TWD227416S - Stamp component for transferring microstructure - Google Patents

Stamp component for transferring microstructure Download PDF

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Publication number
TWD227416S
TWD227416S TW111304865F TW111304865F TWD227416S TW D227416 S TWD227416 S TW D227416S TW 111304865 F TW111304865 F TW 111304865F TW 111304865 F TW111304865 F TW 111304865F TW D227416 S TWD227416 S TW D227416S
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TW
Taiwan
Prior art keywords
transparent
transparent resin
thickness
side length
article
Prior art date
Application number
TW111304865F
Other languages
Chinese (zh)
Inventor
小川敬典
近藤和紀
戸村信章
松本展明
坂本晶
北川太一
Original Assignee
日商信越化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商信越化學工業股份有限公司 filed Critical 日商信越化學工業股份有限公司
Publication of TWD227416S publication Critical patent/TWD227416S/en

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Abstract

【物品用途】;本設計物品是一種微小構造體移載用模板零件，例如在厚度為0.5-3mm、邊長為5-300mm的透明基板上具有厚度為1-500μm的透明樹脂。透明樹脂拾取配置在另一基板上的半導體元件或微發光二極體並移載到再一基板上。此外，透明樹脂的表面具有突起。突起的形狀為四角錐梯形的形狀，例如基部的邊長為1-150μm。;【設計說明】;本設計物品的整體為透明。[Use of article] This design article is a template part for transferring microstructures, for example, a transparent resin with a thickness of 1-500μm on a transparent substrate with a thickness of 0.5-3mm and a side length of 5-300mm. The transparent resin picks up the semiconductor element or micro-light emitting diode arranged on another substrate and transfers it to another substrate. In addition, the transparent resin has protrusions on its surface. The shape of the protrusion is a quadrangular pyramidal trapezoid, for example, the side length of the base is 1-150 μm. ;[Design Description];The entire design object is transparent.

Description

微小構造體移載用模板零件Template parts for transferring microstructures

本設計物品是一種微小構造體移載用模板零件，例如在厚度為0.5-3mm、邊長為5-300mm的透明基板上具有厚度為1-500μm的透明樹脂。透明樹脂拾取配置在另一基板上的半導體元件或微發光二極體並移載到再一基板上。此外，透明樹脂的表面具有突起。突起的形狀為四角錐梯形的形狀，例如基部的邊長為1-150μm。This design article is a template part for transferring microstructures, for example, a transparent resin with a thickness of 1-500 μm on a transparent substrate with a thickness of 0.5-3 mm and a side length of 5-300 mm. The transparent resin picks up the semiconductor element or micro-light emitting diode arranged on another substrate and transfers it to another substrate. In addition, the transparent resin has protrusions on its surface. The shape of the protrusion is a quadrangular pyramidal trapezoid, for example, the side length of the base is 1-150 μm.

本設計物品的整體為透明。The entire design object is transparent.

TW111304865F 2021-10-15 2022-04-15 Stamp component for transferring microstructure TWD227416S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-022461 2021-02-16
JP2021022461F JP1724478S (en) 2021-10-15 2021-10-15 Stamp parts for microstructure transfer

Publications (1)

Publication Number Publication Date
TWD227416S true TWD227416S (en) 2023-09-11

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ID=83230162

Family Applications (2)

Application Number Title Priority Date Filing Date
TW111304865F TWD227416S (en) 2021-10-15 2022-04-15 Stamp component for transferring microstructure
TW111305385F TWD226270S (en) 2021-10-15 2022-04-15 Stamp component for transferring microstructure

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW111305385F TWD226270S (en) 2021-10-15 2022-04-15 Stamp component for transferring microstructure

Country Status (2)

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JP (1) JP1724478S (en)
TW (2) TWD227416S (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD204497S (en) 2018-12-19 2020-05-01 日商松下知識產權經營股份有限公司 Semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1660180S (en) 2019-10-25 2020-05-25

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD204497S (en) 2018-12-19 2020-05-01 日商松下知識產權經營股份有限公司 Semiconductor device

Also Published As

Publication number Publication date
JP1724478S (en) 2022-09-12
TWD226270S (en) 2023-07-01

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