TWD227420S - Stamp component for transferring microstructure - Google Patents

Stamp component for transferring microstructure Download PDF

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Publication number
TWD227420S
TWD227420S TW111304906F TW111304906F TWD227420S TW D227420 S TWD227420 S TW D227420S TW 111304906 F TW111304906 F TW 111304906F TW 111304906 F TW111304906 F TW 111304906F TW D227420 S TWD227420 S TW D227420S
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TW
Taiwan
Prior art keywords
transparent
transparent resin
thickness
side length
article
Prior art date
Application number
TW111304906F
Other languages
Chinese (zh)
Inventor
小川敬典
近藤和紀
戸村信章
松本展明
坂本晶
北川太一
Original Assignee
日商信越化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商信越化學工業股份有限公司 filed Critical 日商信越化學工業股份有限公司
Publication of TWD227420S publication Critical patent/TWD227420S/en

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Abstract

【物品用途】;本設計物品是一種微小構造體移載用模板零件，例如在厚度為0.5-3mm、邊長為5-300mm的透明基板上具有厚度為1-500μm的透明樹脂。透明樹脂拾取配置在另一基板上的半導體元件或微發光二極體並移載到再一基板上。此外，透明樹脂的表面具有以5-1000μm的間距而格狀排列的突起。突起的形狀為四角錐梯形的形狀，例如基部的邊長為1-150μm。;【設計說明】;本設計物品的整體為透明。[Use of article] This design article is a template part for transferring microstructures, for example, a transparent resin with a thickness of 1-500μm on a transparent substrate with a thickness of 0.5-3mm and a side length of 5-300mm. The transparent resin picks up the semiconductor element or micro-light emitting diode arranged on another substrate and transfers it to another substrate. In addition, the surface of the transparent resin has protrusions arranged in a grid pattern at a pitch of 5 to 1000 μm. The shape of the protrusion is a quadrangular pyramidal trapezoid, for example, the side length of the base is 1-150 μm. ;[Design Description];The entire design object is transparent.

Description

微小構造體移載用模板零件Template parts for transferring microstructures

本設計物品是一種微小構造體移載用模板零件，例如在厚度為0.5-3mm、邊長為5-300mm的透明基板上具有厚度為1-500μm的透明樹脂。透明樹脂拾取配置在另一基板上的半導體元件或微發光二極體並移載到再一基板上。此外，透明樹脂的表面具有以5-1000μm的間距而格狀排列的突起。突起的形狀為四角錐梯形的形狀，例如基部的邊長為1-150μm。This design article is a template part for transferring microstructures, for example, a transparent resin with a thickness of 1-500 μm on a transparent substrate with a thickness of 0.5-3 mm and a side length of 5-300 mm. The transparent resin picks up the semiconductor element or micro-light emitting diode arranged on another substrate and transfers it to another substrate. In addition, the surface of the transparent resin has protrusions arranged in a grid pattern at a pitch of 5 to 1000 μm. The shape of the protrusion is a quadrangular pyramidal trapezoid, for example, the side length of the base is 1-150 μm.

本設計物品的整體為透明。The entire design object is transparent.

TW111304906F 2021-10-15 2022-04-15 Stamp component for transferring microstructure TWD227420S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021022437F JP1724565S (en) 2021-10-15 2021-10-15 Stamp parts for microstructure transfer
JP2021-022437 2021-10-15

Publications (1)

Publication Number Publication Date
TWD227420S true TWD227420S (en) 2023-09-11

Family

ID=83230215

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111304906F TWD227420S (en) 2021-10-15 2022-04-15 Stamp component for transferring microstructure

Country Status (2)

Country Link
JP (1) JP1724565S (en)
TW (1) TWD227420S (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD204497S (en) 2018-12-19 2020-05-01 日商松下知識產權經營股份有限公司 Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD204497S (en) 2018-12-19 2020-05-01 日商松下知識產權經營股份有限公司 Semiconductor device

Also Published As

Publication number Publication date
JP1724565S (en) 2022-09-12

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