TWD240927S - 基板處理裝置用溫度測定具 - Google Patents

基板處理裝置用溫度測定具

Info

Publication number
TWD240927S
TWD240927S TW112306500F TW112306500F TWD240927S TW D240927 S TWD240927 S TW D240927S TW 112306500 F TW112306500 F TW 112306500F TW 112306500 F TW112306500 F TW 112306500F TW D240927 S TWD240927 S TW D240927S
Authority
TW
Taiwan
Prior art keywords
substrate processing
temperature measuring
processing equipment
measuring tool
design
Prior art date
Application number
TW112306500F
Other languages
English (en)
Chinese (zh)
Inventor
中田高行
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD240927S publication Critical patent/TWD240927S/zh

Links

TW112306500F 2023-06-19 2023-12-12 基板處理裝置用溫度測定具 TWD240927S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-012484 2023-01-31
JP2023012484F JP1760961S (enExample) 2023-06-19 2023-06-19

Publications (1)

Publication Number Publication Date
TWD240927S true TWD240927S (zh) 2025-10-11

Family

ID=89452047

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112306500F TWD240927S (zh) 2023-06-19 2023-12-12 基板處理裝置用溫度測定具

Country Status (3)

Country Link
US (1) USD1140754S1 (enExample)
JP (1) JP1760961S (enExample)
TW (1) TWD240927S (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD174923S (zh) 2015-02-25 2016-04-11 日立國際電氣股份有限公司 熱電偶用保護管
TWD182149S (zh) 2016-02-10 2017-04-01 日立國際電氣股份有限公司 基板處理裝置之溫度測定器之部分

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD564462S1 (en) * 2005-12-27 2008-03-18 Tokyo Electron Limited RF electrode for a process tube of semiconductor manufacturing apparatus
USD560518S1 (en) * 2006-06-22 2008-01-29 Watlow Electric Manufacturing Company Uni-probe temperature sensor assembly
KR101012082B1 (ko) * 2007-06-25 2011-02-07 데이또꾸샤 가부시키가이샤 가열 장치 및 이것을 채용한 기판 처리 장치 및 반도체장치의 제조 방법 및 절연체
DE202012003186U1 (de) * 2012-03-29 2012-04-30 Türk & Hillinger GmbH Eintauch-Temperatursensor
JP6493722B2 (ja) * 2014-07-03 2019-04-03 清水建設株式会社 ３次元図形生成システム及び３次元図形生成方法
JP1534940S (enExample) * 2015-02-25 2015-10-13
JP1577928S (enExample) * 2016-07-14 2017-06-05
JP1577927S (enExample) 2016-07-14 2017-06-05
JP1692912S (ja) * 2020-09-15 2021-08-16 温度センサ
CN117836914A (zh) * 2021-09-28 2024-04-05 株式会社国际电气 支撑件、基板处理装置以及半导体装置的制造方法
USD1030526S1 (en) * 2022-03-18 2024-06-11 Therm-O-Disc, Incorporated Single probe sensor
USD1031467S1 (en) * 2022-03-18 2024-06-18 Therm-O-Disc, Incorporated Dual probe sensor
US20250316504A1 (en) * 2024-04-09 2025-10-09 Applied Materials, Inc. Cleaning device for semiconductor and flat panel display processing tools

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD174923S (zh) 2015-02-25 2016-04-11 日立國際電氣股份有限公司 熱電偶用保護管
TWD182149S (zh) 2016-02-10 2017-04-01 日立國際電氣股份有限公司 基板處理裝置之溫度測定器之部分

Also Published As

Publication number Publication date
JP1760961S (enExample) 2024-01-10
USD1140754S1 (en) 2026-08-11

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