TWD208176S - 半導體製造用晶圓支持器 - Google Patents

半導體製造用晶圓支持器 Download PDF

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Publication number
TWD208176S
TWD208176S TW107307217D02F TW107307217D02F TWD208176S TW D208176 S TWD208176 S TW D208176S TW 107307217D02 F TW107307217D02 F TW 107307217D02F TW 107307217D02 F TW107307217D02 F TW 107307217D02F TW D208176 S TWD208176 S TW D208176S
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TW
Taiwan
Prior art keywords
view
design
approximately
article
semiconductor manufacturing
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TW107307217D02F
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English (en)
Chinese (zh)
Inventor
宮澤杉夫
野村勝
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日商日本碍子股份有限公司
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Publication of TWD208176S publication Critical patent/TWD208176S/zh

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TW107307217D02F 2018-07-25 2018-12-11 半導體製造用晶圓支持器 TWD208176S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-016239 2018-07-25
JPD2018-16239F JP1643124S (enrdf_load_stackoverflow) 2018-07-25 2018-07-25

Publications (1)

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TWD208176S true TWD208176S (zh) 2020-11-11

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TW107307217D02F TWD208176S (zh) 2018-07-25 2018-12-11 半導體製造用晶圓支持器

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JP (1) JP1643124S (enrdf_load_stackoverflow)
TW (1) TWD208176S (enrdf_load_stackoverflow)

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD699199S1 (en) 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode plate for a plasma processing apparatus
USD699200S1 (en) 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD709539S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709537S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709536S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709538S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD724553S1 (en) 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD770992S1 (en) 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD797691S1 (en) 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD802634S1 (en) 2015-10-23 2017-11-14 Flow International Corporation Contour follower for a fluid jet cutting machine
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
TWD189096S (zh) 2016-10-13 2018-03-11 恩特葛瑞斯股份有限公司 晶圓支撐環
TWD189313S (zh) 2017-04-07 2018-03-21 Ａｓｍ知識產權私人控股有限公司 用於半導體製造設備的承載器

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD699199S1 (en) 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode plate for a plasma processing apparatus
USD699200S1 (en) 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD709539S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709537S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709536S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709538S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD724553S1 (en) 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD770992S1 (en) 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD802634S1 (en) 2015-10-23 2017-11-14 Flow International Corporation Contour follower for a fluid jet cutting machine
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD797691S1 (en) 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
TWD187824S (zh) 2016-04-14 2018-01-11 應用材料股份有限公司 組合邊緣環
TWD189096S (zh) 2016-10-13 2018-03-11 恩特葛瑞斯股份有限公司 晶圓支撐環
TWD189313S (zh) 2017-04-07 2018-03-21 Ａｓｍ知識產權私人控股有限公司 用於半導體製造設備的承載器

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JP1643124S (enrdf_load_stackoverflow) 2019-10-07

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