TWD229331S - Stamp component for transferring microstructure - Google Patents

Stamp component for transferring microstructure Download PDF

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Publication number
TWD229331S
TWD229331S TW112300213D01F TW112300213D01F TWD229331S TW D229331 S TWD229331 S TW D229331S TW 112300213D01 F TW112300213D01 F TW 112300213D01F TW 112300213D01 F TW112300213D01 F TW 112300213D01F TW D229331 S TWD229331 S TW D229331S
Authority
TW
Taiwan
Prior art keywords
item
transparent
transferring
article
stamp component
Prior art date
Application number
TW112300213D01F
Other languages
Chinese (zh)
Inventor
小川敬典
近藤和紀
戸村信章
松本展明
坂本晶
北川太一
Original Assignee
日商信越化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商信越化學工業股份有限公司 filed Critical 日商信越化學工業股份有限公司
Publication of TWD229331S publication Critical patent/TWD229331S/en

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Abstract

【物品用途】;本物品是一種微小構造體移載用模板零件。本物品例如在厚度0.5~3mm、直徑50~450mm的透明基板上具有厚度爲1~500µm的透明樹脂。本物品用於拾取由透明樹脂在基板上形成或提供的微小構造體，例如半導體元件和微型LED元件等，以將拾取的微小構造體移載到不同的基板上。;【設計說明】;物品整體透明。【Use of item】;This item is a template part for transferring tiny structures. This article has, for example, a transparent resin with a thickness of 1 to 500 µm on a transparent substrate with a thickness of 0.5 to 3 mm and a diameter of 50 to 450 mm. This article is used to pick up microstructures formed or provided by transparent resin on a substrate, such as semiconductor components and micro LED components, so as to transfer the picked microstructures to different substrates. ;[Design Description];The entire item is transparent.

Description

微小構造體移載用模板零件Template parts for transferring microstructures

本物品是一種微小構造體移載用模板零件。本物品例如在厚度0.5~3mm、直徑50~450mm的透明基板上具有厚度爲1~500µm的透明樹脂。本物品用於拾取由透明樹脂在基板上形成或提供的微小構造體，例如半導體元件和微型LED元件等，以將拾取的微小構造體移載到不同的基板上。This item is a template part for transferring microstructures. This article has, for example, a transparent resin with a thickness of 1 to 500 µm on a transparent substrate with a thickness of 0.5 to 3 mm and a diameter of 50 to 450 mm. This article is used to pick up microstructures formed or provided by transparent resin on a substrate, such as semiconductor components and micro LED components, so as to transfer the picked microstructures to different substrates.

物品整體透明。The item is completely transparent.

TW112300213D01F 2021-10-15 2022-04-15 Stamp component for transferring microstructure TWD229331S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-022487 2021-02-16
JP2021022487F JP1725067S (en) 2021-10-15 2021-10-15 Stamp parts for microstructure transfer

Publications (1)

Publication Number Publication Date
TWD229331S true TWD229331S (en) 2024-01-01

Family

ID=83230520

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112300213D01F TWD229331S (en) 2021-10-15 2022-04-15 Stamp component for transferring microstructure

Country Status (2)

Country Link
JP (1) JP1725067S (en)
TW (1) TWD229331S (en)

Also Published As

Publication number Publication date
JP1725067S (en) 2022-09-15

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