JP1740485S - Stamp parts for microstructure transfer - Google Patents

Stamp parts for microstructure transfer

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Publication number
JP1740485S
JP1740485S JP2021022463F JP2021022463F JP1740485S JP 1740485 S JP1740485 S JP 1740485S JP 2021022463 F JP2021022463 F JP 2021022463F JP 2021022463 F JP2021022463 F JP 2021022463F JP 1740485 S JP1740485 S JP 1740485S
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JP
Japan
Prior art keywords
microstructure
transparent resin
microstructure transfer
stamp parts
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021022463F
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Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2021022463F priority Critical patent/JP1740485S/en
Priority to TW111304866D02F priority patent/TWD227419S/en
Priority to TW111304866D01F priority patent/TWD227418S/en
Application granted granted Critical
Publication of JP1740485S publication Critical patent/JP1740485S/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

本物品は微小構造体移載用スタンプ部品である。本物品は、例えば厚さ０．５～３ｍｍで１辺が５～３００ｍｍの透明基板上に厚さ１～５００μｍの透明樹脂を備えており、基板に形成・配置された半導体素子、マイクロＬＥＤ素子等の微小構造体を前記透明樹脂によりピックアップし、ピックアップした微小構造体を別の基板に移載するために用いられる。また、本物品は前記透明樹脂表面に凸型形状突起を備えている。この凸型形状突起の形状は四角錐台形状が３段重なった形状であり、例えば底辺１辺が１～１５０μｍである。This article is a stamp part for transferring a microstructure. The article comprises a transparent substrate having a thickness of 0.5 to 3 mm and a side of 5 to 300 mm, and a transparent resin having a thickness of 1 to 500 μm. or the like is picked up by the transparent resin, and the picked-up microstructure is transferred to another substrate. Further, the present article has convex-shaped projections on the surface of the transparent resin. The shape of this convex-shaped protrusion is a shape in which three truncated pyramids are stacked one on top of another, and the base side is 1 to 150 μm, for example.

JP2021022463F 2021-10-15 2021-10-15 Stamp parts for microstructure transfer Active JP1740485S (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021022463F JP1740485S (en) 2021-10-15 2021-10-15 Stamp parts for microstructure transfer
TW111304866D02F TWD227419S (en) 2021-10-15 2022-04-15 Stamp component for transferring microstructure
TW111304866D01F TWD227418S (en) 2021-10-15 2022-04-15 Stamp component for transferring microstructure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021022463F JP1740485S (en) 2021-10-15 2021-10-15 Stamp parts for microstructure transfer

Publications (1)

Publication Number Publication Date
JP1740485S true JP1740485S (en) 2023-03-30

Family

ID=85717910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021022463F Active JP1740485S (en) 2021-10-15 2021-10-15 Stamp parts for microstructure transfer

Country Status (2)

Country Link
JP (1) JP1740485S (en)
TW (2) TWD227419S (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1645206S (en) 2018-12-19 2019-11-11

Also Published As

Publication number Publication date
TWD227419S (en) 2023-09-11
TWD227418S (en) 2023-09-11

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