Referring to FIG. 7A, a substrate 46 having a third receiving structure including four pins 50 each having a screw hole and having a semiconductor chip 48 mounted thereon is shown. When fixing the heat sink with fan 30 on the board 46, the heat sink 30 is inverted from the state shown in FIG. 6C and the mounting bracket is mounted on the pin 50 as shown in FIG. 7B. By mounting the bracket 42 and screwing the mounting bracket 42 to the pin 50, the heat sink with fan 30 is fixed on the board 46.

FIG. 8A has a third receiving structure similar to the substrate 46 shown in FIG. 7A, and has a different height. 4 shows a substrate 46 ′ on which a semiconductor chip 52 is mounted. To fix the heat sink with fan 30 on this board 46 ', mount the mounting bracket 42 on the pin 50 as shown in Fig. 6C and connect the mounting bracket 42 to the pin 5 Screw it to 0. As a result, as shown in FIG.

It is fixed to the substrate 4 6 ′ while floating at a certain height from 6 ′. Therefore, interference between the tall semiconductor chip 52 and the heat sink with fan 30 is prevented.

The heat sink 30 with a fan of the present embodiment has functional parts of the same shape on the upper and lower surfaces, and the distance from the upper and lower surfaces of the mounting bracket is different. Therefore, even when the heat sink 30 is mounted on the same receiving structure, By swapping the upper and lower surfaces, it is possible to provide different heat receiving surface heights.

Referring to FIG. 9A, a perspective view of a speed force assembly 56 according to a third embodiment of the present invention is shown. FIG. 9B is a perspective view when FIG. 9A is viewed obliquely from the rear left, and FIG. 9C is a perspective view when viewed from the back. The speed assembly 56 is constructed by supporting a speaker 58 on a frame 60. The frame 60 has a pair of opposing mounting brackets (fixing brackets) 62 each having a mounting hole (fixing hole) 64, and these mounting brackets are opposed to each other in a direction orthogonal to 62. It has a pair of mounting brackets (fixing brackets) 66 having mounting holes (fixing holes) 68.

FIG. 10A shows a housing 70 having a fourth receiving structure including a pair of holding plates 72 and 74 and a pin 76. To fix the speaker assembly 56 to this housing 70, insert a pin into the mounting hole 6 4 of the mounting bracket 62 as shown in FIG. 9B.

7 Insert the speaker assembly 5 6 as shown in Fig. 10B, and fix the speaker assembly 56 to the housing 7 so that both ends of the speaker assembly 56 are held down by the plates 72, 74. .

FIG. 11A shows a housing 80 having a fifth receiving structure including high holding plates 82, 84 and pins 86. To fix the speaker assembly 56 to the housing 80, the speaker assembly 56 in the state shown in FIG. 9A is rotated 90 degrees counterclockwise. Then, as shown in Figure 11B, attach the mounting bracket 66 Insert the pin 86 into the hole 68, and fix the speaker assembly 56 to the housing 80 so as to hold both ends of the speaker assembly 56 with the plates 82, 84. In this embodiment, the structure on the receiving side to which the speaker assembly 56 is attached is different. However, since the speaker assembly is provided with two different types of attachment structures in advance, the same speaker assembly structure is used for both. Can be assembled to the housing. Industrial applicability

According to the present invention, the functional component has the same shape in the first posture and the second posture rotated by 90 degrees from the first posture, and the functional component has the same shape. (1) Since it has a fixed part and a second fixed part used in the second posture, the same functional part can be mounted on a plurality of different mounting positions or on different receiving structures without impairing its function. Can be attached. As a result, parts can be shared and the number of parts can be reduced, and the product competitiveness of the information processing device can be enhanced by reducing the manufacturing cost.

Claims

The scope of the claims

1. A functional part of an information processing device,

A first posture and a functional part whose projections are the same in the second posture rotated 90 degrees from the first posture;

A first fixing unit fixed to the first mounting unit of the information processing device in the first posture;

A second fixing portion fixed to a second mounting portion different from the first mounting portion of the information processing device in the second posture;

A functional component of an information processing apparatus, comprising:

2. The functional component is composed of a heat sink,

The information processing device according to claim 1, wherein the first fixing portion has a plurality of first fixing holes, and the second fixing portion has a plurality of second fixing holes different from the first fixing holes. Functional parts of the device.

3. The functional component is composed of speed,

4. The information processing apparatus according to claim 1, wherein the first fixed unit is fixed to a first information processing device, and the second fixed unit is fixed to a second information processing device different from the first information processing device. Functional parts of the device.

5. A functional part of an information processing device,

A first posture and a functional portion having the same shape in the second posture, which is the reverse of the first posture,

And a plurality of fixing portions provided at different positions from the front and back of the functional component.

6. The functional component of the information processing device according to claim 4, wherein the functional component is configured by a heat sink having heat receiving surfaces on the front and back, and each of the fixing units is configured by a bracket having a fixing hole.

6. The functional component of an information processing device according to claim 5, wherein the plurality of fixing portions are mounted on different information processing devices with the front and back reversed.