TWD207699S - 基板處理裝置用吸頂式加熱器的保持板 - Google Patents

基板處理裝置用吸頂式加熱器的保持板 Download PDF

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Publication number
TWD207699S
TWD207699S TW108306967F TW108306967F TWD207699S TW D207699 S TWD207699 S TW D207699S TW 108306967 F TW108306967 F TW 108306967F TW 108306967 F TW108306967 F TW 108306967F TW D207699 S TWD207699 S TW D207699S
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TW
Taiwan
Prior art keywords
processing device
substrate processing
holding plate
ceiling heater
ceiling
Prior art date
Application number
TW108306967F
Other languages
English (en)
Chinese (zh)
Inventor
杉浦忍
小杉哲也
山口天和
Original Assignee
日商國際電氣股份有限公司
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Publication date
Application filed by 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司
Publication of TWD207699S publication Critical patent/TWD207699S/zh

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TW108306967F 2019-07-11 2019-11-13 基板處理裝置用吸頂式加熱器的保持板 TWD207699S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-015586 2019-01-31
JPD2019-15586F JP1651618S (ja) 2019-07-11 2019-07-11

Publications (1)

Publication Number Publication Date
TWD207699S true TWD207699S (zh) 2020-10-11

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TW108306967F TWD207699S (zh) 2019-07-11 2019-11-13 基板處理裝置用吸頂式加熱器的保持板

Country Status (3)

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US (1) USD962183S1 (ja)
JP (1) JP1651618S (ja)
TW (1) TWD207699S (ja)

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6390905B1 (en) * 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
US7326105B2 (en) * 2005-08-31 2008-02-05 Micron Technology, Inc. Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces
USD601521S1 (en) * 2006-09-28 2009-10-06 Tokyo Electron Limited Heater for manufacturing semiconductor
USD589471S1 (en) * 2006-09-28 2009-03-31 Tokyo Electron Limited Heater for manufacturing semiconductor
JP2008177248A (ja) * 2007-01-16 2008-07-31 Tokyo Seimitsu Co Ltd 研磨ヘッド用リテーナリング
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD732094S1 (en) * 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
JP2016507896A (ja) * 2013-01-11 2016-03-10 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 化学機械研磨装置及び方法
US9227297B2 (en) * 2013-03-20 2016-01-05 Applied Materials, Inc. Retaining ring with attachable segments
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
JP1541874S (ja) * 2015-03-16 2016-01-18
US10174437B2 (en) * 2015-07-09 2019-01-08 Applied Materials, Inc. Wafer electroplating chuck assembly
JP1556433S (ja) * 2015-10-06 2016-08-15
JP1560719S (ja) * 2015-12-01 2016-10-11
JP1581406S (ja) * 2016-10-14 2017-07-18
WO2018100850A1 (ja) * 2016-12-01 2018-06-07 株式会社日立国際電気 基板処理装置、天井ヒータおよび半導体装置の製造方法
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
KR20190008101A (ko) * 2017-07-14 2019-01-23 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 기판 보지구 및 반도체 장치의 제조 방법
JP1651623S (ja) * 2019-07-18 2020-01-27
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device

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Publication number Publication date
USD962183S1 (en) 2022-08-30
JP1651618S (ja) 2020-01-27

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