TWD209201S - Film for manufacturing semiconductor device - Google Patents

Film for manufacturing semiconductor device Download PDF

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Publication number
TWD209201S
TWD209201S TW109301937D03F TW109301937D03F TWD209201S TW D209201 S TWD209201 S TW D209201S TW 109301937D03 F TW109301937D03 F TW 109301937D03F TW 109301937D03 F TW109301937D03 F TW 109301937D03F TW D209201 S TWD209201 S TW D209201S
Authority
TW
Taiwan
Prior art keywords
film
manufacturing semiconductor
semiconductor device
design
diaphragm
Prior art date
Application number
TW109301937D03F
Other languages
Chinese (zh)
Inventor
尾崎義信
田澤強
谷口紘平
矢羽田達也
板垣圭
Original Assignee
日商昭和電工材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TWD209201S publication Critical patent/TWD209201S/en

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Description

製造半導體裝置用的膜片 Diaphragm for manufacturing semiconductor devices

本設計物品是一種製造半導體裝置用的膜片。 This design article is a diaphragm for manufacturing semiconductor devices.

本設計圖式所揭露之虛線為本案不主張設計之部分。圖式中一點鏈線所圍繞者，係界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。顯示使用狀態的參考視圖1和2表示本設計之物品及所應用環境中之各部件名稱，其中本設計應用之物品係由基膜與黏著劑層、成膜支撐構件所構成，黏著劑層和基膜是透明的。 The dotted line disclosed in this design diagram is the part of the project that does not advocate design. The one-point chain line in the diagram defines the scope of this case. The one-point chain line itself is a part of the case that does not advocate design. The reference views 1 and 2 showing the state of use show the names of the articles of this design and the parts in the application environment. The articles of this design are composed of a base film, an adhesive layer, and a film-forming support member. The adhesive layer and The base film is transparent.

TW109301937D03F 2019-10-25 2020-04-10 Film for manufacturing semiconductor device TWD209201S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-023723 2019-02-13
JPD2019-23723F JP1660180S (en) 2019-10-25 2019-10-25

Publications (1)

Publication Number Publication Date
TWD209201S true TWD209201S (en) 2021-01-01

Family

ID=70775656

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109301937D03F TWD209201S (en) 2019-10-25 2020-04-10 Film for manufacturing semiconductor device

Country Status (2)

Country Link
JP (1) JP1660180S (en)
TW (1) TWD209201S (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD223597S (en) 2021-10-15 2023-02-11 日商信越化學工業股份有限公司 Stamp component for transferring microstructure
TWD226179S (en) 2021-10-15 2023-06-21 日商信越化學工業股份有限公司 Stamp component for transferring microstructure
TWD226035S (en) 2021-10-15 2023-06-21 日商信越化學工業股份有限公司 Stamp component for transferring microstructure
TWD226364S (en) 2021-10-15 2023-07-01 日商信越化學工業股份有限公司 Stamp component for transferring microstructure
TWD226368S (en) 2021-10-15 2023-07-01 日商信越化學工業股份有限公司 Stamp component for transferring microstructure
TWD226270S (en) 2021-10-15 2023-07-01 日商信越化學工業股份有限公司 Stamp component for transferring microstructure
TWD232260S (en) 2021-10-15 2024-07-11 日商信越化學工業股份有限公司 (日本) Stamp component for transferring microstructure
TWD236035S (en) 2021-10-15 2025-01-21 日商信越化學工業股份有限公司 (日本) Stamp component for transferring microstructure
TWD236036S (en) 2022-11-04 2025-01-21 日商信越化學工業股份有限公司 (日本) Stamp component for transferring microstructure
TWD236037S (en) 2022-11-04 2025-01-21 日商信越化學工業股份有限公司 (日本) Stamp component for transferring microstructure
USD1070795S1 (en) 2021-10-15 2025-04-15 Shin-Etsu Chemical Co., Ltd. Stamp component for transferring microstructure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200937508A (en) 2007-09-21 2009-09-01 Semiconductor Energy Lab Substrate provided with semiconductor films and manufacturing method thereof
TW201622010A (en) 2014-11-13 2016-06-16 新電元工業股份有限公司 Semiconductor device manufacturing method and glass film forming device
TW201934683A (en) 2018-02-05 2019-09-01 南韓商三星電子股份有限公司 Protective film composition and method of manufacturing semiconductor package by using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200937508A (en) 2007-09-21 2009-09-01 Semiconductor Energy Lab Substrate provided with semiconductor films and manufacturing method thereof
TWI470682B (en) 2007-09-21 2015-01-21 半導體能源研究所股份有限公司 Substrate provided with semiconductor film and method of manufacturing the same
TW201622010A (en) 2014-11-13 2016-06-16 新電元工業股份有限公司 Semiconductor device manufacturing method and glass film forming device
TWI584381B (en) 2014-11-13 2017-05-21 新電元工業股份有限公司 A method of manufacturing a semiconductor device, and a glass film forming apparatus
TW201934683A (en) 2018-02-05 2019-09-01 南韓商三星電子股份有限公司 Protective film composition and method of manufacturing semiconductor package by using the same

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD226365S (en) 2021-10-15 2023-07-01 日商信越化學工業股份有限公司 Stamp component for transferring microstructure
TWD232260S (en) 2021-10-15 2024-07-11 日商信越化學工業股份有限公司 (日本) Stamp component for transferring microstructure
TWD226035S (en) 2021-10-15 2023-06-21 日商信越化學工業股份有限公司 Stamp component for transferring microstructure
TWD226364S (en) 2021-10-15 2023-07-01 日商信越化學工業股份有限公司 Stamp component for transferring microstructure
TWD226366S (en) 2021-10-15 2023-07-01 日商信越化學工業股份有限公司 Stamp component for transferring microstructure
TWD226368S (en) 2021-10-15 2023-07-01 日商信越化學工業股份有限公司 Stamp component for transferring microstructure
TWD226363S (en) 2021-10-15 2023-07-01 日商信越化學工業股份有限公司 Stamp component for transferring microstructure
TWD226367S (en) 2021-10-15 2023-07-01 日商信越化學工業股份有限公司 Stamp component for transferring microstructure
TWD226179S (en) 2021-10-15 2023-06-21 日商信越化學工業股份有限公司 Stamp component for transferring microstructure
TWD223597S (en) 2021-10-15 2023-02-11 日商信越化學工業股份有限公司 Stamp component for transferring microstructure
TWD226270S (en) 2021-10-15 2023-07-01 日商信越化學工業股份有限公司 Stamp component for transferring microstructure
TWD236035S (en) 2021-10-15 2025-01-21 日商信越化學工業股份有限公司 (日本) Stamp component for transferring microstructure
USD1070796S1 (en) 2021-10-15 2025-04-15 Shin-Etsu Chemical Co., Ltd. Stamp component for transferring microstructure
TWD236034S (en) 2021-10-15 2025-01-21 日商信越化學工業股份有限公司 (日本) Stamp component for transferring microstructure
USD1070795S1 (en) 2021-10-15 2025-04-15 Shin-Etsu Chemical Co., Ltd. Stamp component for transferring microstructure
TWD236586S (en) 2021-10-15 2025-03-01 日商信越化學工業股份有限公司 (日本) Stamp component for transferring microstructure
TWD236037S (en) 2022-11-04 2025-01-21 日商信越化學工業股份有限公司 (日本) Stamp component for transferring microstructure
TWD236036S (en) 2022-11-04 2025-01-21 日商信越化學工業股份有限公司 (日本) Stamp component for transferring microstructure

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Publication number Publication date
JP1660180S (en) 2020-05-25

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