TWD211372S - 散熱片之部分 - Google Patents

散熱片之部分 Download PDF

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Publication number
TWD211372S
TWD211372S TW108303814F TW108303814F TWD211372S TW D211372 S TWD211372 S TW D211372S TW 108303814 F TW108303814 F TW 108303814F TW 108303814 F TW108303814 F TW 108303814F TW D211372 S TWD211372 S TW D211372S
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TW
Taiwan
Prior art keywords
reference picture
case
parts
item
design
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TW108303814F
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English (en)
Inventor
稲垣義勝
引地秀太
坂井啓志
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日商古河電氣工業股份有限公司
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Application filed by 日商古河電氣工業股份有限公司 filed Critical 日商古河電氣工業股份有限公司
Publication of TWD211372S publication Critical patent/TWD211372S/zh

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Abstract

【物品用途】;本設計物品關於一種散熱片，可用於對電腦、伺服器等中之CPU所產生的熱量進行散熱。;【設計說明】;圖式所揭露之虛線，為本案不主張設計之部分。;於「立體參考圖」、「另一視角立體參考圖」、「上蓋取下立體參考圖」中所揭露之灰階填色，係表示本案不主張之部分。

Description

散熱片之部分
本設計物品關於一種散熱片，可用於對電腦、伺服器等中之CPU所產生的熱量進行散熱。
圖式所揭露之虛線，為本案不主張設計之部分。
於「立體參考圖」、「另一視角立體參考圖」、「上蓋取下立體參考圖」中所揭露之灰階填色，係表示本案不主張之部分。
TW108303814F 2018-12-28 2019-06-27 散熱片之部分 TWD211372S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-028918 2018-12-28
JPD2018-28918F JP1643634S (zh) 2018-12-28 2018-12-28

Publications (1)

Publication Number Publication Date
TWD211372S true TWD211372S (zh) 2021-05-11

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TW108303814F TWD211372S (zh) 2018-12-28 2019-06-27 散熱片之部分

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US (1) USD971862S1 (zh)
JP (1) JP1643634S (zh)
TW (1) TWD211372S (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1026838S1 (en) * 2022-04-26 2024-05-14 Taiwan Microloops Corp. Heat dissipation module

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JP1643634S (zh) 2020-10-12
USD971862S1 (en) 2022-12-06

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