TWD243494S - 基板處理裝置用氣體供給噴嘴 - Google Patents

基板處理裝置用氣體供給噴嘴

Info

Publication number
TWD243494S
TWD243494S TW113304577F TW113304577F TWD243494S TW D243494 S TWD243494 S TW D243494S TW 113304577 F TW113304577 F TW 113304577F TW 113304577 F TW113304577 F TW 113304577F TW D243494 S TWD243494 S TW D243494S
Authority
TW
Taiwan
Prior art keywords
processing apparatus
substrate processing
gas supply
supply nozzle
item
Prior art date
Application number
TW113304577F
Other languages
English (en)
Chinese (zh)
Inventor
守屋赳利
岡嶋優作
槣原美香
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD243494S publication Critical patent/TWD243494S/zh

Links

TW113304577F 2024-03-08 2024-09-05 基板處理裝置用氣體供給噴嘴 TWD243494S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024-004873 2024-03-08
JP2024004873F JP1774817S (oth) 2024-03-08 2024-03-08

Publications (1)

Publication Number Publication Date
TWD243494S true TWD243494S (zh) 2026-03-21

Family

ID=91672187

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113304577F TWD243494S (zh) 2024-03-08 2024-09-05 基板處理裝置用氣體供給噴嘴

Country Status (3)

Country Link
US (1) USD1109711S1 (oth)
JP (1) JP1774817S (oth)
TW (1) TWD243494S (oth)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD120457S1 (zh) 2006-10-06 2007-12-11 紐富來科技股份有限公司 氣相成長裝置用氣體噴嘴

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USD447921S1 (en) * 2001-01-09 2001-09-18 Gary Ray Beltz Plant water nozzle attachment
USD502985S1 (en) * 2003-03-11 2005-03-15 Johannes Petrus Coetzee Katzke Nozzle
US8148271B2 (en) * 2005-08-05 2012-04-03 Hitachi Kokusai Electric Inc. Substrate processing apparatus, coolant gas supply nozzle and semiconductor device manufacturing method
US7635096B2 (en) * 2005-08-19 2009-12-22 Stoneage, Inc. Self regulating fluid bearing high pressure rotary nozzle with balanced thrust force
JP5044931B2 (ja) * 2005-10-31 2012-10-10 東京エレクトロン株式会社 ガス供給装置及び基板処理装置
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JP2009239082A (ja) * 2008-03-27 2009-10-15 Tokyo Electron Ltd ガス供給装置、処理装置及び処理方法
USD613116S1 (en) * 2009-08-10 2010-04-06 W.C. Bradley Co. Universal fit bar burner
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US10683571B2 (en) * 2014-02-25 2020-06-16 Asm Ip Holding B.V. Gas supply manifold and method of supplying gases to chamber using same
JP6320824B2 (ja) * 2014-03-31 2018-05-09 株式会社東芝 ガス供給管、およびガス処理装置
JP1520999S (oth) * 2014-09-02 2015-04-06
JP1534651S (oth) * 2015-01-28 2015-10-05
JP1547057S (oth) * 2015-05-28 2016-04-04
JP6578243B2 (ja) * 2015-07-17 2019-09-18 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ ガス供給ノズル、基板処理装置、半導体装置の製造方法およびプログラム
JP1563647S (oth) * 2016-01-29 2016-11-21
JP6538582B2 (ja) * 2016-02-15 2019-07-03 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法およびプログラム
JP6710134B2 (ja) * 2016-09-27 2020-06-17 東京エレクトロン株式会社 ガス導入機構及び処理装置
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JP1684258S (oth) * 2020-07-27 2021-04-26
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JP1731676S (ja) * 2022-05-30 2025-12-15 基板処理装置用ガス供給ノズル
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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD120457S1 (zh) 2006-10-06 2007-12-11 紐富來科技股份有限公司 氣相成長裝置用氣體噴嘴

Also Published As

Publication number Publication date
USD1109711S1 (en) 2026-01-20
JP1774817S (oth) 2024-07-05

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