TWM541698U - Fixing rack for heat sink - Google Patents

Description

Radiator holder

This creation is about a support frame, especially a support frame for a heat sink for electronic components.

Since the electronic components on the motherboard of the computer system generate high temperatures under working conditions, especially the central processing unit (CPU) that performs faster and faster. In order to maintain a normal and stable operation of the computer system, it is usually necessary to add a heat sink to these electronic components to dissipate heat from the electronic components that generate high temperatures, thereby maintaining the system at a normal operating temperature.

Furthermore, most of the heat sinks installed on electronic components today require a mounting bracket to be used to bond the heat sink to the motherboard. However, due to the different appearance of electronic components of various models, in general, most of the general manufacturers require a variety of externally sized holders to provide different electronic components for combination. For this reason, the process of design development or inventory management of the product imposes an additional burden, so it does not meet the cost and economic benefits.

In view of this, the creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art, and has devoted himself to the application of the theory, that is, the goal of the creator's improvement.

One of the aims of the present invention is to provide a heat sink fixing frame for providing heat dissipation in combination with circuit boards of different specifications to increase the convenience of use.

In order to achieve the above object, the present invention is a heat sink fixing frame for dissipating heat from an electronic component in combination with a heat sink. The fixing frame comprises a plurality of plates, at least one foldable piece and a plurality of joints. The plurality of plates are surrounded by a hollowed out area, and the hollowed out area comprises a main receiving space and at least one preliminary receiving space on a side of the main receiving space; at least one foldable piece is detachably connected to one of the plates and located at least one In the preparation space, a plurality of joints are disposed on the plates, and the fixtures are coupled to the heat sink through the joints.

Compared with the prior art, the hollowed-out area of the heat sink of the present invention includes a main accommodating space and a side of the main accommodating space; and the detachable piece is detachably connected (connected by a connecting rib) The plate attached to the fixing frame is located in the preliminary accommodating space; accordingly, when the length of the circuit board does not exceed the main accommodating space, no external force is applied to the detachable piece, and the detachable piece remains in the preliminary accommodating position. In the space, the supporting force is provided to the circuit board; on the other hand, the foldable piece 20 can break the connecting rib through a suitable external force, so that the foldable piece can be detached and the preliminary accommodating space is exposed, and accordingly, the fixing frame It can be combined with a board of another size to achieve the purpose of dissipating heat of different sizes of boards, increasing the convenience and practicality of the creation.

The detailed description and technical content of the present invention are described below with reference to the drawings, but the drawings are only for reference and explanation, and are not intended to limit the creation.

Please refer to FIG. 1 , which is a schematic view of the three-dimensional combination of the heat sink and the fixing frame of the present invention. The present invention is a heat sink fixing frame 1 for combining a heat sink 2. The heat sink 2 is attached to a heat generating component through the fixing frame 1 to further dissipate heat from the heat generating component. The structure of the holder 1 will be described in more detail later.

Please refer to FIG. 2 at the same time, which is a schematic view of the three-dimensional appearance of the fixed frame of the present invention. The holder 1 of the present invention comprises a plurality of sheets 10, at least one foldable sheet 20 and a plurality of joints 30. Preferably, the sheets 10, the at least one foldable sheet 20 and the joints 30 are integrally formed. That is, the material of the fixing frame 1 can be made of high temperature resistant plastic, and can be made by processing such as injection molding. In addition, the material of the fixing frame 1 may be made of metal, and may be formed by a processing method such as press molding.

As shown in the figure, in the embodiment, the plurality of panels 10 are surrounded by a hollow area 100, and the hollow area 100 includes a main accommodating space 101 and at least one preliminary accommodating space on the side of the main accommodating space 101. 102. Moreover, the at least one foldable sheet 20 is detachably connected to one of the sheets 10 and located in the at least one preliminary accommodating space 102. In more detail, the peripheral edge of the foldable sheet 20 has a plurality of connecting ribs 21, and a gap is left between the connecting ribs 21 and the sheet 10, that is, the foldable sheet 20 is transmitted through the connecting ribs 21. The sheet 10 is attached. Further, when a suitable external force acts on the foldable sheet 20, the connecting ribs 21 can be broken to detach the foldable sheet 20 from the sheet 10.

In an embodiment of the present invention, the foldable sheet 20 is flush with a surface 11 of the sheet 10 that is joined to the surface of the heat sink 2 that is joined; in addition, the foldable sheet 20 is away from One side of the heat sink 2 has a hook 22.

Furthermore, the plurality of joints 30 are disposed on the plates 10; further, the fixtures 1 are coupled to the heat sink 2 through the joints 30. In the embodiment, the joints 30 include a plurality of pairs of elastic clasps 31 and a plurality of hooks 32. Preferably, the elastic clasps 31 and the hooks 32 are adjacent to the corner ends of the main accommodating space 101; specifically, the elastic clasps 31 and the hooks 32 are respectively disposed diagonally Accordingly, the elastic clasps 31 and the hooks 32 are coupled to the heat sink 2 in a symmetrical manner to provide a stable bonding effect. Please refer to FIG. 3 and FIG. 4 again, which are respectively a schematic diagram of the combination of the heat sink and the circuit board combined with the fixing frame of the present invention and a schematic view of the combined appearance. In this embodiment, the electronic components (heating components) are disposed on a circuit board 3; in addition, the plurality of first supporting hooks 12 of the mounting plate 1 have a plurality of first supporting hooks 12 on the side of the electronic component. The circuit board 3 is disposed in the main accommodating space 101 and is positioned on the first support hooks 12. In addition, a plurality of second support hooks 13 are also disposed around the preliminary accommodation space 102.

Preferably, the second supporting hooks 13 are disposed on opposite sides of the preliminary receiving space 102, and an abutting block 14 extends between the bottoms of the opposite second supporting hooks 13. In addition, the abutting block 14 and the hollowed-out area 100 formed by the plates 10 together form an accommodating space for inserting and positioning the circuit board 3.

Specifically, the main accommodating space 101 is used to provide a circuit board 3. When the length of the circuit board 3 does not exceed the main accommodating space 101, no external force is applied to the foldable sheet 20. That is, the connecting ribs 21 of the foldable sheet 20 are not broken by an external force, so that the foldable sheet 20 is maintained in the preliminary accommodating space 102 without being detached. Accordingly, the foldable sheet 20 is still attached to the sheet 10, and the hook 22 of the foldable sheet 20 is pressed against one side of the circuit board 3. In addition, the first support hooks 12 are also buckled on the periphery of the circuit board 3,

Please refer to FIG. 5 to FIG. 7 respectively, which are schematic diagrams of the three-dimensional appearance of the foldable piece of the fixed frame of the present invention, the three-dimensional joint diagram of the heat sink and the circuit board, and the three-dimensional appearance of the combined. The holder 1 of the present invention is applied to the foldable sheet 20 by a suitable external force to break the connecting ribs 21 and detach the foldable sheet 20 from the sheet 10. As shown in FIG. 5, the detachable piece 20 is exposed to the external force to expose the preliminary accommodating space 102, and the preliminary accommodating space 102 communicates with the main accommodating space 101. A board that can be combined with another size.

Referring to Fig. 6, in the present embodiment, electronic components are disposed on a circuit board 3'. Further, the above-described fixing frame 1 is coupled to the heat sink 2 by a plurality of them. Accordingly, the heat sink 2 is disposed through the holder 1 to attach the electronic component (heat generating component). It should be noted that the circuit board 3' is placed on the abutting block 14 when it is inserted into the preliminary accommodating space 102.

Referring to FIG. 7, it can be seen that the length of the circuit board 3' exceeds the main accommodating space 101. Therefore, a main portion of the circuit board 3' is disposed in the main accommodating space 101, and the circuit board is A portion of 3' is projected and positioned in the preliminary accommodation space 102. In addition, the circuit board 3' is supported and positioned by the first support hook 12 and the second support hook 13 of the holder 1. Thereby, the heat sink 2 can dissipate heat from the circuit board 3'. Preferably, the periphery of the circuit board 3' is opposite to the second support hooks 13 and has a plurality of bumps 4'. The second support hooks 13 are respectively latched on the bumps 4'. .

It should be noted that, in this embodiment, the width of the preliminary accommodating space 102 is smaller than the width of the main accommodating space 101, but the actual implementation is not limited thereto.

It should be noted that in the present embodiment, the hollow area 100 of the fixing frame 1 only includes one preliminary accommodating space 102. In actual implementation, the fixing frame 1 can be disposed on different sides of the main accommodating space 101. The accommodating accommodating space 102 is connected to the main accommodating space 101 after the detachable piece 20 is detached from the main accommodating space 102, so that it can be determined whether to be detached according to actual use conditions, so as to be combined with various specifications. Circuit board.

Please refer to FIG. 8 and FIG. 9 , which are schematic diagrams of a three-dimensional appearance of another embodiment of the fixing frame of the present invention and a three-dimensional appearance of the heat sink. This embodiment is substantially the same as the previous embodiment, and the fixing frame 1a includes a plurality of plates 10a, at least one foldable piece 20a, and a plurality of joint portions 30a. The hollow sheets 100a include a main receiving space 101a and at least one preliminary receiving space 102a. Moreover, the at least one foldable sheet 20a is detachably connected to one of the sheets 10a and located in the at least one preliminary accommodation space 102a. The fixing frame 1a is used to couple a heat sink 2, and the heat sink 2 is attached to a circuit board 3a through the fixing frame 1a.

The difference between the present embodiment and the previous embodiment is that the width of the preliminary accommodating space 102a is equal to the width of the main accommodating space 101a, that is, the width of the at least one foldable sheet 20a is The widths of the main accommodation spaces 101a are substantially equal.

Please refer to FIG. 10 and FIG. 11 , which are schematic diagrams of the three-dimensional appearance of the foldable piece of the other embodiment of the present invention, and the three-dimensional appearance of the heat sink and the circuit board. Similarly, the fixing frame 1a can disengage the foldable sheet 20a from the sheet 10a by a suitable external force. As shown in FIG. 10, the foldable piece 20a is exposed to an external force to expose the preliminary accommodating space 102a, and the preliminary accommodating space 102a communicates with the main accommodating space 101. Accordingly, the fixed frame 1a A board that can be combined with another size.

Referring to FIG. 11, the holder 1a is coupled to the heat sink 2 through the plurality of joint portions 30a. Further, the heat sink 2 is placed through the holder 1a to attach an electronic component (heat generating component). As shown, the length of the other circuit board 3a' exceeds the main accommodating space 101a, wherein a main portion of the circuit board 3a' is disposed in the main accommodating space 101a, and further, a part of the circuit board 3a' Positioned in the preliminary accommodation space 102a. Thereby, the heat sink 2 can dissipate heat from the circuit board 3a'.

The above descriptions are only preferred embodiments of the present invention, and are not intended to be used in the scope of the patents, and other equivalent changes in the patent spirit of the present invention are all within the scope of the patent.

1, 1a‧‧‧ fixed frame

2‧‧‧heatsink

3, 3', 3a, 3a'‧‧‧ boards

4’‧‧‧Bumps

10, 10a‧‧‧ plates

100, 100a‧‧‧ hollow area

101, 101a‧‧‧ main space

102, 102a‧‧‧ Prepared space

11‧‧‧ surface

12‧‧‧First support hook

13‧‧‧Second support card

14‧‧‧Abutment block

20, 20a‧‧‧Foldable

201‧‧‧ surface

21‧‧‧ Connecting ribs

22‧‧‧check

30, 30a‧‧ ‧ Joint Department

31‧‧‧Flexible clasps

32‧‧‧ card hook

FIG. 1 is a schematic view showing the three-dimensional combination of the heat sink and the fixing frame of the present invention.

FIG. 2 is a schematic perspective view of the fixing frame of the present invention.

FIG. 3 is a schematic view showing the combination of the heat sink and the circuit board combined with the fixing frame of the present invention.

FIG. 4 is a schematic perspective view showing the combination of the heat sink and the circuit board combined with the fixing frame of the present invention.

Fig. 5 is a perspective view showing the three-dimensional appearance of the foldable piece of the holder of the present invention after being detached.

FIG. 6 is a perspective view showing the three-dimensional combination of the foldable piece of the fixing frame of the present invention and the heat sink and the circuit board.

FIG. 7 is a perspective view showing the three-dimensional appearance of the foldable piece of the fixed frame of the present invention after being combined with the heat sink and the circuit board.

FIG. 8 is a perspective view showing another embodiment of the fixing frame of the present invention.

FIG. 9 is a schematic perspective view showing another embodiment of the fixing frame of the present invention combined with a heat sink.

FIG. 10 is a perspective view showing the three-dimensional appearance of the foldable piece of another embodiment of the present invention.

FIG. 11 is a perspective view showing the three-dimensional appearance of the foldable piece of another embodiment of the present invention after being detached from the heat sink and the circuit board.

1‧‧‧ fixed frame

10‧‧‧ plates

100‧‧‧ hollow area

101‧‧‧Main space

102‧‧‧Prepared space

12‧‧‧Support card hook

13‧‧‧Second support card

14‧‧‧Abutment block

20‧‧‧Foldable

21‧‧‧ Connecting ribs

22‧‧‧check

30‧‧‧Combination Department

31‧‧‧Flexible clasps

32‧‧‧ card hook

Claims (11)

A heat sink fixing frame for dissipating heat from an electronic component on a circuit board in combination with a heat sink, the fixing frame comprising: a plurality of plates enclosing a hollow area, the hollow area comprising a main receiving space and At least one preliminary accommodating space on one side of the main accommodating space; at least one foldable piece detachably connecting one of the plates and located in the at least one preliminary accommodating space; and a plurality of joints disposed at the On the plates, the holder is coupled to the heat sink through the joints. The mounting bracket of the heat sink of claim 1, wherein the peripheral edge of the foldable sheet has a plurality of connecting ribs, and a gap is left between the connecting ribs and the sheet. A holder for a heat sink according to claim 1, wherein the foldable sheet is flush with a surface of the sheet to which the surface of the heat sink is attached. The holder of the heat sink of claim 3, wherein the foldable piece has a hook on a side away from the combined heat sink. The mounting bracket of the heat sink of claim 1, wherein the plurality of pairs of elastic buckles and the plurality of hooks are adjacent to the corner ends of the main accommodating space. The mounting bracket of the heat sink of claim 5, wherein the elastic clasps and the hook hooks are respectively disposed diagonally. The mounting bracket of the heat sink of claim 1, wherein the plurality of first supporting hooks are disposed on the first supporting hooks. The mounting bracket of the heat sink of claim 7, wherein the plurality of second supporting hooks are disposed around the preliminary accommodating space, and the peripheral edge of the circuit board is extended corresponding to the second supporting hooks. The bumps, the second support hooks are respectively clamped on the bumps. The fixing bracket of the heat sink of claim 8, wherein the second supporting hooks are disposed on opposite sides of the preliminary receiving space, and the bottoms of the opposite second supporting hooks are extended between The abutting block is disposed on the abutting block when the circuit board is inserted into the preliminary accommodating space. The fixing frame of the heat sink according to claim 1, wherein the width of the preliminary accommodating space is smaller than the width of the main accommodating space. The fixing frame of the heat sink according to claim 1, wherein the width of the preliminary accommodating space is equal to the width of the main accommodating space.