TWD229744S

TWD229744S - Release substrate

Info

Publication number: TWD229744S
Application number: TW111301799F
Authority: TW
Inventors: 小川敬典; 近藤和紀; 戸村信章; 松本展明; 坂本晶; 北川太一
Original assignee: 日商信越化學工業股份有限公司 (日本); 日商信越化學工業股份有限公司
Priority date: 2021-10-15
Filing date: 2022-04-15
Publication date: 2024-02-01
Also published as: JP1727676S; TWD229878S

Abstract

【物品用途】;本設計物品是一種離型基板，且是一種用於轉移微結構的離型基板。本設計之物品例如在碟狀透明基板上具有透明樹脂，透明樹脂具有1微米-100微米的厚度，而碟狀透明基板具有0.5毫米-3毫米的厚度以及50毫米-450毫米的半徑。本設計物品用於將提供在樹脂上的微結構，例如半導體器件和micro-LED等，通過雷射剝離等轉移到其他基板上。;【設計說明】;本設計之物品整體為透明的。圖式所揭露之虛線部分，為本案不主張設計之部分。圖式中實線部分為本案要主張設計之部分。圖式中以虛線表示不主張設計的定向為平面的部分。左側視圖的右端與右側視圖的左端處，以虛線表示定向為平面的部分之端部分。[Use of the article]; The article of this design is a release substrate, and is a release substrate for transferring microstructures. The article of this design, for example, has a transparent resin on a disc-shaped transparent substrate, and the transparent resin has a thickness of 1 micron-100 microns, and the disc-shaped transparent substrate has a thickness of 0.5 mm-3 mm and a radius of 50 mm-450 mm. The article of this design is used to transfer microstructures provided on the resin, such as semiconductor devices and micro-LEDs, to other substrates by laser stripping. ;[Design Description]; The article of this design is transparent as a whole. The dotted line portion disclosed in the figure is the portion that is not claimed in the present case. The solid line portion in the figure is the portion that is claimed in the present case. The dotted line in the figure represents the portion that is oriented as a plane and is not claimed in the present case. At the right end of the left-side view and the left end of the right-side view, the end portion of the portion oriented as a plane is indicated by a dotted line.

Description

Release substrate

本設計物品是一種離型基板，且是一種用於轉移微結構的離型基板。本設計之物品例如在碟狀透明基板上具有透明樹脂，透明樹脂具有1微米-100微米的厚度，而碟狀透明基板具有0.5毫米-3毫米的厚度以及50毫米-450毫米的半徑。本設計物品用於將提供在樹脂上的微結構，例如半導體器件和micro-LED等，通過雷射剝離等轉移到其他基板上。This design article is a release substrate, and is a release substrate used for transferring microstructures. The article of this design has, for example, a transparent resin on a disc-shaped transparent substrate. The transparent resin has a thickness of 1 micron to 100 microns, and the disc-shaped transparent substrate has a thickness of 0.5 mm to 3 mm and a radius of 50 mm to 450 mm. This design article is used to transfer microstructures provided on resin, such as semiconductor devices and micro-LEDs, to other substrates through laser lift-off, etc.

本設計之物品整體為透明的。圖式所揭露之虛線部分，為本案不主張設計之部分。圖式中實線部分為本案要主張設計之部分。圖式中以虛線表示不主張設計的定向為平面的部分。左側視圖的右端與右側視圖的左端處，以虛線表示定向為平面的部分之端部分。The entire object of this design is transparent. The dotted line parts revealed in the diagram are the parts that are not designed in this case. The solid line part in the diagram is the main design part of this case. Dotted lines in the drawing indicate parts where the orientation of the design is not intended to be planar. At the right end of the left view and the left end of the right view, the end portions of the portions oriented as a plane are represented by dotted lines.