TW200502735A - Functional part for information processing apparatus - Google Patents

Functional part for information processing apparatus

Info

Publication number
TW200502735A
TW200502735A TW092119311A TW92119311A TW200502735A TW 200502735 A TW200502735 A TW 200502735A TW 092119311 A TW092119311 A TW 092119311A TW 92119311 A TW92119311 A TW 92119311A TW 200502735 A TW200502735 A TW 200502735A
Authority
TW
Taiwan
Prior art keywords
functional part
processing apparatus
information processing
posture
functional
Prior art date
Application number
TW092119311A
Other languages
Chinese (zh)
Other versions
TWI223739B (en
Inventor
Kaito Tanaka
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of TWI223739B publication Critical patent/TWI223739B/en
Publication of TW200502735A publication Critical patent/TW200502735A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A functional part for an information processing apparatus having a functional portion with same projection at a first posture and a second posture which is rotated 90 degrees from the first posture. The functional part further has a first fixing portion to be fixed to a first mounting portion of the information processing apparatus when the functional part is the first posture and a second fixing portion to be fixed to second mounting portion of the information processing apparatus when the functional part is the second posture.
TW092119311A 2003-07-15 2003-07-15 Functional part for information processing apparatus TWI223739B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/008986 WO2005006434A1 (en) 2003-07-15 2003-07-15 Information processing device functional part

Publications (2)

Publication Number Publication Date
TWI223739B TWI223739B (en) 2004-11-11
TW200502735A true TW200502735A (en) 2005-01-16

Family

ID=34044631

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092119311A TWI223739B (en) 2003-07-15 2003-07-15 Functional part for information processing apparatus

Country Status (2)

Country Link
TW (1) TWI223739B (en)
WO (1) WO2005006434A1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09213848A (en) * 1996-02-02 1997-08-15 Sony Corp Heat sink of electronic component
JP2000183251A (en) * 1998-12-16 2000-06-30 Keihin Corp Heat-radiation structure
JP2000306646A (en) * 1999-04-22 2000-11-02 Tyco Electronics Amp Kk Ic socket assembly

Also Published As

Publication number Publication date
TWI223739B (en) 2004-11-11
WO2005006434A1 (en) 2005-01-20

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