USD802634S1 - Contour follower for a fluid jet cutting machine - Google Patents

Contour follower for a fluid jet cutting machine Download PDF

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Publication number
USD802634S1
USD802634S1 US29/543,395 US201529543395F USD802634S US D802634 S1 USD802634 S1 US D802634S1 US 201529543395 F US201529543395 F US 201529543395F US D802634 S USD802634 S US D802634S
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United States
Prior art keywords
cutting machine
fluid jet
jet cutting
contour follower
follower
Prior art date
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Active
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US29/543,395
Inventor
Ethan E. Romanoff
Kenneth E. Claeys
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Flow International Corp
Original Assignee
Flow International Corp
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Publication date
Application filed by Flow International Corp filed Critical Flow International Corp
Priority to US29/543,395 priority Critical patent/USD802634S1/en
Assigned to WILMINGTON TRUST, NATIONAL ASSOCIATION reassignment WILMINGTON TRUST, NATIONAL ASSOCIATION SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FLOW INTERNATIONAL CORPORATION
Assigned to FLOW INTERNATIONAL CORPORATION reassignment FLOW INTERNATIONAL CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CLAEYS, KENNETH E., ROMANOFF, ETHAN E.
Assigned to ALLY BANK, AS AGENT reassignment ALLY BANK, AS AGENT SECURITY AGREEMENT Assignors: FLOW INTERNATIONAL CORPORATION
Application granted granted Critical
Publication of USD802634S1 publication Critical patent/USD802634S1/en
Assigned to CREDIT SUISSE, AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT reassignment CREDIT SUISSE, AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DYNAMIC ROBOTIC SOLUTIONS, INC., FLOW INTERNATIONAL CORPORATION, H2O JET, INC., KMT AQUA-DYNE, INC., KMT WATERJET SYSTEMS, INC., SHAPE TECHNOLOGIES GROUP, INC.
Assigned to BARCLAYS BANK PLC, AS COLLATERAL AGENT reassignment BARCLAYS BANK PLC, AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DYNAMIC ROBOTIC SOLUTIONS, INC., FLOW INTERNATIONAL CORPORATION, H2O JET, INC., KMT AQUA-DYNE, INC., KMT WATERJET SYSTEMS, INC., SHAPE TECHNOLOGIES GROUP, INC.
Assigned to FLOW INTERNATIONAL CORPORATION, KMT ROBOTIC SOLUTIONS, INC., SHAPE TECHNOLOGIES GROUP, INC., H2O JET, INC. reassignment FLOW INTERNATIONAL CORPORATION RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: ALLY BANK
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Description

FIG. 1 is a top isometric view of a contour follower for a fluid jet cutting machine.
FIG. 2 is a bottom isometric view thereof.
FIG. 3 is a front elevational view thereof.
FIG. 4 is a rear elevational view thereof.
FIG. 5 is a right side elevational view thereof, which is a mirror-image of the left side.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Stippling shown in the drawings provides surface shading and is not intended to indicate surface decoration. The broken lines in the drawings depict unclaimed environmental subject matter.

Claims (1)

    CLAIM
  1. The ornamental design for a contour follower for a fluid jet cutting machine, substantially as shown and described.
US29/543,395 2015-10-23 2015-10-23 Contour follower for a fluid jet cutting machine Active USD802634S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/543,395 USD802634S1 (en) 2015-10-23 2015-10-23 Contour follower for a fluid jet cutting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/543,395 USD802634S1 (en) 2015-10-23 2015-10-23 Contour follower for a fluid jet cutting machine

Publications (1)

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USD802634S1 true USD802634S1 (en) 2017-11-14

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US29/543,395 Active USD802634S1 (en) 2015-10-23 2015-10-23 Contour follower for a fluid jet cutting machine

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD889335S1 (en) * 2018-10-03 2020-07-07 Vaughn C Jewell Disc
TWD208177S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208178S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208174S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208175S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208176S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6649123B2 (en) 2000-02-21 2003-11-18 ABA Garäte- & Maschinenbau GmbH. Apparatus for the scanning of working levels
US6852002B2 (en) 1999-08-25 2005-02-08 Flow International Corporation Apparatus and methods for Z-axis control and collision detection and recovery for waterjet cutting systems
US20060040590A1 (en) * 2004-08-19 2006-02-23 Flow International Corporation Contour follower
US7464630B2 (en) 2001-08-27 2008-12-16 Flow International Corporation Apparatus for generating and manipulating a high-pressure fluid jet
US20130025422A1 (en) * 2011-07-29 2013-01-31 Chillman Alex M Waterjet cutting system with standoff distance control
US20130306748A1 (en) * 2012-05-16 2013-11-21 Mohamed A. Hashish Fluid jet receptacle with rotatable inlet feed component and related fluid jet cutting system and method
US20170015018A1 (en) * 2015-07-13 2017-01-19 Flow International Corporation Methods of cutting fiber reinforced polymer composite workpieces with a pure waterjet
US20170113324A1 (en) * 2015-10-23 2017-04-27 Flow International Corporation Contour follower apparatus and related systems and methods
US20170136650A1 (en) * 2013-10-28 2017-05-18 Flow International Corporation Fluid jet cutting systems, components and methods that facilitate improved work environments

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6852002B2 (en) 1999-08-25 2005-02-08 Flow International Corporation Apparatus and methods for Z-axis control and collision detection and recovery for waterjet cutting systems
US6649123B2 (en) 2000-02-21 2003-11-18 ABA Garäte- & Maschinenbau GmbH. Apparatus for the scanning of working levels
US7464630B2 (en) 2001-08-27 2008-12-16 Flow International Corporation Apparatus for generating and manipulating a high-pressure fluid jet
US7703363B2 (en) 2001-08-27 2010-04-27 Flow International Corporation Apparatus for generating and manipulating a high-pressure fluid jet
US20060040590A1 (en) * 2004-08-19 2006-02-23 Flow International Corporation Contour follower
US7331842B2 (en) 2004-08-19 2008-02-19 Flow International Corporation Contour follower for tool
US7803036B2 (en) 2004-08-19 2010-09-28 Flow International Corporation Method of using a contour follower
US20130025422A1 (en) * 2011-07-29 2013-01-31 Chillman Alex M Waterjet cutting system with standoff distance control
US20130306748A1 (en) * 2012-05-16 2013-11-21 Mohamed A. Hashish Fluid jet receptacle with rotatable inlet feed component and related fluid jet cutting system and method
US20170136650A1 (en) * 2013-10-28 2017-05-18 Flow International Corporation Fluid jet cutting systems, components and methods that facilitate improved work environments
US20170015018A1 (en) * 2015-07-13 2017-01-19 Flow International Corporation Methods of cutting fiber reinforced polymer composite workpieces with a pure waterjet
US20170113324A1 (en) * 2015-10-23 2017-04-27 Flow International Corporation Contour follower apparatus and related systems and methods

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD208177S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208178S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208174S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208175S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208176S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
USD889335S1 (en) * 2018-10-03 2020-07-07 Vaughn C Jewell Disc

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