1300688 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種固定裝置，尤指一種可用於固定散熱模 組之固定裝置。 …、 【先前技術】 電腦及祠服器中’中央處理器（Central Processing Unit， 縮寫為CPU)之散熱一直係整個電腦及伺服器系統散熱之關 鍵，如第一及第二圖所示，當前一般做法為，在中央處理器 60上方固設一包括一散熱器62之散熱模組64，使該散熱器 62與該中央處理器緊密接觸以達到為該中央處理器⑻散 熱之目的，為隔絕空氣及增強散熱效果，於該散熱器62與該 處理$ 6。之接觸面之間塗佈—層具有良好導熱性能之散 ^ 66。而在代工企業中，某些電腦及飼服器在發貨給品牌 廠商客戶時，並不包括該中央處理器60，該中奂虛理哭m 士1300688 IX. Description of the Invention: [Technical Field] The present invention relates to a fixing device, and more particularly to a fixing device which can be used for fixing a heat dissipation module. ..., [Prior Art] The heat dissipation of the Central Processing Unit (CPU) in computers and servers has been the key to the heat dissipation of the entire computer and server system, as shown in the first and second figures. Generally, a heat dissipation module 64 including a heat sink 62 is fixed on the central processing unit 60, so that the heat sink 62 is in close contact with the central processing unit to achieve heat dissipation for the central processing unit (8). The air and enhanced heat dissipation effect on the heat sink 62 are treated with $6. The coating layer between the contact faces has a good thermal conductivity of 66. In the foundry enterprises, some computers and feeding machines do not include the central processing unit 60 when they are shipped to the brand manufacturer's customers.
有必要對習知之散熱模組 固定裝置進行改良，以 消除上述缺失。 【發明内容】It is necessary to modify the conventional thermal module fixture to eliminate the above deficiency. [Summary of the Invention]
種可架高散熱模組之散熱模 1300688 而 一種散熱模組固定裝置，可裝設於一電路板以架高 組，該電路板一側面固設一可插設電腦晶片之插座，該^槿 組固疋裝置包括環繞該插座而設之複數凸柱、複數固定於該等 凸，^支撐件及一固設於該散熱模組底部之支撐架，該支撐架 裝設複數連接件，透過該支撐架之連接件連接於該等 ^ 固定該散熱模組。 τ —與習知技術相比較，該散熱模組固定裝置透過該等支撐件 固定於對應凸柱及固設於該散熱模組底部之支撐架之連^件 連接於對應之支撐件以固定該散熱模組，使該散熱模組與該電 路板之插座相隔一定距離，互不影響，寸為企業節省獨 及運輸該散熱模組之成本。 & 【實施方式】 請參閱第三及第四圖，本發明散熱模組固定裝置裝設於一 電路板10上以架高一散熱模組30。該電路板1〇正面固設一 可插設電腦晶# (如CPU晶>})之插座12，該電路板1〇於 該^座12之周邊開設複數通孔13，該散熱模組3〇包括一散 熱器32、、一固定於該散熱器32 一侧之散熱風扇弘及一用於 連通外界為該散熱風扇34提供冷空氣之風罩36,該散熱器32 之底部設一凸部35及兩分別位於該凸部35兩侧之固定部37, 該凸^ 35上塗佈有散熱膏46 (如第七圖所示），並於該凸部 35上蓋5又一可遮撞散熱貧46之保護罩48，該兩固定部37均 開設複數螺孔49。 “該散熱模組固定裝置之較佳實施方式包括一可固定於該 電路板10背面之背板14、複數支撐件5〇及一可與該等支撐 件50連接之支撐架33。該背板14於四角處對應該電路板 1通孔13分別凸設複數具有内螺紋之凸柱16，該等凸柱16 罪近根部處分別凹設一固定槽18。請一併參考第五圖，每一 支撐件50包括一法蘭部52、凸設於該法蘭部52下侧之具有 外螺紋且可螺固於該背板14之凸柱16内螺紋之一鎖固部54 1300688 及凸設於該法蘭部52上 包括兩可分別固設== 之套接部56。該支樓 件38 ’每—固定件％包括之兩固定部37之固定 向同一側斜向外延=及自$體部39兩端 熱器32之固定部37之_ 亥t體部39對應 二：腳40上裝設_可鎖固於對=固疋孔41’每_ ^方式中該等連接件係彈簣之連接件，在本實 應彈簧預緊螺絲42之正下方=一固定腳40於對 之套接部56之令空立柱44。 成一可套設對應支撐件50 請同時參閱第三至第七圖， 6自該電路板1G之背面穿上^m：i4之凸柱 ，面，用橡谬套柱(圖未示以於2電路 上。在每一凸fel6 將該背板14 ©定於該電路板1〇 穿過該兩固丄之牛50 ;用螺絲(圖未示） 32之兩固定部37之分別將它們螺鎖於該散熱器 熱器义之賴定3 _賴定件於該散 套設對應之支撐:ί 定腳4〇下方之立柱44 夕、土益μ仵5〇該荨立柱44之下部抵擋於對應支撐件 之這時，即可螺鎖該兩固定件38之固定腳40 緊螺絲42 ’使該等彈簧預緊螺絲42分別螺鎖於辦 件5〇之套接部56，這樣，該散熱模組30底部之散二 T f之保護罩48與該電路板1〇之插座12相隔-定距離f ，該保遵^ 48與該插座12發生干涉，進而破壞該保護罩 8内之散熱貧46及損壞該插座12，即可以將該散埶模έ且3〇 支=該電路板1G上與該電路板1G -秘修客 當客戶收到貨物時，將該兩固定件38之彈簧預緊螺絲42 自對應之支撐件50螺鬆，將該散熱模組30卸下。卸掉該背板 1300688The heat dissipation module 1300688 can be mounted on a heat dissipation module, and the heat dissipation module fixing device can be installed on a circuit board to form a height group, and a socket for inserting a computer chip is fixed on one side of the circuit board. The assembly device includes a plurality of protrusions disposed around the socket, a plurality of protrusions fixed to the protrusions, a support member, and a support frame fixed to the bottom of the heat dissipation module, the support frame is provided with a plurality of connecting members, The connecting member of the support frame is connected to the fixing unit to fix the heat dissipation module. τ - compared with the conventional technology, the heat dissipating module fixing device is fixed to the corresponding protruding post and the supporting member fixed to the bottom of the heat dissipating module through the supporting members, and is connected to the corresponding supporting member to fix the The heat dissipation module allows the heat dissipation module to be separated from the socket of the circuit board by a certain distance without affecting each other, and the cost of the heat dissipation module is saved for the enterprise. <Embodiment> Referring to the third and fourth figures, the heat dissipation module fixing device of the present invention is mounted on a circuit board 10 to raise the heat dissipation module 30. A socket 12 for inserting a computer crystal # (such as a CPU crystal) is disposed on the front side of the circuit board 1 . The circuit board 1 defines a plurality of through holes 13 around the periphery of the base 12, and the heat dissipation module 3 The heat sink 32 includes a heat sink 32, a heat dissipating fan fixed to one side of the heat sink 32, and a windshield 36 for connecting the outside to provide cold air to the heat dissipating fan 34. The bottom of the heat sink 32 is provided with a convex portion. 35 and two fixing portions 37 respectively located on opposite sides of the convex portion 35, the convex surface 35 is coated with a thermal grease 46 (as shown in the seventh figure), and the cover 5 on the convex portion 35 is further shielded from heat dissipation. The protective cover 48 of the poor 46 has a plurality of screw holes 49. The preferred embodiment of the heat dissipation module fixing device includes a back plate 14 fixed to the back of the circuit board 10, a plurality of support members 5, and a support frame 33 connectable to the support members 50. The back plate 14 at the four corners corresponding to the through hole 13 of the circuit board 1 respectively protruded with a plurality of internal threaded studs 16, the studs 16 are respectively recessed at the root of a fixed groove 18. Please refer to the fifth figure, each A support member 50 includes a flange portion 52, and a locking portion 54 1300688 and a protruding portion of the internal thread of the boss 16 which is externally threaded and screwed to the back plate 14 The sleeve portion 52 includes two sleeve portions 56 which can be respectively fixed with ==. The fixing member 38' each of the fixing members includes two fixing portions 37 which are fixed obliquely to the same side = and from The body portion 39 has a fixed portion 37 of the heat exchanger 32 at both ends. The hait body portion 39 corresponds to two: the foot 40 is mounted on the foot _ lockable in the pair = the fixed hole 41'. The connecting piece of the cymbal is directly below the compliant spring pre-tightening screw 42 = a fixed leg 40 is disposed on the erecting portion 56 of the ferrule 44. The corresponding supporting member 50 can be sleeved Please also refer to the third to seventh figures, 6 from the back of the circuit board 1G put on the ^m:i4 column, face, with rubber sleeves (not shown for the 2 circuit. In each convex fel6 The back plate 14 is disposed on the circuit board 1 through the two solid cows 50; the two fixing portions 37 of the screws (not shown) 32 are respectively screwed to the heat sink Lai Ding 3 _ Lai Ding set in the corresponding support of the loose sleeve: ί fixed foot 4 below the column 44 夕, 益益 μ仵5 〇 the lower part of the 荨 column 44 to resist the corresponding support member, then snail The fixing legs 40 of the two fixing members 38 are tightened by the screws 42', so that the spring pre-tightening screws 42 are screwed to the sockets 56 of the handles 5, so that the bottom of the heat dissipation module 30 is scattered. The protective cover 48 is spaced apart from the socket 12 of the circuit board 1 by a distance f, and the protection device 48 interferes with the socket 12, thereby destroying the heat dissipation 46 in the protective cover 8 and damaging the socket 12, that is, The diverging module and 3 = = the circuit board 1G and the circuit board 1G - the clerk when the customer receives the goods, the spring pre-tightening screws 42 of the two fixing members 38 are self-corresponding Unscrewing strut member 50, the heat dissipation module 30 removed. Remove the back plate 1300688
Μ之凸柱16之支撐件50，並於該電路板10之插座12上插 上電腦晶片，卸下該散熱器32底部之保護罩48，將裝設有^ 定件38之散熱模組30置於該電腦晶片上，使該兩固 1定Χ 之固定腳40下方之立柱44套設對應之凸柱16，並使該 定件38之彈簧預緊螺絲42分別螺固於對應凸柱 攸而再次將該散熱模組3〇組裝於該電路板1〇，這 f 32底部之散熱膏46與電腦晶片緊密接觸，可達到良 熱效果，滿足客戶對產品品質之要求。 政 _。糊要件，纽法提出專利申 明淮以上所述者僅為本發明之較佳實施方式，舉 ，之人士，在爰依本發明精神所作之 ，匕 應涵盍於以下之申請專利範圍内。 飞I匕白 【圖式簡單說明】 第一圖係習知電腦散熱模組與裝有中 —之立體組裝圖。、褒有中央處理益之電路板 ，二圖係第一圖中之II-II剖面圖。 第三圖係本發明散熱模組固定裴置之 熱模組之立體分解圖。 仏只鈿方式與散 f 三圖之散熱模組之另—立體圖。 圖係仏《之讀件之賴放大圖。 第/、圖係本發明散熱模組固定梦 熱模組之立體組裝圖。裝置之較佳實施方式與散 第七圖係第四圖中之W剖面圖。 【主要元件符號說明】 〔習知〕 中央處理器 風罩 插座 60 64 68 散熱器 散熱膏 62 66 8 1300688 〔本創作〕 電路板 通孔 - 凸柱 . 散熱模組 支撐架 凸部 固定部 本體部 • 固定孔 立柱 •保護蓋 ‘ 支撐件 鎖固部 插座 12 背板 14 固定槽 18 散熱器 32 散熱風扇 34 風罩 36 固定件 38 固定腳_ 40 彈簧預緊螺絲42 散熱膏 46 螺孔 49 法蘭部 52 套接部 56 9The support member 50 of the protruding post 16 is inserted into the socket 12 of the circuit board 10, and the protective cover 48 at the bottom of the heat sink 32 is removed, and the heat dissipation module 30 of the fixing member 38 is mounted. And being placed on the computer chip, so that the column 44 below the fixing leg 40 of the two solids 1 is sleeved with the corresponding protrusion 16 and the spring pre-tightening screws 42 of the fixing member 38 are respectively screwed to the corresponding protrusions 攸Once again, the heat dissipation module 3 is assembled on the circuit board 1 , and the heat dissipation paste 46 at the bottom of the f 32 is in close contact with the computer chip, which can achieve a good heat effect and meet the requirements of the customer for product quality. Politics _. The above is only the preferred embodiment of the present invention, and the person who has made it in accordance with the spirit of the present invention should be included in the following patent application. Flying I 匕 白 [Simple description of the diagram] The first picture is a three-dimensional assembly diagram of a conventional computer cooling module and a medium-sized one. There is a circuit board for central processing, and the second picture is a sectional view of II-II in the first figure. The third figure is an exploded perspective view of the thermal module of the heat dissipating module fixing device of the present invention.仏 钿 钿 与 另 另 另 另 三 三 三 三 三 三 三 三 另 另 另The figure is a magnified view of the readings. The figure / is a three-dimensional assembly diagram of the thermal module of the present invention. A preferred embodiment of the apparatus and a cross-sectional view of the fourth figure in the fourth diagram. [Main component symbol description] [Authentic] Central processor hood socket 60 64 68 Radiator thermal grease 62 66 8 1300688 [This creation] Circuit board through hole - stud. Thermal module support frame convex part fixing part body part • Fixed hole column • Protective cover 'Support member lock socket 12 Back plate 14 Fixing groove 18 Heat sink 32 Cooling fan 34 Windshield 36 Fixing piece 38 Fixing foot _ 40 Spring pre-tightening screw 42 Thermal grease 46 Screw hole 49 Flange Portion 52 Socket 56 9