TWD204229S - 電漿處理裝置用環 - Google Patents

電漿處理裝置用環 Download PDF

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Publication number
TWD204229S
TWD204229S TW108302365F TW108302365F TWD204229S TW D204229 S TWD204229 S TW D204229S TW 108302365 F TW108302365 F TW 108302365F TW 108302365 F TW108302365 F TW 108302365F TW D204229 S TWD204229 S TW D204229S
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TW
Taiwan
Prior art keywords
plasma
article
plasma processing
ring
processing device
Prior art date
Application number
TW108302365F
Other languages
English (en)
Chinese (zh)
Inventor
磯崎真一
森政士
横川賢濵
荒瀬高男
岩瀬拓
Original Assignee
日商日立全球先端科技股份有限公司
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Publication of TWD204229S publication Critical patent/TWD204229S/zh

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TW108302365F 2018-10-25 2019-04-24 電漿處理裝置用環 TWD204229S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-023399 2018-10-25
JPD2018-23399F JP1640255S (es) 2018-10-25 2018-10-25

Publications (1)

Publication Number Publication Date
TWD204229S true TWD204229S (zh) 2020-04-21

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ID=67769555

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108302365F TWD204229S (zh) 2018-10-25 2019-04-24 電漿處理裝置用環

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US (1) USD891636S1 (es)
JP (1) JP1640255S (es)
TW (1) TWD204229S (es)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD219730S (zh) 2021-04-26 2022-07-01 日商日立全球先端科技股份有限公司 電漿處理裝置用離子遮蔽板

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1659287S (es) * 2019-10-18 2020-05-11
USD943539S1 (en) 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
JP1678330S (es) * 2020-05-27 2021-02-01
JP1704964S (ja) * 2021-04-19 2022-01-14 プラズマ処理装置用サセプタリング

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8703249B2 (en) * 2002-04-17 2014-04-22 Lam Research Corporation Techniques for reducing arcing-related damage in a clamping ring of a plasma processing system
JP1438320S (es) 2011-09-20 2015-04-06
JP1438319S (es) 2011-09-20 2015-04-06
JP1438745S (es) 2011-09-20 2015-04-06
US9123661B2 (en) * 2013-08-07 2015-09-01 Lam Research Corporation Silicon containing confinement ring for plasma processing apparatus and method of forming thereof
US9236284B2 (en) * 2014-01-31 2016-01-12 Applied Materials, Inc. Cooled tape frame lift and low contact shadow ring for plasma heat isolation
JP5615454B1 (ja) * 2014-02-25 2014-10-29 コバレントマテリアル株式会社 フォーカスリング
JP1551512S (es) * 2015-06-12 2016-06-13
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
JP1584146S (es) * 2017-01-31 2017-08-21
JP1584784S (es) * 2017-01-31 2017-08-28
JP1598984S (es) * 2017-07-31 2018-03-05
JP1598997S (es) * 2017-08-31 2018-03-05

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD219730S (zh) 2021-04-26 2022-07-01 日商日立全球先端科技股份有限公司 電漿處理裝置用離子遮蔽板

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Publication number Publication date
USD891636S1 (en) 2020-07-28
JP1640255S (es) 2019-09-02

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