TWD227418S - Stamp component for transferring microstructure - Google Patents
Stamp component for transferring microstructure Download PDFInfo
- Publication number
- TWD227418S TWD227418S TW111304866D01F TW111304866D01F TWD227418S TW D227418 S TWD227418 S TW D227418S TW 111304866D01 F TW111304866D01 F TW 111304866D01F TW 111304866D01 F TW111304866D01 F TW 111304866D01F TW D227418 S TWD227418 S TW D227418S
- Authority
- TW
- Taiwan
- Prior art keywords
- design
- case
- transparent resin
- transparent
- thickness
- Prior art date
Links
- 239000011347 resin Substances 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
Abstract
【物品用途】;本設計物品是一種微小構造體移載用模板零件，例如在厚度為0.5-3mm、邊長為5-300mm的透明基板上具有厚度為1-500μm的透明樹脂。透明樹脂拾取配置在另一基板上的半導體元件或微發光二極體並移載到再一基板上。此外，透明樹脂的表面具有突起。突起的形狀為三個四角錐梯形重疊的形狀，例如基部的邊長為1-150μm。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。圖式所揭露之實線部分，為本案主張設計之部分。圖式中一點鏈線所圍繞者，是界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。;本設計物品的整體為透明。[Use of article] This design article is a template part for transferring microstructures, for example, a transparent resin with a thickness of 1-500μm on a transparent substrate with a thickness of 0.5-3mm and a side length of 5-300mm. The transparent resin picks up the semiconductor element or micro-light emitting diode arranged on another substrate and transfers it to another substrate. In addition, the transparent resin has protrusions on its surface. The shape of the protrusion is a shape in which three quadrangular pyramidal trapezoids overlap, and for example, the side length of the base is 1-150 μm. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design. The solid line part revealed in the drawing is the proposed design part of this case. What is surrounded by the one-point chain line in the diagram defines the scope of the claim in this case. The one-point chain line itself is the part of the design that is not claimed in this case. ;The entire design object is transparent.
Description
本設計物品是一種微小構造體移載用模板零件，例如在厚度為0.5-3mm、邊長為5-300mm的透明基板上具有厚度為1-500μm的透明樹脂。透明樹脂拾取配置在另一基板上的半導體元件或微發光二極體並移載到再一基板上。此外，透明樹脂的表面具有突起。突起的形狀為三個四角錐梯形重疊的形狀，例如基部的邊長為1-150μm。This design article is a template part for transferring microstructures, for example, a transparent resin with a thickness of 1-500 μm on a transparent substrate with a thickness of 0.5-3 mm and a side length of 5-300 mm. The transparent resin picks up the semiconductor element or micro-light emitting diode arranged on another substrate and transfers it to another substrate. In addition, the transparent resin has protrusions on its surface. The shape of the protrusion is a shape in which three quadrangular pyramidal trapezoids overlap, and for example, the side length of the base is 1-150 μm.
圖式所揭露之虛線部分，為本案不主張設計之部分。圖式所揭露之實線部分，為本案主張設計之部分。圖式中一點鏈線所圍繞者，是界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。The dotted line parts revealed in the diagram are the parts that are not designed in this case. The solid line part revealed in the drawing is the proposed design part of this case. What is surrounded by the one-point chain line in the diagram defines the scope of the claim in this case. The one-point chain line itself is the part of the design that is not claimed in this case.
本設計物品的整體為透明。The entire design object is transparent.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-022463 | 2021-10-15 | ||
| JP2021022463F JP1740485S (en) | 2021-10-15 | 2021-10-15 | Stamp parts for microstructure transfer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD227418S true TWD227418S (en) | 2023-09-11 |
Family
ID=85717910
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111304866D01F TWD227418S (en) | 2021-10-15 | 2022-04-15 | Stamp component for transferring microstructure |
| TW111304866D02F TWD227419S (en) | 2021-10-15 | 2022-04-15 | Stamp component for transferring microstructure |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111304866D02F TWD227419S (en) | 2021-10-15 | 2022-04-15 | Stamp component for transferring microstructure |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1740485S (en) |
| TW (2) | TWD227418S (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD204497S (en) | 2018-12-19 | 2020-05-01 | 日商松下知識產權經營股份有限公司 | Semiconductor device |
-
2021
- 2021-10-15 JP JP2021022463F patent/JP1740485S/en active Active
-
2022
- 2022-04-15 TW TW111304866D01F patent/TWD227418S/en unknown
- 2022-04-15 TW TW111304866D02F patent/TWD227419S/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD204497S (en) | 2018-12-19 | 2020-05-01 | 日商松下知識產權經營股份有限公司 | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD227419S (en) | 2023-09-11 |
| JP1740485S (en) | 2023-03-30 |
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