TWD224189S - Stamp component for transferring microstructure - Google Patents
Stamp component for transferring microstructure Download PDFInfo
- Publication number
- TWD224189S TWD224189S TW111301798D03F TW111301798D03F TWD224189S TW D224189 S TWD224189 S TW D224189S TW 111301798D03 F TW111301798D03 F TW 111301798D03F TW 111301798D03 F TW111301798D03 F TW 111301798D03F TW D224189 S TWD224189 S TW D224189S
- Authority
- TW
- Taiwan
- Prior art keywords
- item
- transparent
- article
- transferring
- stamp component
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000009415 formwork Methods 0.000 description 1
Images
Abstract
【物品用途】;本物品是一種微小構造體移載用模板零件。本物品例如在厚度0.5~3mm、直徑50~450mm的透明基板上具有厚度爲1~500µm的透明樹脂。本物品用於拾取由透明樹脂在基板上形成或提供的微小構造體，例如半導體元件和微型LED元件等，以將拾取的微小構造體移載到不同的基板上。;【設計說明】;物品整體透明。【Use of item】;This item is a template part for transferring tiny structures. This article has, for example, a transparent resin with a thickness of 1 to 500 µm on a transparent substrate with a thickness of 0.5 to 3 mm and a diameter of 50 to 450 mm. This article is used to pick up microstructures formed or provided by transparent resin on a substrate, such as semiconductor components and micro LED components, so as to transfer the picked microstructures to different substrates. ;[Design Description];The entire item is transparent.
Description
本物品是一種微小構造體移載用模板零件。本物品例如在厚度0.5~3mm、直徑50~450mm的透明基板上具有厚度爲1~500µm的透明樹脂。本物品用於拾取由透明樹脂在基板上形成或提供的微小構造體，例如半導體元件和微型LED元件等，以將拾取的微小構造體移載到不同的基板上。This article is a formwork part for microstructure transfer. This article has, for example, a transparent resin with a thickness of 1 to 500 µm on a transparent substrate with a thickness of 0.5 to 3 mm and a diameter of 50 to 450 mm. This article is used to pick up microstructures formed or provided on a substrate with transparent resin, such as semiconductor elements and micro LED elements, etc., to transfer the picked up microstructures to a different substrate.
物品整體透明。The item is transparent as a whole.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-022485 | 2021-10-15 | ||
| JP2021022485F JP1718125S (en) | 2021-10-15 | 2021-10-15 | Stamp parts for transferring microstructures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD224189S true TWD224189S (en) | 2023-03-11 |
Family
ID=82068556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111301798D03F TWD224189S (en) | 2021-10-15 | 2022-04-15 | Stamp component for transferring microstructure |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1718125S (en) |
| TW (1) | TWD224189S (en) |
-
2021
- 2021-10-15 JP JP2021022485F patent/JP1718125S/en active Active
-
2022
- 2022-04-15 TW TW111301798D03F patent/TWD224189S/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP1718125S (en) | 2022-06-23 |
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