TWD222973S

TWD222973S - Stamp component for transferring microstructure

Info

Publication number: TWD222973S
Application number: TW111301798D01F
Authority: TW
Inventors: 小川敬典; 近藤和紀; 戸村信章; 松本展明; 坂本晶; 北川太一
Original assignee: 日商信越化學工業股份有限公司
Priority date: 2021-10-15
Filing date: 2022-04-15
Publication date: 2023-01-01
Also published as: JP1718418S

Abstract

【物品用途】;本物品是一種微小構造體移載用模板零件。本物品例如在厚度0.5~3mm、直徑50~450mm的透明基板上具有厚度爲1~500µm的透明樹脂。本物品用於拾取由透明樹脂在基板上形成或提供的微小構造體，例如半導體元件和微型LED元件等，以將拾取的微小構造體移載到不同的基板上。;【設計說明】;物品整體透明。;以虛線表示的定向平面，為本案不主張設計之部分。;後視圖未繪示定向平面。;在左側視圖的右端及在右側視圖的左端，定向平面的末端以虛線表示。【Use of item】;This item is a template part for transferring tiny structures. This article has, for example, a transparent resin with a thickness of 1 to 500 µm on a transparent substrate with a thickness of 0.5 to 3 mm and a diameter of 50 to 450 mm. This article is used to pick up microstructures formed or provided by transparent resin on a substrate, such as semiconductor components and micro LED components, so as to transfer the picked microstructures to different substrates. ;[Design Description];The entire item is transparent. ;The directional plane represented by the dotted line is a part of this case that is not intended to be designed. ;The rear view does not show the orientation plane. ;At the right end of the left view and at the left end of the right view, the ends of the orientation plane are indicated by dashed lines.

Description

Formwork parts for transfer of microstructures

本物品是一種微小構造體移載用模板零件。本物品例如在厚度0.5~3mm、直徑50~450mm的透明基板上具有厚度爲1~500µm的透明樹脂。本物品用於拾取由透明樹脂在基板上形成或提供的微小構造體，例如半導體元件和微型LED元件等，以將拾取的微小構造體移載到不同的基板上。This article is a formwork part for microstructure transfer. This article has, for example, a transparent resin with a thickness of 1 to 500 µm on a transparent substrate with a thickness of 0.5 to 3 mm and a diameter of 50 to 450 mm. This article is used to pick up microstructures formed or provided on a substrate with transparent resin, such as semiconductor elements and micro LED elements, etc., to transfer the picked up microstructures to a different substrate.

物品整體透明。The item is transparent as a whole.

以虛線表示的定向平面，為本案不主張設計之部分。The directional plane indicated by the dotted line is the part of the design that is not claimed in this case.

後視圖未繪示定向平面。The rear view does not show the orientation plane.

在左側視圖的右端及在右側視圖的左端，定向平面的末端以虛線表示。At the right end of the left view and at the left end of the right view, the ends of the orientation planes are indicated by dotted lines.