TWD189096S - 晶圓支撐環 - Google Patents

晶圓支撐環

Info

Publication number
TWD189096S
TWD189096S TW106301900F TW106301900F TWD189096S TW D189096 S TWD189096 S TW D189096S TW 106301900 F TW106301900 F TW 106301900F TW 106301900 F TW106301900 F TW 106301900F TW D189096 S TWD189096 S TW D189096S
Authority
TW
Taiwan
Prior art keywords
support ring
wafer support
design
wafer
item usage
Prior art date
Application number
TW106301900F
Other languages
English (en)
Inventor
艾瑞克 柯可嵐
Original Assignee
恩特葛瑞斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 恩特葛瑞斯股份有限公司 filed Critical 恩特葛瑞斯股份有限公司
Publication of TWD189096S publication Critical patent/TWD189096S/zh

Links

Abstract

【物品用途】;本設計係關於一種晶圓支撐環。;【設計說明】

Description

晶圓支撐環
本設計係關於一種晶圓支撐環。
TW106301900F 2016-10-13 2017-04-13 晶圓支撐環 TWD189096S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/580,872 2016-10-13
US29/580,872 USD815385S1 (en) 2016-10-13 2016-10-13 Wafer support ring

Publications (1)

Publication Number Publication Date
TWD189096S true TWD189096S (zh) 2018-03-11

Family

ID=60191666

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106301900F TWD189096S (zh) 2016-10-13 2017-04-13 晶圓支撐環

Country Status (3)

Country Link
US (1) USD815385S1 (zh)
JP (1) JP1590044S (zh)
TW (1) TWD189096S (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD208175S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208177S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208174S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208178S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器之部分
TWD208176S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
US12387913B2 (en) 2022-07-08 2025-08-12 Tosoh Smd, Inc. Dynamic vacuum seal system for physical vapor deposition sputter applications
USD1109856S1 (en) 2023-07-07 2026-01-20 Tosoh Smd, Inc. Dynamic vacuum seal system isolation ring for physical vapor deposition sputter applications

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD802723S1 (en) * 2015-11-27 2017-11-14 Ebara Corporation Sealing ring
JP1581114S (zh) * 2016-10-21 2017-07-10
USD875899S1 (en) * 2016-10-21 2020-02-18 Nok Corporation Seal
JP1604073S (zh) * 2017-06-27 2018-05-21
USD890310S1 (en) * 2018-02-08 2020-07-14 Nok Corporation Seal
USD917825S1 (en) * 2019-07-16 2021-04-27 Entegris, Inc. Wafer support ring
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device
USD1062662S1 (en) * 2023-03-30 2025-02-18 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring
USD1063595S1 (en) * 2023-03-30 2025-02-25 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring

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US3893649A (en) * 1971-08-09 1975-07-08 Dynamic Form Systems Inc Bag holder
US4867401A (en) * 1988-08-04 1989-09-19 Graff Frederick E Bag holder
US4899967A (en) * 1989-01-17 1990-02-13 Johnson Austin E Portable flexible bag holder
USD457283S1 (en) * 1995-04-05 2002-05-14 Jay L. Wayt Refuse bag retainer ring
CN103862463B (zh) * 2007-05-31 2017-08-15 应用材料公司 延伸双scara机械手连接装置的伸出距离的方法及设备
USD655401S1 (en) * 2009-08-10 2012-03-06 Nippon Valqua Industries, Ltd. Hybrid seal member
TWD149672S (zh) 2010-08-16 2012-10-11 荏原製作所股份有限公司 密封環
USD646764S1 (en) * 2010-11-04 2011-10-11 Faster S.P.A. Sealing gasket
USD667601S1 (en) * 2011-06-21 2012-09-18 Garbo Grabber, LLC Trash collecting device
USD754308S1 (en) * 2012-08-07 2016-04-19 Nippon Valqua Industries, Ltd. Composite sealing material
USD723239S1 (en) * 2012-08-30 2015-02-24 Entegris, Inc. Wafer carrier ring
USD743513S1 (en) * 2014-06-13 2015-11-17 Asm Ip Holding B.V. Seal ring

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD208175S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208177S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208174S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208178S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器之部分
TWD208176S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
US12387913B2 (en) 2022-07-08 2025-08-12 Tosoh Smd, Inc. Dynamic vacuum seal system for physical vapor deposition sputter applications
USD1109856S1 (en) 2023-07-07 2026-01-20 Tosoh Smd, Inc. Dynamic vacuum seal system isolation ring for physical vapor deposition sputter applications

Also Published As

Publication number Publication date
USD815385S1 (en) 2018-04-10
JP1590044S (zh) 2017-11-06

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