TWD225749S - Receptor substrate - Google Patents
Receptor substrate Download PDFInfo
- Publication number
- TWD225749S TWD225749S TW111301808F TW111301808F TWD225749S TW D225749 S TWD225749 S TW D225749S TW 111301808 F TW111301808 F TW 111301808F TW 111301808 F TW111301808 F TW 111301808F TW D225749 S TWD225749 S TW D225749S
- Authority
- TW
- Taiwan
- Prior art keywords
- article
- design
- transparent
- receptor substrate
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract description 11
- 239000011347 resin Substances 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 2
Images
Abstract
【物品用途】;本設計物品是一種受體基板，且是一種用於轉移微結構的受體基板。本設計之物品例如在透明基板上具有透明樹脂，透明樹脂具有1微米-500微米的厚度，而透明基板具有0.5毫米-6毫米的厚度以及100毫米1000毫米的側邊長度。本設計物品用於將形成或提供在其他基板上的微結構，例如半導體器件和micro-LED等，通過雷射剝離等接收到透明樹脂上。;【設計說明】;本設計之物品整體為透明的。[Use of article]; This designed article is a receptor substrate, and it is a receptor substrate used for transferring microstructures. The article of this design has, for example, a transparent resin on a transparent substrate, the transparent resin has a thickness of 1 micron to 500 microns, and the transparent substrate has a thickness of 0.5 mm to 6 mm and a side length of 100 mm to 1000 mm. This design article is used to receive microstructures formed or provided on other substrates, such as semiconductor devices and micro-LEDs, onto transparent resin through laser lift-off, etc. ;[Design Description];The items in this design are entirely transparent.
Description
本設計物品是一種受體基板，且是一種用於轉移微結構的受體基板。本設計之物品例如在透明基板上具有透明樹脂，透明樹脂具有1微米-500微米的厚度，而透明基板具有0.5毫米-6毫米的厚度以及100毫米1000毫米的側邊長度。本設計物品用於將形成或提供在其他基板上的微結構，例如半導體器件和micro-LED等，通過雷射剝離等接收到透明樹脂上。The article of design is a receptor substrate, and is a receptor substrate for transferring microstructures. The article of this design has, for example, a transparent resin on a transparent substrate, the transparent resin has a thickness of 1 micron to 500 microns, and the transparent substrate has a thickness of 0.5 mm to 6 mm and a side length of 100 mm to 1000 mm. This design article is used to receive microstructures formed or provided on other substrates, such as semiconductor devices and micro-LEDs, etc., onto transparent resins by laser lift-off, etc.
本設計之物品整體為透明的。The article of this design is transparent as a whole.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021022475F JP1718081S (en) | 2021-10-15 | 2021-10-15 | Receptor substrate for microstructure transfer |
| JP2021-022475 | 2021-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD225749S true TWD225749S (en) | 2023-06-11 |
Family
ID=82068477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111301808F TWD225749S (en) | 2021-10-15 | 2022-04-15 | Receptor substrate |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1718081S (en) |
| TW (1) | TWD225749S (en) |
-
2021
- 2021-10-15 JP JP2021022475F patent/JP1718081S/en active Active
-
2022
- 2022-04-15 TW TW111301808F patent/TWD225749S/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP1718081S (en) | 2022-06-23 |
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