TWI534597B - Server - Google Patents

Description

server

The present invention relates to a server, and more particularly to a server that is coupled to a heat dissipation substrate by a rigid link to reinforce the circuit board.

In general, in order to prevent the printed circuit board assembly (PCBA) from being bent due to falling or being shaken during transportation, an iron back plate is usually provided on the circuit board to strengthen the circuit. The strength of the board to prevent the board from bending when it is dropped or shaken.

Please refer to the first figure. The first figure shows a schematic view of a prior art circuit board module with an iron backplane. As shown, a circuit board module PA100 having an iron backplane includes a circuit board PA1 and an iron backplane PA2. The iron back plate PA2 is an iron frame piece having a hollow through slot, and the iron back plate PA2 is locked on the circuit board PA1 by using four screws PA200. In fact, the iron back plate PA2 is more likely to be a heat dissipation substrate (not shown) that is locked on the other surface of the circuit board PA1, so that the circuit board PA1 is fixed between the iron back plate PA2 and the heat dissipation substrate.

As described above, the iron backplane PA2 is fixed on the circuit board PA1, which can be used to support the circuit board PA1 to prevent the circuit board PA1 from falling or being subjected to Bending occurs during impact; however, since the surface of the circuit board PA1 is used to route the circuit and the electronic components are disposed, the iron back plate PA2 must be attached to the circuit board PA1 to effectively increase the strength of the circuit board PA1. However, it also sacrifices the layout area of many boards PA1. Further, when the electronic components on the circuit board PA1 are disposed too much, the iron back plate PA2 cannot be provided to reinforce the strength of the circuit board PA1.

In view of the prior art, when the user uses the arrangement of the iron back plate to reinforce the strength of the circuit board, the electronic component layout of the circuit board is limited because the iron back plate occupies too much area of the circuit board. In addition, when there is not enough space on the board, the iron backplane cannot be set.

Accordingly, it is a primary object of the present invention to provide a server whereby the strength of the board can be effectively reinforced without occupying an excessive area of the board.

In view of the above, the present invention provides a server for solving the problems of the prior art, and includes a circuit board, a heat dissipation substrate, and a rigid link. The circuit board has a stress concentration region and a stress dispersion region located on the periphery of the stress concentration region. The heat dissipation substrate is coupled to the circuit board. The rigid link is coupled to the heat dissipation substrate and fixed to both sides of the circuit board. Therefore, since the servo is fixed on both sides of the circuit board by using the rigid link, when the circuit board is impacted, the rigid link can support the circuit board without bending deformation, and the rigid link is connected to The heat-dissipating substrate is such that the rigid connecting rod can be supported by the heat-dissipating substrate and is not easily bent, and the impact force can be dispersed on the heat-dissipating substrate.

An auxiliary technical means derived from the above-mentioned technical means is that the rigid link has a rigid link body connected to the heat dissipation substrate. Preferably, the rigid link system is soldered to the heat dissipation substrate. The rigid link has two end fixing portions, and the two end fixing portions are disposed at both ends of the rigid link body, and are respectively fixed to the stress dispersion region. In addition, the two end fixing portions further have a screw hole for fixing the two end fixing portions to both sides of the circuit board. Wherein, the fixing of the heat-dissipating substrate and the rigid connecting rod body by welding can make the rigid connecting rod and the heat-dissipating substrate more stable, and the setting of the screw hole enables the rigid connecting rod to be effectively and quickly locked. On the board.

An auxiliary technical means derived from the above-mentioned necessary technical means is that the heat dissipation substrate has a plurality of heat dissipation fins. Thereby, the board can be effectively dissipated.

An auxiliary technical means derived from the above-mentioned technical means is that the heat dissipation substrate has a plurality of fixing holes for fixing the heat dissipation substrate to the stress concentration region of the circuit board by the fixing holes. Thereby, the heat dissipation substrate can be effectively fixed to the circuit board.

An auxiliary technical means derived from the above-mentioned necessary technical means is that the heat dissipation substrate is composed of a highly thermally conductive metal. Thereby, the board can be effectively dissipated.

The specific embodiments of the present invention will be further described by the following examples and drawings.

PA100‧‧‧Circuit board module with iron backplane

PA1‧‧‧ circuit board

PA2‧‧‧ iron back plate

PA200‧‧‧ screws

100‧‧‧Server

1‧‧‧ boards

2‧‧‧heated substrate

21‧‧‧ Heat sink fins

22‧‧‧Fixed holes

3‧‧‧Rigid connecting rod

31‧‧‧Rigid Link Body

32, 33‧‧‧ End fixing department

321‧‧‧ screw hole

200‧‧‧ screws

SC‧‧‧stress concentration area

SD‧‧‧ Stress Dispersion Area

The first figure shows a stereoscopic display of a circuit board module with an iron backplane in the prior art. 2 is a perspective view showing a server provided by a preferred embodiment of the present invention; and a third view showing a heat dissipation substrate and a rigid link provided by a preferred embodiment of the present invention.

Please refer to the second and third figures. The second figure shows a schematic view of the server provided by the preferred embodiment of the present invention. The third figure shows the heat dissipation substrate and the rigid connecting rod provided by the preferred embodiment of the present invention. Stereoscopic view. As shown, a server 100 includes a circuit board 1, a heat sink substrate 2, and a rigid link 3. The circuit board 1 has a stress concentration area SC and a stress dispersion area SD located on the periphery of the stress concentration area SC.

The heat dissipation substrate 2 is composed of a plurality of heat dissipation fins 21, and the heat dissipation substrate 2 has four fixing holes 22 (only one is shown). Among them, the heat dissipation substrate 2 is made of a material having a high thermal conductivity, such as a metal such as aluminum or copper.

The rigid link 3 has a rigid link body 31 and two end fixing portions 32 and 33, and the rigid link body 31 is welded to the heat dissipation substrate 2. The end fixing portions 32 and 33 are disposed at both ends of the rigid link body 31, and the end fixing portion 32 has a screw hole 321 , and the end fixing portion 32 has a screw hole (not shown, and is symmetrically arranged with the screw hole 321 ) ). Among them, the rigid link 3 is made of a relatively rigid metal material, such as a stainless steel material.

In practical use, the server 100 is a fixing hole through the heat dissipation substrate 2 22, the heat-dissipating substrate 2 is screwed to the stress concentration area SC of the circuit board 1. For example, a screw hole corresponding to the fixing hole 22 is disposed in the stress concentration area SC of the circuit board 1, and the screw can be first passed through the fixing hole. After 22, the corresponding screw holes of the circuit board 1 are locked, and the heat dissipation substrate 2 is locked in the stress concentration area SC of the circuit board 1. In practice, the heat-dissipating substrate 2 can partially contact the circuit board 1 in a non-contact manner, and the printed circuit board 1 can be contacted in a non-integral manner, and the heat of the circuit board 1 can be transferred to the heat-dissipating fin through the contact portion. Slice 21. In practice, the heat dissipation substrate 2 is made of a highly thermally conductive metal such as aluminum or copper, but is not limited thereto.

In addition, the rigid link 3 is used to lock the two end fixing portions 32 and 33 through the screw holes 321 of the end fixing portion 32 and the screw holes of the end fixing portion 33 to the stress dispersion area SD of the circuit board 1 by the two screws 200, respectively. For example, an opening corresponding to the screw hole 321 is provided on the stress dispersion area SD of the circuit board 1 (not shown), and the user can first insert the screw through the opening hole and then lock the screw hole 321 to fix the two ends. The portions 32 and 33 are locked to the circuit board 1. The rigid link 3 can be effectively and quickly fixed to the circuit board 1 by screwing the rigid link 3 and the circuit board 1.

As described above, since the rigid link 3 is fixed to the heat dissipation substrate 2, the heat dissipation substrate 2 is fixed to the stress concentration area SC of the circuit board 1, and the rigid link 3 is fixed to the stress dispersion area SD of the circuit board 1, Therefore, the circuit board 1 is largely fixed by the heat dissipation substrate 2 and the rigid link 3, thereby reinforcing the strength of the entire circuit board 1.

In summary, since the prior art utilizes the strength of the iron back plate itself to reinforce the strength of the circuit board, it is necessary to fix the iron back plate to the circuit board in an adhesive manner to effectively improve the strength of the circuit board, that is, the iron back. Board for The reinforcing ability of the circuit board depends on the area occupied by the iron back board, and in order to gradually reduce the area occupied by the iron back board, the iron back board is designed as a hollow frame, but even so, the iron back board still needs to occupy a certain amount. The area can effectively reinforce the strength of the circuit board; compared to this, the servo of the present invention is fixed on both sides of the circuit board by using a rigid link, so that the circuit board can be effectively prevented from being bent due to falling or being shaken. Folding phenomenon, and since the reinforcing rod body is connected to the heat dissipating substrate, and the heat dissipating substrate is fixed on the circuit board, the circuit board can be further reinforced by the heat dissipating substrate and the reinforcing rod body, and the external force received on both sides of the circuit board It can also be dispersed to the heat dissipation substrate via the reinforcing rod body, which greatly enhances the strength of the board.

In addition, since the reinforcing rod body is fixed to both sides of the circuit board only through the two end fixing portions, the area occupied by the reinforcing rod body can be effectively reduced, and the heat dissipating substrate is set according to the heat dissipation requirement of the circuit board, so While occupying the area of the circuit board outside, that is, in the case where the prior art originally provided a heat dissipating substrate to dissipate the circuit board, the present invention reinforces the circuit board through the rigid link, and the prior art is through the iron back. The board is reinforced, so the combination of the rigid link and the heat sink substrate of the present invention does have unpredictable effects.

The features and spirit of the present invention will be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed.

100‧‧‧Server

200‧‧‧ screws

1‧‧‧ boards

2‧‧‧heated substrate

3‧‧‧Rigid connecting rod

32, 33‧‧‧ End fixing department

SC‧‧‧stress concentration area

SD‧‧‧ Stress Dispersion Area

Claims (6)

A server comprising: a circuit board having a stress concentration region and a stress dispersion region located at a periphery of the stress concentration region; a heat dissipation substrate coupled to the circuit board and located in the stress concentration region; And a rigid link body having a rigid link body fixedly attached to the heat dissipation substrate and fixed to the stress dispersion area of the circuit board across the stress concentration area. The server of claim 1, wherein the rigid link has two end fixing portions disposed at two ends of the rigid link body and respectively fixed to the stress dispersion region . The server of claim 2, wherein the two end fixing portions each have a screw hole, thereby fixing the two end fixing portions to the circuit board. The server of claim 1, wherein the heat dissipation substrate has a plurality of heat dissipation fins. The server of claim 1, wherein the heat dissipation substrate has a plurality of fixing holes for fixing the heat dissipation substrate to the stress concentration region of the circuit board by the fixing holes. The server of claim 1, wherein the heat dissipation substrate is made of a highly thermally conductive metal.