TWD241749S - 基板處理裝置用氣體供給噴嘴 - Google Patents

基板處理裝置用氣體供給噴嘴

Info

Publication number
TWD241749S
TWD241749S TW113300136F TW113300136F TWD241749S TW D241749 S TWD241749 S TW D241749S TW 113300136 F TW113300136 F TW 113300136F TW 113300136 F TW113300136 F TW 113300136F TW D241749 S TWD241749 S TW D241749S
Authority
TW
Taiwan
Prior art keywords
processing apparatus
substrate processing
gas supply
supply nozzle
item
Prior art date
Application number
TW113300136F
Other languages
English (en)
Chinese (zh)
Inventor
笠松健太
平野敦士
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD241749S publication Critical patent/TWD241749S/zh

Links

TW113300136F 2023-08-31 2024-01-11 基板處理裝置用氣體供給噴嘴 TWD241749S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-017719 2023-02-08
JP2023017719F JP1760970S (enExample) 2023-08-31 2023-08-31

Publications (1)

Publication Number Publication Date
TWD241749S true TWD241749S (zh) 2025-12-01

Family

ID=89452049

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113300136F TWD241749S (zh) 2023-08-31 2024-01-11 基板處理裝置用氣體供給噴嘴

Country Status (2)

Country Link
JP (1) JP1760970S (enExample)
TW (1) TWD241749S (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD191628S (zh) 2017-04-14 2018-07-11 日立國際電氣股份有限公司 Air supply nozzle for substrate processing apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD191628S (zh) 2017-04-14 2018-07-11 日立國際電氣股份有限公司 Air supply nozzle for substrate processing apparatus

Also Published As

Publication number Publication date
JP1760970S (enExample) 2024-01-10

Similar Documents

Publication Publication Date Title
TWD228390S (zh) 用於半導體製造設備的腔壁的襯墊
JP2013503490A5 (enExample)
TWD217559S (zh) 用於處理腔室基板支撐件的基底板
JP1678278S (ja) 基板処理装置用ボート
TWD227498S (zh) 氣體分配板
TWD203444S (zh) 基板處理裝置用氣體導入管
JP2016051864A5 (enExample)
TW201207148A (en) Improved silicon nitride films and methods
JP2011009699A5 (ja) 基板処理装置、基板処理方法および半導体装置の製造方法
JP1684468S (ja) 基板処理装置用天井ヒータ
SG11201808114VA (en) Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
TWD227156S (zh) 用於半導體製程的氣體分佈板
TWD241749S (zh) 基板處理裝置用氣體供給噴嘴
TWI762813B (zh) 用於清洗和表面處理的原子氧和臭氧裝置
JP1737180S (ja) 半導体処理装置用シャワーヘッド
JP1684469S (ja) 基板処理装置用天井ヒータ
TWD197467S (zh) 基板處理裝置用氣體導入管
TW200503051A (en) Methods and apparatus for processing semiconductor wafers with plasma processing chambers in a wafer track environment
TWD225633S (zh) 半導體製造裝置用隔熱組件外罩
TWD215922S (zh) 基板處理裝置用氣體導入管
TWD228269S (zh) 基板處理裝置用基板保持具
JP1767336S (ja) 半導体処理装置用シャワーヘッド
TWD226182S (zh) 基板處理裝置用氣體供給噴嘴之部分
TWD231991S (zh) 基板處理裝置用氣體供給噴嘴之部分
TWD228904S (zh) 用於半導體製造設備的排氣壁的襯墊