TWD226364S - Stamp component for transferring microstructure - Google Patents
Stamp component for transferring microstructure Download PDFInfo
- Publication number
- TWD226364S TWD226364S TW112301381F TW112301381F TWD226364S TW D226364 S TWD226364 S TW D226364S TW 112301381 F TW112301381 F TW 112301381F TW 112301381 F TW112301381 F TW 112301381F TW D226364 S TWD226364 S TW D226364S
- Authority
- TW
- Taiwan
- Prior art keywords
- design
- transparent resin
- transparent
- thickness
- side length
- Prior art date
Links
- 239000011347 resin Substances 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000009415 formwork Methods 0.000 description 1
Abstract
【物品用途】;本設計物品是一種微小構造體移載用模板零件，例如在厚度為0.5-3mm、邊長為5-300mm的透明基板上具有厚度為1-500μm的透明樹脂。透明樹脂拾取配置在另一基板上的半導體元件或微發光二極體並移載到再一基板上。此外，透明樹脂的表面具有以5-1000μm的間距而格狀排列的突起。突起的形狀為三個四角錐梯形重疊的形狀，例如基部的邊長為1-150μm。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。圖式所揭露之實線部分，為本案主張設計之部分。;本設計物品的整體為透明。[Use of article] This design article is a template part for transferring microstructures, for example, a transparent resin with a thickness of 1-500μm on a transparent substrate with a thickness of 0.5-3mm and a side length of 5-300mm. The transparent resin picks up the semiconductor element or micro-light emitting diode arranged on another substrate and transfers it to another substrate. In addition, the surface of the transparent resin has protrusions arranged in a grid pattern at a pitch of 5 to 1000 μm. The shape of the protrusion is a shape in which three quadrangular pyramidal trapezoids overlap, and for example, the side length of the base is 1-150 μm. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design. The solid line part revealed in the drawing is the proposed design part of this case. ;The entire design object is transparent.
Description
本設計物品是一種微小構造體移載用模板零件，例如在厚度為0.5-3mm、邊長為5-300mm的透明基板上具有厚度為1-500μm的透明樹脂。透明樹脂拾取配置在另一基板上的半導體元件或微發光二極體並移載到再一基板上。此外，透明樹脂的表面具有以5-1000μm的間距而格狀排列的突起。突起的形狀為三個四角錐梯形重疊的形狀，例如基部的邊長為1-150μm。The design article is a formwork part for microstructure transfer, for example, a transparent resin with a thickness of 1-500 μm on a transparent substrate with a thickness of 0.5-3 mm and a side length of 5-300 mm. The transparent resin picks up semiconductor elements or micro light emitting diodes disposed on another substrate and transfers them to another substrate. In addition, the surface of the transparent resin has protrusions arranged in a grid at a pitch of 5-1000 μm. The shape of the protrusion is the overlapping shape of three quadrangular pyramids and trapezoids, for example, the side length of the base is 1-150 μm.
圖式所揭露之虛線部分，為本案不主張設計之部分。圖式所揭露之實線部分，為本案主張設計之部分。The dotted line part disclosed in the drawing is the part not claimed in this case. The part of the solid line disclosed in the drawing is the part of the design claimed in this case.
本設計物品的整體為透明。The whole of this design item is transparent.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-022439 | 2021-10-15 | ||
| JP2021022439F JP1718123S (en) | 2021-10-15 | 2021-10-15 | Stamp parts for transferring microstructures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD226364S true TWD226364S (en) | 2023-07-01 |
Family
ID=82068560
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112301382F TWD226365S (en) | 2021-10-15 | 2022-04-15 | Stamp component for transferring microstructure |
| TW112301381F TWD226364S (en) | 2021-10-15 | 2022-04-15 | Stamp component for transferring microstructure |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112301382F TWD226365S (en) | 2021-10-15 | 2022-04-15 | Stamp component for transferring microstructure |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1718123S (en) |
| TW (2) | TWD226365S (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD209201S (en) | 2019-10-25 | 2021-01-01 | 日商昭和電工材料股份有限公司 | Film for manufacturing semiconductor device |
-
2021
- 2021-10-15 JP JP2021022439F patent/JP1718123S/en active Active
-
2022
- 2022-04-15 TW TW112301382F patent/TWD226365S/en unknown
- 2022-04-15 TW TW112301381F patent/TWD226364S/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD209201S (en) | 2019-10-25 | 2021-01-01 | 日商昭和電工材料股份有限公司 | Film for manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD226365S (en) | 2023-07-01 |
| JP1718123S (en) | 2022-06-23 |
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