TWD204229S - 電漿處理裝置用環 - Google Patents

電漿處理裝置用環 Download PDF

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Publication number
TWD204229S
TWD204229S TW108302365F TW108302365F TWD204229S TW D204229 S TWD204229 S TW D204229S TW 108302365 F TW108302365 F TW 108302365F TW 108302365 F TW108302365 F TW 108302365F TW D204229 S TWD204229 S TW D204229S
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TW
Taiwan
Prior art keywords
plasma
article
plasma processing
ring
processing device
Prior art date
Application number
TW108302365F
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English (en)
Chinese (zh)
Inventor
磯崎真一
森政士
横川賢濵
荒瀬高男
岩瀬拓
Original Assignee
日商日立全球先端科技股份有限公司
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Publication of TWD204229S publication Critical patent/TWD204229S/zh

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TW108302365F 2018-10-25 2019-04-24 電漿處理裝置用環 TWD204229S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-023399 2018-10-25
JPD2018-23399F JP1640255S (cs) 2018-10-25 2018-10-25

Publications (1)

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TWD204229S true TWD204229S (zh) 2020-04-21

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ID=67769555

Family Applications (1)

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TW108302365F TWD204229S (zh) 2018-10-25 2019-04-24 電漿處理裝置用環

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US (1) USD891636S1 (cs)
JP (1) JP1640255S (cs)
TW (1) TWD204229S (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD219730S (zh) 2021-04-26 2022-07-01 日商日立全球先端科技股份有限公司 電漿處理裝置用離子遮蔽板

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1659287S (cs) * 2019-10-18 2020-05-11
USD943539S1 (en) 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
JP1678330S (cs) * 2020-05-27 2021-02-01
JP1704964S (ja) * 2021-04-19 2022-01-14 プラズマ処理装置用サセプタリング

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8703249B2 (en) * 2002-04-17 2014-04-22 Lam Research Corporation Techniques for reducing arcing-related damage in a clamping ring of a plasma processing system
JP1438319S (cs) 2011-09-20 2015-04-06
JP1438745S (cs) 2011-09-20 2015-04-06
JP1438320S (cs) 2011-09-20 2015-04-06
US9123661B2 (en) * 2013-08-07 2015-09-01 Lam Research Corporation Silicon containing confinement ring for plasma processing apparatus and method of forming thereof
US9236284B2 (en) * 2014-01-31 2016-01-12 Applied Materials, Inc. Cooled tape frame lift and low contact shadow ring for plasma heat isolation
JP5615454B1 (ja) * 2014-02-25 2014-10-29 コバレントマテリアル株式会社 フォーカスリング
JP1551512S (cs) * 2015-06-12 2016-06-13
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
JP1584146S (cs) * 2017-01-31 2017-08-21
JP1584784S (cs) * 2017-01-31 2017-08-28
JP1598984S (cs) * 2017-07-31 2018-03-05
JP1598997S (cs) * 2017-08-31 2018-03-05

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD219730S (zh) 2021-04-26 2022-07-01 日商日立全球先端科技股份有限公司 電漿處理裝置用離子遮蔽板

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Publication number Publication date
USD891636S1 (en) 2020-07-28
JP1640255S (cs) 2019-09-02

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